Light emitting device package and light emitting device package module including the same

Abstract

Disclosed herein is a light emitting device package and a light emitting device package module. The light emitting device package includes: a base including a cavity; a first light emitting device disposed in the cavity, the first light emitting device including a first light emitting element configured to produce light having a first peak wavelength and a first fluorescent layer covering a top and side surfaces of the first light emitting element; and a second light emitting device disposed in the cavity, the second light emitting device including a second light emitting element configured to produce light having a second peak wavelength and a second fluorescent layer covering a top and side surfaces of the second light emitting element, wherein the first fluorescent layer is configured to convert the light having the first peak wavelength of the first light emitting element to light having a third peak wavelength, and the second fluorescent layer is configured to convert the light having the second peak wavelength of the second light emitting element to light having a fourth peak wavelength.

1 - 20 . (canceled) 
     
     
         21 . A light emitting device package module comprising:
 a circuit board configured a reflective sheet on main side of the circuit board and a plurality of terminals on one side of the circuit board;   a plurality of light emitting packages comprising a base formed a cavity configured a first light emitting device and a second light emitting device and having an anode terminal portion and a cathode terminal portion vertically connected on the terminals of the circuit board; and   a light guide plate disposed on the reflective sheet reflecting a light of the light emitting packages to the light guide plate;   wherein the first light emitting device including a first fluorescent layer covered a top surface and a side surface of a first light emitting element, and the second light emitting device including a second fluorescent layer covered a top surface and a side surface of a second light emitting element.   
     
     
         22 . The light emitting device package module of  claim 21 , wherein the first light emitting element having a first peak wavelength in a range from 380 nm to 450 nm, and the first fluorescent layer converted the first peak wavelength to the third peak wavelength in a range from 510 nm to 550 nm, and the second light emitting element having a second peak wavelength in a range from 380 nm to 450 nm, and the second fluorescent layer converted the second peak wavelength to the fourth peak wavelength in a range from 600 nm to 650 nm. 
     
     
         23 . The light emitting device package module of  claim 21 , wherein the anode terminal portion and the cathode terminal portion protruded from a side surface of the base, and formed in parallel with each other on the side surface of the base. 
     
     
         24 . The light emitting device package module of  claim 21 , wherein the anode terminal portion and the cathode terminal portion electrically connected the terminals of the circuit board. 
     
     
         25 . The light emitting device package module of  claim 21 , wherein the cavity packed a molding member, the molding member covered on the first light emitting device and the second light emitting device. 
     
     
         26 . The light emitting device package module of  claim 21 , wherein the base further comprising a plurality of reflecting surfaces configured to reflect light from the first light emitting device and the second light emitting device towards a center of the cavity. 
     
     
         27 . The light emitting device package module of  claim 21 , wherein the first light emitting device and the second light emitting device is a chip scale package (CSP) or a wafer level package (WLP). 
     
     
         28 . A light emitting device package module comprising:
 a circuit board configured a reflective sheet on main side of the circuit board and a plurality of terminals on one side of the circuit board;   a plurality of light emitting packages comprising a base formed a cavity configured a first light emitting device and a second light emitting device and having an anode terminal portion and a cathode terminal portion; and   a light guide plate disposed on the reflective sheet reflecting a light of the light emitting packages to the light guide plate;   wherein the anode terminal portion and the cathode terminal portion vertically connected on the terminals of the circuit board, and protruded from a side surface of the base, and formed in parallel with each other on the side surface of the base.   
     
     
         29 . The light emitting device package module of  claim 28 , wherein the first light emitting element having a first peak wavelength in a range from 380 nm to 450 nm, and the first fluorescent layer converted the first peak wavelength to the third peak wavelength in a range from 510 nm to 550 nm, and the second light emitting element having a second peak wavelength in a range from 380 nm to 450 nm, and the second fluorescent layer converted the second peak wavelength to the fourth peak wavelength in a range from 600 nm to 650 nm. 
     
     
         30 . The light emitting device package module of  claim 28 , wherein the first light emitting device including a first fluorescent layer covered a top surface and a side surface of a first light emitting element, and the second light emitting device including a second fluorescent layer covered a top surface and a side surface of a second light emitting element, 
     
     
         31 . The light emitting device package module of  claim 28 , wherein the cavity packed a molding member, the molding member covered on the first light emitting device and the second light emitting device. 
     
     
         32 . The light emitting device package module of  claim 28 , wherein the base further comprising a plurality of reflecting surfaces configured to reflect light from the first light emitting device and the second light emitting device towards a center of the cavity. 
     
     
         33 . The light emitting device package module of  claim 28 , wherein the first light emitting device and the second light emitting device is a chip scale package (CSP) or a wafer level package (WLP). 
     
     
         34 . A light emitting device package module comprising:
 a circuit board configured a reflective sheet on main side of the circuit board and a plurality of terminals on one side of the circuit board;   a plurality of light emitting packages comprising a base formed a cavity configured a first light emitting device and a second light emitting device and having an anode terminal portion and a cathode terminal portion; and   a light guide plate formed on the reflective sheet reflecting a light of the light emitting packages to the light guide plate;   wherein the light emitting packages vertically disposed on the terminals of the circuit board and the light of the light emitting packages irradiated to the reflective sheet and a position of the cavity of the light emitting packages configured a center of one facet of the light guide plate.   
     
     
         35 . The light emitting device package module of  claim 34 , wherein the anode terminal portion and the cathode terminal portion vertically connected on the terminals of the circuit board, and protruded from a side surface of the base, and formed in parallel with each other on the side surface of the base. 
     
     
         36 . The light emitting device package module of  claim 34 , wherein the first light emitting device including a first fluorescent layer covered a top surface and a side surface of a first light emitting element, and the second light emitting device including a second fluorescent layer covered a top surface and a side surface of a second light emitting element, 
     
     
         37 . The light emitting device package module of  claim 34 , wherein the cavity packed a molding member, the molding member covered on the first light emitting device and the second light emitting device. 
     
     
         38 . The light emitting device package module of  claim 34 , wherein the base further comprising a plurality of reflecting surfaces configured to reflect light from the first light emitting device and the second light emitting device towards a center of the cavity. 
     
     
         39 . The light emitting device package module of  claim 34 , wherein the first light emitting element having a first peak wavelength in a range from 380 nm to 450 nm, and the first fluorescent layer converted the first peak wavelength to the third peak wavelength in a range from 510 nm to 550 nm, and the second light emitting element having a second peak wavelength in a range from 380 nm to 450 nm, and the second fluorescent layer converted the second peak wavelength to the fourth peak wavelength in a range from 600 nm to 650 nm. 
     
     
         40 . The light emitting device package module of  claim 34 , wherein the first light emitting device and the second light emitting device is a chip scale package (CSP) or a wafer level package (WLP).