US2019216121A1PendingUtilityA1

Salt replacement composition, a process for making a salt replacement composition, and its use in baked dough products

Assignee: SCELTA UMAMI HOLDING B VPriority: May 11, 2012Filed: Mar 28, 2019Published: Jul 18, 2019
Est. expiryMay 11, 2032(~5.8 yrs left)· nominal 20-yr term from priority
A21D 2/02A21D 2/36A23L 27/45A23V 2002/00
58
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

The present invention relates to a salt replacement product comprising homogeneous particles of: (a) 5-70 wt % of one or more extracts from fungi, like from mycelia or mushrooms; (b) 10-80 wt % of a chloride salt of a metal that is acceptable in food, chosen from calcium, magnesium, or mixtures thereof; and (c) optionally one or more powder stabilizing additives. The invention furthermore relates to a process for making the product, and to use of the product for salt replacement in baked dough products.

Claims

exact text as granted — not AI-modified
1 . Salt replacement product comprising a homogeneous particles of:
 a. 5-70 wt % of one or more extracts from fungi, like from mycelia or mushrooms;   b. 10-80 wt % of a chloride salt of a metal that is acceptable in food, chosen from calcium, magnesium, or mixtures thereof;   c. and optionally one or more powder stabilizing additives.   
     
     
         2 . Process for the preparation of a salt replacement product, comprising the following steps:
 a. providing a solution of
 i. 5-70 wt % (on dry weight) of one or more extracts from fungi, like from mycelia or mushrooms 
 ii. 10-80 wt % (on dry weight) of a chloride salt of a metal that is acceptable in food, chosen from calcium, magnesium, or mixtures thereof; 
 iii. and optionally one or more powder stabilizing additives 
   b. drying the solution   c. and obtaining a substantial homogeneous salt replacement product in granular form.   
     
     
         3 . Process according to  claim 2  wherein the drying is performed by spray drying. 
     
     
         4 . Product or process according to any one of the preceding claims, wherein the extract from fungi is yeast extract. 
     
     
         5 . Product or process according to any one of  claims 1 - 3 , wherein the extract from fungi is extract from agaricus bisporus mushroom. 
     
     
         6 . Product or process according to any one of the preceding claims, wherein the chloride salt is calcium chloride. 
     
     
         7 . Product or process according to any one of the preceding claims, wherein the powder stabilizing additive includes maltodextrine. 
     
     
         8 . Product or process according to any one of the preceding claims, wherein the salt replacement product contains 20-40 wt % extract of fungi. 
     
     
         9 . Product or process according to any one of the preceding claims, wherein the salt replacement product contains 40-70 wt % chloride salt. 
     
     
         10 . Product or process according to any one of the preceding claims, wherein the salt replacement product contains an amount of fungi extract relative to chloride salt of between about 1:1 to 1:3. 
     
     
         11 . Product or process according to any one of the preceding claims, wherein the product contains about 25-35 wt % fungi extract, 50-70 wt % chloride salt and 5-25 wt % stabilizing additives. 
     
     
         12 . Dough product which comprises flour, water, leavening agent, optional bread improvers and optionally other additives, containing less than 1.3% sodium chloride, further comprising 0.2-3% salt replacement product of any one of  claims 1 - 11 . 
     
     
         13 . Dough product according to  claim 12 , wherein the leavening agent is yeast. 
     
     
         14 . Baked dough product, containing less than 1.3% sodium chloride, further comprising 0.2-3% salt replacement product of any one of the preceding claims.

Join the waitlist — get patent alerts

Track US2019216121A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.