Electronic device package

Abstract

Electronic device package technology is disclosed. In one example, an electronic device package can include a substrate, an electronic component disposed on the substrate and electrically coupled to the substrate, and an underfill material disposed at least partially between the electronic component and the substrate. A lateral portion of the underfill material can comprises a lateral surface extending away from the substrate and a meniscus surface extending between the lateral surface and the electronic component.

What is claimed is: 
     
         1 . A method for making an electronic device package, comprising:
 disposing an electronic component on a substrate, such that the electronic component is electrically coupled to the substrate;   forming a barrier with a sacrificial material about at least a portion of the electronic component;   disposing an underfill material at least partially between the electronic component and the substrate, wherein flow of the underfill material is mechanically inhibited at least partially by the barrier; and   removing the barrier.   
     
     
         2 . The method of  claim 1 , wherein forming the barrier comprises dispensing the sacrificial material on the substrate. 
     
     
         3 . The method of  claim 1 , wherein forming the barrier comprises printing the sacrificial material on the substrate. 
     
     
         4 . The method of  claim 3 , wherein printing the sacrificial material on the substrate comprises disposing a stencil about the substrate, the stencil having an aperture corresponding to a location of the barrier. 
     
     
         5 . The method of  claim 4 , wherein printing the sacrificial material on the substrate further comprises causing the sacrificial material to pass through the aperture and onto the substrate. 
     
     
         6 . The method of  claim 5 , wherein printing the sacrificial material on the substrate further comprises removing the stencil. 
     
     
         7 . The method of  claim 5 , wherein printing the sacrificial material on the substrate further comprises drying the sacrificial material. 
     
     
         8 . The method of  claim 1 , wherein removing the barrier comprises heating the sacrificial material. 
     
     
         9 . The method of  claim 8 , wherein the sacrificial material is thermally decomposed. 
     
     
         10 . The method of  claim 1 , wherein removing the barrier comprises dissolving the sacrificial material. 
     
     
         11 . The method of  claim 10 , wherein the sacrificial material is water soluble. 
     
     
         12 . A method for making an electronic device package, comprising:
 obtaining a substrate having an electronic component region, and a sacrificial material on the substrate forming a barrier about at least a portion of the electronic component region;   disposing an electronic component on a substrate in the electronic component region, such that the electronic component is electrically coupled to the substrate;   disposing an underfill material at least partially between the electronic component and the substrate, wherein flow of the underfill material is mechanically inhibited at least partially by the barrier; and   removing the barrier.   
     
     
         13 . The method of  claim 12 , wherein removing the barrier comprises heating the sacrificial material. 
     
     
         14 . The method of  claim 13 , wherein the sacrificial material is thermally decomposed. 
     
     
         15 . The method of  claim 12 , wherein removing the barrier comprises dissolving the sacrificial material. 
     
     
         16 . The method of  claim 15 , wherein the sacrificial material is water soluble. 
     
     
         17 . A method for facilitating an underfill material keep out zone (KOZ) of an electronic component, comprising:
 obtaining a substrate having an electronic component region; and   disposing a sacrificial material on the substrate to form a barrier about at least a portion of the electronic component region to mechanically inhibit flow of an underfill material.   
     
     
         18 . The method of  claim 17 , wherein disposing a sacrificial material on the substrate comprises dispensing the sacrificial material on the substrate. 
     
     
         19 . The method of  claim 17 , wherein disposing a sacrificial material on the substrate comprises printing the sacrificial material on the substrate. 
     
     
         20 . The method of  claim 19 , wherein printing the sacrificial material on the substrate comprises disposing a stencil about the substrate, the stencil having an aperture corresponding to a location of the barrier. 
     
     
         21 . The method of  claim 20 , wherein printing the sacrificial material on the substrate further comprises causing the sacrificial material to pass through the aperture and onto the substrate. 
     
     
         22 . The method of  claim 21 , wherein printing the sacrificial material on the substrate further comprises removing the stencil. 
     
     
         23 . The method of  claim 21 , wherein printing the sacrificial material on the substrate further comprises drying the sacrificial material. 
     
     
         24 . The method of  claim 17 , wherein the sacrificial material is thermally decomposable. 
     
     
         25 . The method of  claim 17 , wherein the sacrificial material is water soluble.