Molded chip fabrication method and apparatus

Abstract

A method and apparatus for coating a plurality of semiconductor devices that is particularly adapted to coating LEDs with a coating material containing conversion particles. One method according to the invention comprises providing a mold with a formation cavity. A plurality of semiconductor devices are mounted within the mold formation cavity and a curable coating material is injected or otherwise introduced into the mold to fill the mold formation cavity and at least partially cover the semiconductor devices. The coating material is cured so that the semiconductor devices are at least partially embedded in the cured coating material. The cured coating material with the embedded semiconductor devices is removed from the formation cavity. The semiconductor devices are separated so that each is at least partially covered by a layer of the cured coating material. One embodiment of an apparatus according to the invention for coating a plurality of semiconductor devices comprises a mold housing having a formation cavity arranged to hold semiconductor devices. The formation cavity is also arranged so that a curable coating material can be injected into and fills the formation cavity to at least partially covering the semiconductor devices.

We claim: 
     
         1 . A light emitting diode (LED) device, comprising:
 a LED at least partially embedded in a matrix material, wherein the outer surface of said matrix material comprises a plurality of planar surfaces and wherein at least one surface of said LED is uncovered by said matrix material.   
     
     
         2 . The LED device of  claim 1 , wherein said matrix material comprises an encapsulant. 
     
     
         3 . The LED device of  claim 1 , wherein said matrix material comprises epoxy or silicone. 
     
     
         4 . The LED device of  claim 1 , wherein said matrix material comprises a conversion material. 
     
     
         5 . The LED device of  claim 1 , wherein said matrix material is substantially cube-shaped. 
     
     
         6 . The LED device of  claim 1 , wherein said LED is substantially square shaped. 
     
     
         7 . The LED device of  claim 1 , wherein said LED has angled surfaces. 
     
     
         8 . A light emitting diode (LED) device, comprising:
 a LED comprising positive and negative terminals arranged on one surface of said LED, wherein said LED is partially covered by a substantially cube-shaped matrix material, wherein said positive and negative terminals are not covered by said matrix material.   
     
     
         9 . The LED device of  claim 8 , wherein said LED is substantially square shaped. 
     
     
         10 . The LED device of  claim 8 , wherein said LED has angled surfaces. 
     
     
         11 . The LED device of  claim 8 , wherein said matrix material comprises an encapsulant. 
     
     
         12 . The LED device of  claim 8 , wherein said matrix material comprises epoxy or silicone. 
     
     
         13 . The LED device of  claim 8 , wherein said matrix material comprises a conversion material. 
     
     
         14 . A light emitting diode (LED), comprising:
 a LED comprising positive and negative terminals on the same surface of said semiconductor layers and coplanar with each other, said LED emitting light in response to an electrical signal applied to said terminals; and   a matrix material covering surfaces of said LED wherein the outer surfaces of said matrix material comprises a plurality of planar surfaces, with an exposed portion of each of said terminals being uncovered by said matrix material.   
     
     
         15 . The LED of  claim 14 , wherein the outer surface of said. matrix material is substantially cube-shaped. 
     
     
         16 . The LED of  claim 14 , wherein said LED is substantially square shaped. 
     
     
         17 . The LED of  claim 14 , wherein said. LED has angled surfaces. 
     
     
         18 . The LED of  claim 14 , wherein said matrix material comprises an encapsulant. 
     
     
         19 . The LED of  claim 14 , wherein said matrix material comprises epoxy or silicone. 
     
     
         20 . The LED of  claim 14 , wherein said matrix material comprises a conversion material.