Substrate processing apparatus, substrate processing method, and storage medium storing program

Abstract

A substrate processing apparatus includes: a first polishing head configured to polish a first surface of a substrate by sliding a polishing tool on the first surface; a second polishing head configured to polish the first surface of the substrate by sliding a polishing tool on the first surface, the second polishing head having a smaller diameter than a diameter of the first polishing head; and a substrate support mechanism configured to support the substrate by a fluid pressure at positions corresponding to the first polishing head and the second polishing head, the substrate support mechanism being configured to support the substrate from a second surface of the substrate opposite to the first surface.

What is claimed is: 
     
         1 . A substrate processing apparatus comprising:
 a first polishing head configured to polish a first surface of a substrate by sliding a first polishing tool on the first surface;   a second polishing head configured to polish the first surface of the substrate by sliding a second polishing tool on the first surface, the second polishing head having a smaller diameter than a diameter of the first polishing head; and   a substrate support mechanism configured to support the substrate by a fluid pressure at positions corresponding to the first polishing head and the second polishing head from a second surface of the substrate opposite to the first surface.   
     
     
         2 . The substrate processing apparatus according to  claim 1 , wherein
 the substrate support mechanism includes:   a first static pressure plate configured to support the substrate at the position corresponding to the first polishing head; and   a second static pressure plate configured to support the substrate at the position corresponding to the second polishing head.   
     
     
         3 . The substrate processing apparatus according to  claim 2 , further comprising:
 a second arm configured to move the second polishing head;   a movable mechanism provided in the substrate support mechanism and configured to move the second static pressure plate; and   a controller configured to control the second arm and the movable mechanism such that the second static pressure plate follows the second polishing head.   
     
     
         4 . The substrate processing apparatus according to  claim 1 , wherein
 the substrate support mechanism includes:   a static pressure plate; and   a movable mechanism configured to move the static pressure plate between an area corresponding to the first polishing head and an area corresponding to the second polishing head.   
     
     
         5 . The substrate processing apparatus according to  claim 1 , wherein
 the substrate support mechanism includes:   a static pressure plate configured to support the substrate at the positions corresponding to the first polishing head and the second polishing head;   a first fluid line configured to supply a fluid to an area on the static pressure plate corresponding to the first polishing head; and   a second fluid line configured to supply a fluid to an area on the static pressure plate corresponding to the second polishing head.   
     
     
         6 . The substrate processing apparatus according to  claim 5 , further comprising:
 a second arm configured to move the second polishing head;   a plurality of the second fluid line provided in the substrate support mechanism and connected with a plurality of positions on the static pressure plate within a range in which the second polishing head is moved; and   a controller configured to control an amount of the fluid to be supplied through each second fluid line, thereby to change positions on the static pressure plate to which the fluid is supplied follows the second polishing head.   
     
     
         7 . The substrate processing apparatus according to  claim 1 , wherein
 the second polishing head is arranged to polish the substrate at a position outside of the first polishing head in a radial direction of the substrate.   
     
     
         8 . The substrate processing apparatus according to  claim 1 , wherein
 the substrate processing apparatus includes a back surface polishing apparatus,   the first surface of the substrate is a surface on which no device is formed, and   the polishing process is performed after a resist is applied to the second surface of the substrate and before an exposure process is performed.   
     
     
         9 . A substrate processing apparatus comprising:
 a substrate holding mechanism configured to hold and rotate a substrate, the substrate holding mechanism including a plurality of rollers configured to be able to contact a periphery of the substrate, each roller being configured to be rotatable about an axis thereof;   a first polishing head configured to polish a first surface of the substrate by sliding a first polishing tool on the first surface; and   a second polishing head configured to polish the first surface of the substrate by sliding a second polishing tool on the first surface, the second polishing head having a smaller diameter than a diameter of the first polishing head.   
     
     
         10 . A substrate processing method comprising:
 polishing a first surface of a substrate by sliding a first polishing tool of a first polishing head on the first surface of the substrate and by sliding a second polishing tool of a second polishing head on the first surface of the substrate, the second polishing head having a smaller diameter than a diameter of the first polishing head; and   supporting the substrate from a second surface of the substrate at positions corresponding to the first polishing head and the second polishing head, the second surface being opposite to the first surface.   
     
     
         11 . The substrate processing method according to  claim 10 , wherein
 the first surface of the substrate is a surface on which no device is formed, and   the polishing process is performed after a resist is applied to the second surface of the substrate and before an exposure process is performed.   
     
     
         12 . A substrate processing method comprising:
 rotating a substrate by bringing a plurality of rollers into contact with a periphery of the substrate and rotating each roller about an axis thereof; and   polishing, during rotation of the substrate, a first surface of the substrate with a first polishing head and a second polishing head, the second polishing head having a smaller diameter than a diameter of the first polishing head.   
     
     
         13 . The substrate processing method according to  claim 12 , wherein
 the first surface of the substrate is a surface on which no device is formed, and   the polishing process is performed after a resist is applied to the second surface of the substrate and before an exposure process is performed.   
     
     
         14 . A non-volatile storage medium storing a program causing a computer to perform a method for controlling a substrate processing apparatus, the method comprising:
 polishing a first surface of a substrate by sliding a first polishing tool of a first polishing head on the first surface of the substrate and by sliding a second polishing tool of a second polishing head on the first surface of the substrate, the second polishing head having a smaller diameter than a diameter of the first polishing head; and   supporting, during the polishing, the substrate from a second surface of the substrate at positions corresponding to the first polishing head and the second polishing head, the second surface being opposite to the first surface.   
     
     
         15 . A non-volatile storage medium storing a program causing a computer to perform a method for controlling a substrate processing apparatus, the method comprising:
 rotating a substrate by bringing a plurality of rollers into contact with a periphery of the substrate and rotating each roller about an axis thereof; and   polishing, during rotation of the substrate, a first surface of the substrate with a first polishing head and a second polishing head, the second polishing head having a smaller diameter than a diameter of the first polishing head.