Inspection method, inspection apparatus, production method, and production system for heatsink

Abstract

A method for inspecting a heatsink in which a heat dissipation layer is formed on a surface of a substrate formed by casting, includes shooting the heat dissipation layer by image pickup means in a state where residual heat transferred from the substrate to the heat dissipation layer remains and thereby acquiring image data representing a temperature distribution on a surface of the heat dissipation layer, the heat dissipation layer being formed by performing a film-forming process on the surface of the substrate where residual heat that is generated when the substrate is cast remains, the image pickup means being configured to receive an emission of light from molecules of the heat dissipation layer.

What is claimed is: 
     
         1 . A method for inspecting a heatsink in which a heat dissipation layer is formed on a surface of a substrate formed by casting, comprising
 shooting the heat dissipation layer by image pickup means in a state where residual heat transferred from the substrate to the heat dissipation layer remains and thereby acquiring image data representing a temperature distribution on a surface of the heat dissipation layer, the heat dissipation layer being formed by performing a film-forming process on the surface of the substrate where residual heat that is generated when the substrate is cast remains, the image pickup means being configured to receive an emission of light from molecules of the heat dissipation layer.   
     
     
         2 . The method for inspecting a heatsink according to  claim 1 , further comprising:
 comparing the image data with sampling image data and calculating a difference between temperatures of a plurality of areas within a section having a predetermined size in the image data and temperatures of areas in the sampling image data corresponding to respective areas in the image data, the sampling image data being acquired in advance and representing a temperature distribution on the surface of the heat dissipation layer in a state where the heat dissipation layer is not peeled off from the surface of the substrate; and   determining whether or not a total size of areas having a predetermined temperature difference or larger in the section is equal to or larger than a predetermined ratio with respect to the size of the section based on the calculated difference, and determining that the heatsink is a defective product in which the heat dissipation layer is peeled off from the surface of the substrate when the total size of the areas having the predetermined temperature difference or larger is equal to or higher than the predetermined ratio with respect to the size of the section.   
     
     
         3 . The method for inspecting a heatsink according to  claim 1 , further comprising determining whether or not a total size of areas having a predetermined temperature or lower in the section having the predetermined size in the image data is equal to or larger than a predetermined ratio with respect to the size of the section, and determining that the heatsink is a defective product in which the heat dissipation layer is peeled off from the surface of the substrate when the total size of the areas having the predetermined temperature or lower is equal to or higher than the predetermined ratio with respect to the size of the section. 
     
     
         4 . The method for inspecting a heatsink according to  claim 1 , further comprising displaying the image data and the sampling image data, which is acquired in advance and representing the temperature distribution on the surface of the heat dissipation layer in the state where the heat dissipation layer is not peeled off from the surface of the substrate. 
     
     
         5 . A method for producing a heatsink in which a heat dissipation layer is formed on a surface of a substrate formed by casting by performing a film-forming process, the method comprising:
 detecting a temperature of residual heat of the substrate after the substrate is cast;   forming the heat dissipation layer by applying a film-forming resin to the surface of the substrate when the detected temperature of the residual heat of the substrate is equal to or higher than a film-forming temperature of the film-forming resin; and   shooting the heat dissipation layer by image pickup means in a state where residual heat transferred from the substrate to the heat dissipation layer remains and thereby acquiring image data representing a temperature distribution on a surface of the heat dissipation layer, the image pickup means being configured to receive an emission of light from molecules of the heat dissipation layer.   
     
     
         6 . An inspection apparatus for a heatsink in which a heat dissipation layer is formed on a surface of a substrate formed by casting, the inspection apparatus comprising:
 image pickup means for shooting the heat dissipation layer in a state where residual heat transferred from the substrate to the heat dissipation layer remains and thereby acquiring image data representing a temperature distribution on a surface of the heat dissipation layer, the heat dissipation layer being formed by performing a film-forming process on the surface of the substrate where residual heat that is generated when the substrate is cast remains, the image pickup means being configured to receive an emission of light from molecules of the heat dissipation layer; and   processing means for determining whether or not the heatsink is a defective product in which the heat dissipation layer is peeled off from the surface of the substrate based on the image data.   
     
     
         7 . The inspection apparatus for a heatsink according to  claim 6 , wherein the processing means is further configured to:
 compare the image data with sampling image data and calculate a difference between temperatures of a plurality of areas within a section having a predetermined size in the image data and temperatures of areas in the sampling image data corresponding to respective areas in the image data, the sampling image data being acquired in advance and representing a temperature distribution on the surface of the heat dissipation layer in a state where the heat dissipation layer is not peeled off from the surface of the substrate; and   determine whether or not a size of areas having a predetermined temperature difference or larger in the section is equal to or larger than a predetermined ratio with respect to the size of the section based on the calculated difference, and determine that the heatsink is a defective product in which the heat dissipation layer is peeled off from the surface of the substrate when the size of the areas having the predetermined temperature difference or larger is equal to or higher than the predetermined ratio with respect to the size of the section.   
     
     
         8 . The inspection apparatus for a heatsink according to  claim 6 , wherein the processing means is further configured to determine whether or not a size of areas having a predetermined temperature or lower in the section having the predetermined size in the image data is equal to or larger than a predetermined ratio with respect to the size of the section, and determine that the heatsink is a defective product in which the heat dissipation layer is peeled off from the surface of the substrate when the size of the areas having the predetermined temperature or lower is equal to or higher than the predetermined ratio with respect to the size of the section. 
     
     
         9 . A production system for a heatsink in which a heat dissipation layer is formed on a surface of a substrate formed by casting by performing a film-forming process, the production system for a heatsink comprising:
 temperature detecting means for detecting a temperature of the substrate where residual heat that is generated when the substrate is cast remains;   forming means for forming the heat dissipation layer by applying a film-forming resin to the surface of the substrate when the detected temperature of the residual heat of the substrate is equal to or higher than a film-forming temperature of the film-forming resin;   image pickup means for shooting the heat dissipation layer in a state where residual heat transferred from the substrate to the heat dissipation layer remains and thereby acquiring image data representing a temperature distribution on a surface of the heat dissipation layer, the image pickup means being configured to receive an emission of light from molecules of the heat dissipation layer; and   processing means for determining whether or not the heatsink is a defective product in which the heat dissipation layer is peeled off from the surface of the substrate based on the image data.