Compositions and methods of making thin wall housings for electronic devices

Abstract

Provided herein are high flow and ductile thermoplastic resin compositions for the formation of thin wall devices and devices with desirable impact strengths. These compositions are useful in the manufacture of various shaped, formed and/or molded devices.

We/I claim: 
     
         1 . A protective housing, comprising:
 a thermoplastic composition comprising
 a poly(aliphatic ester)-polycarbonate copolymer comprising soft block ester units and carbonate units; 
 a heat stabilizer; and 
 an epoxy resin, 
   wherein the thermoplastic composition has a melt flow rate ranging from 40 g/10 minutes to 150 g/10 minutes, measured according to ASTM D1238 at 300° C. and 1.2 kilogram-force; and   wherein the protective housing has at least one side of 0.5 mm thickness or less.   
     
     
         2 . The protective housing of  claim 1 , wherein the device has at least one side of 0.3 mm thickness or less. 
     
     
         3 . The protective housing of  claim 1 , wherein the device has at least one side of 0.25 mm thickness or less. 
     
     
         4 . The protective housing of  claim 1 , wherein the device has a surface area of at least 100 mm 2 . 
     
     
         5 . The protective housing of  claim 1 , wherein the protective housing is for a smartphone, personal digital assistant, tablet computer, or hand-held video game device. 
     
     
         6 . The protective housing of  claim 1 , wherein the protective housing is a snap-on or add-on element to protect the back, front, and/or one or more sides of the electronic device, wherein the protective housing is detachable from the device. 
     
     
         7 . The protective housing of  claim 1 , wherein the protective housing is for a touch screen device, wherein said protective housing allows for full function of the touch screen device and has no negative impact on touch screen performance 
     
     
         8 . The protective housing of  claim 1 , wherein an ASTM part molded from the thermoplastic composition exhibits 100% ductility at 23° C. 
     
     
         9 . The protective housing of  claim 1 , wherein the thermoplastic composition exhibits a melt flow rate of below 150 g/10 minutes at 300° C. under a load of 1.2 kg according to ASTM D 1238. 
     
     
         10 . The protective housing of  claim 1 , wherein the thermoplastic composition exhibits a melt flow rate of 100 g/10 minutes at 300° C. under a load of 1.2 kg according to ASTM D 1238. 
     
     
         11 . The protective housing of  claim 1 , wherein the soft block ester units of the poly(aliphatic ester)-polycarbonate are derived from an alpha, omega C 6-20  aliphatic dicarboxylic acid or a derivative thereof. 
     
     
         12 . The protective housing of  claim 1 , wherein the poly(aliphatic ester)-polycarbonate copolymer comprising soft block ester units and carbonate units has the following formula: 
       
         
           
           
               
               
           
         
         wherein n is from 1 to 6; and m is from 25 to 60. 
       
     
     
         13 . The protective housing of  claim 1 , wherein the poly(aliphatic ester)-polycarbonate copolymer contains 6.0 mol % sebacic acid. 
     
     
         14 . The protective housing of  claim 1 , wherein the heat stabilizer is: 
       
         
           
           
               
               
           
         
         tris(2,4-di-t-butylphenyl)phosphite; 
       
       
         
           
           
               
               
           
         
       
       bis(2,4-dicumylphenyl)pentaerythritol diphosphite; or a combination thereof. 
     
     
         15 . The protective housing of  claim 1 , wherein the epoxy resin is a hydrolytic stabilizer. 
     
     
         16 . The protective housing of  claim 1 , wherein the thermoplastic composition further comprises is pentaerythritol tetrastearate (PETS), a phthalic acid ester, or a poly-alpha-olefin. 
     
     
         17 . The protective housing of  claim 1 , wherein a 3.2 mm thick plaque molded from the thermoplastic composition, molded at 550° F. melt temperature and 10 minutes dwell time, exhibits a Yellowing Index (YI) percent increase of 6% or less compared to a 3.2 mm thick plaque molded from the thermoplastic composition at 550° F. melt temperature and 30 seconds dwell time. 
     
     
         18 . The protective housing of  claim 1 , wherein a 3.2 mm thick plaque molded from the thermoplastic composition exhibits a 96% or greater molecular weight retention after exposure to 85° C. at 85% relative humidity (RH) after 4 weeks. 
     
     
         19 . A protective housing, comprising: 
       a thermoplastic composition comprising
 a poly(aliphatic ester)-polycarbonate copolymer comprising soft block ester units and carbonate units and having the following formula: 
 
       
         
           
           
               
               
           
         
       
       wherein n is from 1 to 6; and m is from 25 to 60;
 a heat stabilizer, wherein the heat stabilizer is: 
 
       
         
           
           
               
               
           
         
         tris(2,4-di-t-butylphenyl)phosphite; 
       
       
         
           
           
               
               
           
         
         bis(2,4-dicumylphenyl)pentaerythritol diphosphite; or a combination thereof; and 
         an epoxy resin, 
       
       wherein the thermoplastic composition has a melt flow rate ranging from 40 g/10 minutes to 150 g/10 minutes, measured according to ASTM D1238 at 300° C. and 1.2 kilogram-force; and 
       wherein the protective housing has at least one side of 0.5 mm thickness or less. 
     
     
         20 . The protective housing of  claim 19 , wherein the thermoplastic composition further comprises is pentaerythritol tetrastearate (PETS), a phthalic acid ester, or a poly-alpha-olefin.