Multi-layer ceramic electronic component, multi-layer ceramic electronic component mounting substrate, and multi-layer ceramic electronic component package

Abstract

A multi-layer ceramic electronic component includes: a ceramic body that includes internal electrodes laminated in a first direction, and a pair of main surfaces including a center region facing in the first direction; and a pair of external electrodes connected to the internal electrodes and facing each other in a second direction orthogonal to the first direction, a dimension of the ceramic body in the first direction being 1.1 times or more and 1.6 times or less a dimension of the ceramic body in a third direction orthogonal to the first direction and the second direction, the center region being formed at a center portion of at least one of the pair of main surfaces in the second direction.

What is claimed is: 
     
         1 . A multi-layer ceramic electronic component, comprising:
 a ceramic body that includes
 internal electrodes laminated in a first direction, and 
 a pair of main surfaces including a center region facing in the first direction; and 
   a pair of external electrodes connected to the internal electrodes and facing each other in a second direction orthogonal to the first direction,   a dimension of the ceramic body in the first direction being 1.1 times or more and 1.6 times or less a dimension of the ceramic body in a third direction orthogonal to the first direction and the second direction,   the center region being formed at a center portion of at least one of the pair of main surfaces in the second direction.   
     
     
         2 . The multi-layer ceramic electronic component according to  claim 1 , wherein
 a dimension of the center region in the third direction is 80% or more and less than 100% of the dimension of the ceramic body in the third direction.   
     
     
         3 . The multi-layer ceramic electronic component according to  claim 1 , wherein
 the center region includes a flat region.   
     
     
         4 . A multi-layer ceramic electronic component mounting substrate, comprising:
 a circuit board; and   a multi-layer ceramic electronic component including
 a ceramic body including internal electrodes laminated in a first direction, and 
 a pair of external electrodes connected to the internal electrodes and facing each other in a second direction orthogonal to the first direction, the multi-layer ceramic electronic component being mounted onto the circuit board via the pair of external electrodes, 
   a dimension of the ceramic body in the first direction being 1.1 times or more and 1.6 times or less a dimension of the ceramic body in a third direction orthogonal to the first direction and the second direction,   the ceramic body including a pair of main surfaces including a center region facing in the first direction, the center region being formed at a center portion of at least one of the pair of main surfaces in the second direction,   the multi-layer ceramic electronic component being mounted onto the circuit board with the center region being faced outward in the first direction.   
     
     
         5 . A multi-layer ceramic electronic component package, comprising:
 a multi-layer ceramic electronic component including
 a ceramic body including internal electrodes laminated in a first direction, and 
 a pair of external electrodes connected to the internal electrodes and facing each other in a second direction orthogonal to the first direction, the multi-layer ceramic electronic component being mounted onto a circuit board via the pair of external electrodes; 
   a housing portion including a recess that houses the multi-layer ceramic electronic component and includes a take-out opening; and   a sealing portion that covers the take-out opening of the recess,   a dimension of the ceramic body in the first direction being 1.1 times or more and 1.6 times or less a dimension of the ceramic body in a third direction orthogonal to the first direction and the second direction,   the ceramic body including a pair of main surfaces including a center region facing in the first direction, the center region being formed at a center portion of at least one of the pair of main surfaces in the second direction,   the multi-layer ceramic electronic component being housed in the recess with the center region being faced to the take-out opening.