Heat dissipation device

Abstract

A heat dissipation device is disclosed. The heat dissipation device includes a main body and a tubular body. The main body has a chamber. A capillary structure is formed on an inner surface of the chamber by means of laser processing. A working fluid is contained in the chamber. One face of the main body is a condensation face, while the other face of the main body is a heat absorption face. The capillary structure is disposed corresponding to the heat absorption face. The heat absorption face of the main body is made of titanium material. The condensation face is made of titanium material or metal material. The tubular body is correspondingly inserted in the main body. The capillary structure is formed by means of laser processing. This not only solves the problem that the titanium material is difficult to process, but also can enhance the production efficiency.

1 . A heat dissipation device comprising:
 a main body having a chamber, a capillary structure being formed on an inner surface of the chamber by means of laser processing, a working fluid being contained in the chamber, one face of the main body being a condensation face, while the other face of the main body being a heat absorption face, the capillary structure being disposed corresponding to the heat absorption face, the heat absorption face of the main body being made of titanium material, the condensation face being made of titanium material, metal material or ceramic material; and   a tubular body correspondingly inserted in the main body.   
     
     
         2 . The heat dissipation device as claimed in  claim 1 , wherein the capillary structure is a micro-channeled structure or a structure composed of multiple raised bodies or recesses arranged at intervals. 
     
     
         3 . The heat dissipation device as claimed in  claim 1 , wherein the titanium material is commercial pure titanium or titanium alloy. 
     
     
         4 . The heat dissipation device as claimed in  claim 1 , wherein the metal material is selected from a group consisting of gold, silver, copper, aluminum and stainless steel. 
     
     
         5 . The heat dissipation device as claimed in  claim 1 , wherein the main body has an upper plate and a lower plate, the condensation face being positioned on one face of the upper plate, while the heat absorption face being positioned on one face of the lower plate, the upper and lower plate bodies being mated with each other to together define the chamber, the capillary structure being disposed on the other face of the lower plate opposite to the heat absorption face.