Immersion cooling
Abstract
A method of apparatus for immersion cooling electronic equipment including immersing the electronic equipment in a pressure-sealed tank containing a heat transfer fluid and including a vapor space fluidicly coupled to a condenser; operating the electronic equipment to generate heat and evaporate some of the heat transfer fluid, causing heat transfer fluid vapor to enter the condenser; condensing the heat transfer fluid vapor in the condenser to produce a condensate; returning the condensate to the tank; and increasing power consumption to increase heat generated by the electronic equipment and develop an increased pressure of the heat transfer fluid vapor to bring the apparatus into an equilibrium condition.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 - 8 . (canceled)
9 . An apparatus for immersion cooling of electronic equipment, comprising:
a pressure-sealed tank for holding heat transfer fluid in liquid form into which the electronic equipment can be immersed, and including a vapor space above a surface of the liquid heat transfer fluid; a condenser having an inlet connected to the vapor space for receiving heat transfer fluid vapor, a sealable vapor outlet, and a condensate outlet; and a condensate return line through which condensed heat transfer fluid can return from the condensate outlet to the tank.
10 . The apparatus of claim 9 further comprising a filter in the condensate return line for removing at least one of moisture and metallic particles.
11 . The apparatus of claim 9 , further comprising a second condenser inside the tank for condensing heat transfer fluid vapor.
12 . The apparatus of claim 11 wherein the second condenser comprises a bank of condenser tubes.
13 . The apparatus of claim 9 further comprising a desiccant for aiding removal of moisture from air in the vapor space of the tank.
14 . (canceled)
15 . The apparatus of claim 13 further comprising a fan to circulate vapor through the desiccant.
16 . The apparatus of claim 12 further comprising an air cooler fluidicly coupled to the bank of condenser tubes for removing heat from circulating coolant in the condensing tubes.
17 . The apparatus of claim 12 , wherein the bank of condenser tubes is disposed in the vapor space.
18 . The apparatus of claim 9 further comprising a valve for sealing the vapor outlet of the condenser.
19 . The apparatus of claim 9 , wherein the inlet of the condenser is connected to the vapor space via a riser tube.
20 . The apparatus of claim 9 further comprising an air cooler fluidicly coupled to the condenser for removing heat from circulating coolant in the condensing tubes.
21 . The apparatus of claim 9 , wherein the condenser is located outside of the tank.
22 . The apparatus of claim 9 , wherein the condenser is fluidicly coupled to at least one of an expansion chamber or an expansion volume.
23 . The apparatus of claim 22 , wherein the expansion volume comprises a balloon.
24 . The apparatus of claim 9 , wherein the tank is structured and arranged to operate at a variable pressure.
25 . The apparatus of claim 9 , wherein the tank is structured and arranged to operate at a at least one of substantially constant pressure or atmospheric pressure.
26 . An apparatus for immersion cooling of electronic equipment, comprising:
a pressure-sealed tank for holding heat transfer fluid in liquid form into which the electronic equipment can be immersed; a condenser located outside of the tank; a riser tube fluidicly coupling the tank and the condenser for transferring heat transfer fluid vapor from the tank to the condenser; and a condensate return line fluidicly coupling the tank and the condenser through which condensed heat transfer fluid returns from the condenser to the tank.
27 . The apparatus of claim 26 further comprising an air cooler fluidicly coupled to the condenser for removing heat from circulating coolant in the condenser.
28 . The apparatus of claim 26 further comprising a valve for selectively sealing the condenser at a vapor outlet.
29 . The apparatus of claim 26 , wherein the condenser is located outside of a vapor space of the tank.Join the waitlist — get patent alerts
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