US2019186046A1PendingUtilityA1

Porous surface for biomedical devices

Assignee: APPLIED MATERIALS INCPriority: Oct 31, 2014Filed: Dec 21, 2018Published: Jun 20, 2019
Est. expiryOct 31, 2034(~8.3 yrs left)· nominal 20-yr term from priority
B01L 3/5085B01J 2219/00722C40B 50/18C40B 60/00B01J 19/0046C40B 60/04B01L 2300/0819B01J 2219/00644B01J 2219/00637B01J 2219/00596B01J 2219/00317B01L 2300/0893B01L 2200/12
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Claims

Abstract

Embodiments described herein generally relate to biomedical devices including a porous layer forming a support structure for a biological probe and methods of making the same. The porous layer can be a porous silicon containing layer. The pore size can be adjusted such that various size biological probes can be incorporated into the pores. Further, the porous silicon containing layer can be used to support a biofunctionalizing layer.

Claims

exact text as granted — not AI-modified
1 - 20 . (canceled) 
     
     
         21 . A method of depositing a material, comprising:
 positioning an array device on a substrate support, the array device comprising:
 a substrate; and 
 a layer disposed over the substrate, the layer having a first surface, the first surface having a microarray formation layer formed thereon, the microarray formation layer having an exposed surface; 
   forming one or more wells in the microarray formation layer;   depositing a porous silicon-containing layer over the microarray formation layer and in the one or more wells;   removing a portion of the porous silicon-containing layer, the portion of the porous silicon-containing layer being over the microarray formation layer and outside of the one or more wells; and   depositing a biological probe into the one or more wells, the biological probe being in connection with the porous silicon-containing layer.   
     
     
         22 . The method of  claim 21 , wherein forming the one or more wells further comprises:
 depositing a photoresist on the exposed surface of the microarray formation layer;   patterning and etching the photoresist to create one or more well templates in the photoresist; and   etching the microarray formation layer through the well templates to create one or more wells.   
     
     
         23 . The method of  claim 22 , wherein the removing of the portions of the porous silicon-containing layer is performed by removing the photoresist after the porous silicon-containing layer is deposited. 
     
     
         24 . The method of  claim 21 , wherein porous silicon-containing material comprises silicon and oxygen. 
     
     
         25 . The method of  claim 21 , wherein the removing of the portions of the porous silicon-containing layer is performed by using a chemical mechanical polishing process. 
     
     
         26 . The method of  claim 21 , further comprising:
 deposition a biofunctionalizing material prior to the depositing of the biological probe.   
     
     
         27 . The method of  claim 26 , wherein the biofunctionalizing material is a hydrogel. 
     
     
         28 . A method of forming a biomedical device, comprising:
 forming a first dielectric layer on a substrate;   forming a color filter layer on the first dielectric layer, the color filter layer being transparent to at least one wavelength of light while being opaque to at least one wavelength of light;   forming a second dielectric layer on the color filter layer;   forming a metal-containing layer on the second dielectric layer;   forming a microarray formation layer over the metal-containing layer, the microarray formation layer having one or more wells formed therein, each of the one or more wells having a bottom surface in contact with the metal-containing layer;   forming a porous silicon-containing layer over the bottom surface of the one or more wells, the porous silicon-containing layer having an exposed surface; and   forming a biofunctionalizing material over the porous silicon-containing layer on at least the bottom surface of a well.   
     
     
         29 . The method of  claim 28 , wherein the first dielectric layer and the second dielectric layer comprises a silicon oxide layer, a silicon nitride layer, or a silicon oxynitride. 
     
     
         30 . The method of  claim 28 , wherein the second dielectric layer is deposited at a temperature of less than about 100 degrees Celsius. 
     
     
         31 . The method of  claim 28 , wherein the metal-containing layer comprises a tantalum oxide layer, a tungsten oxide layer, or a hafnium oxide layer. 
     
     
         32 . The method of  claim 28 , wherein the biofunctionalizing material comprises hydrogels. 
     
     
         33 . The method of  claim 28 , further comprising:
 after forming a porous silicon-containing layer over the bottom surface of the one or more wells, removing a portion of the porous silicon-containing layer using a chemical mechanical polishing process.

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