Quantum computing assemblies

Abstract

Disclosed herein are quantum computing assemblies, as well as related computing devices and methods. For example, in some embodiments, a quantum computing assembly may include: a quantum device die to generate a plurality of qubits; a control circuitry die to control operation of the quantum device die; and a substrate; wherein the quantum device die and the control circuitry die are disposed on the substrate.

1 . A quantum computing assembly, comprising:
 a quantum device die to generate a plurality of qubits;   a control circuitry die to control operation of the quantum device die; and   a substrate;   wherein the quantum device die and the control circuitry die are disposed on the substrate.   
     
     
         2 . The quantum computing assembly of  claim 1 , wherein the substrate is a package substrate, and the quantum device die and the control circuitry die are included in a common package. 
     
     
         3 . The quantum computing assembly of  claim 1 , wherein the substrate is an interposer. 
     
     
         4 . The quantum computing assembly of  claim 1 , wherein the substrate is a printed circuit board. 
     
     
         5 . The quantum computing assembly of  claim 1 , wherein the quantum device die and the control circuitry die are included in a package-on-package structure. 
     
     
         6 . The quantum computing assembly of  claim 1 , wherein the substrate includes at least one microwave transmission line between the quantum device die and the control circuitry die. 
     
     
         7 . The quantum computing assembly of  claim 1 , wherein the substrate includes at least one conductive pathway between a face of the substrate to which the control circuitry die is coupled, and an opposing face of the substrate. 
     
     
         8 . The quantum computing assembly of  claim 1 , wherein the control circuitry die includes a processing device or a memory element. 
     
     
         9 . The quantum computing assembly of  claim 1 , wherein the quantum device die and the control circuitry die are each coupled to the substrate with solder connections. 
     
     
         10 . The quantum computing assembly of  claim 1 , wherein the quantum device die includes a plurality of gates, and the control circuitry die is to provide voltages to the plurality of gates through the substrate. 
     
     
         11 . The quantum computing assembly of  claim 1 , wherein the quantum device die includes one or more magnet lines, and the control circuitry die is to provide electrical pulses to the one or more magnet lines through the substrate. 
     
     
         12 . The quantum computing assembly of  claim 1 , wherein the control circuitry die includes a switching matrix for selecting one or more of the qubits to read or write. 
     
     
         13 . The quantum computing assembly of  claim 1 , wherein the qubits are quantum-dot-based qubits. 
     
     
         14 . The quantum computing assembly of  claim 1 , wherein the substrate includes electrical pathways between the quantum device die and the control circuitry die, and the electrical pathways include superconducting material. 
     
     
         15 . The quantum computing assembly of  claim 1 , further comprising:
 a memory device to store data generated by the control circuitry die during operation of the quantum device die.   
     
     
         16 . The quantum computing assembly of  claim 1 , further comprising:
 a wired or wireless network controller to receive and transmit data from the control circuitry die.   
     
     
         17 . A method of manufacturing a quantum computing assembly, including:
 providing a substrate, wherein the substrate includes one or more electrical pathways between a first set of contacts and a second set of contacts;   coupling a quantum device die to the first set of contacts such that the quantum device die is disposed on the substrate; and   coupling one or more control dies to the second set of contacts such that the one or more control dies are disposed on the substrate, wherein the control dies are to provide voltages to one or more components of the quantum device die through the one or more electrical pathways.   
     
     
         18 . The method of  claim 17 , wherein the one or more electrical pathways includes a coplanar waveguide, a strip line or a microstrip line. 
     
     
         19 . The method of  claim 17 , wherein the quantum device die is disposed on an intermediate structure, and coupling the quantum device die to the first set of contacts includes physically securing the intermediate structure on the first set of contacts. 
     
     
         20 . The method of  claim 17 , wherein one or more control dies are disposed on an intermediate structure, and coupling the one or more control dies to the second set of contacts includes physically securing the intermediate structure on the second set of contacts. 
     
     
         21 - 25 . (canceled)