Integration of chip level micro-fluidic cooling in chip packages for heat flux removal

Abstract

An electronic chip package includes a base defining a fluid inlet opening for receiving pressurized fluid from a fluid source and a fluid outlet opening. A dielectric body is arranged on the base and configured to support an electronic device. The dielectric body comprises a coolant flow chamber formed in a first surface thereof, and a plurality of impingement openings formed within the coolant flow chamber. The plurality of impingement openings are in communication with the fluid inlet opening of the base for generating a plurality of fluid streams to be expelled into the coolant flow chamber. The body further comprises a coolant return port formed within the coolant flow chamber and in communication with the fluid outlet opening of the base.

What is claimed is: 
     
         1 . A substrate body for supporting an electronic device, comprising:
 at least one electrical circuit formed on or within the body and configured to be connected to the electronic device; and   a plurality of impingement openings formed through the body, each impingement opening responsive to a source of pressurized fluid for generating a fluid stream expelled in a direction of the electronic device.   
     
     
         2 . The substrate body of  claim 1 , wherein the body comprises a plurality of laminated layers of dielectric material. 
     
     
         3 . The substrate body of  claim 2 , wherein the plurality of laminated layers comprise layers of ceramic material. 
     
     
         4 . The substrate body of  claim 1 , further comprising a recessed area formed in a first surface of the body, wherein the plurality of impingement openings are defined within said recessed area. 
     
     
         5 . The substrate body of  claim 4 , further comprising at least one fluid return opening formed through the body and in communication with the recessed area. 
     
     
         6 . The substrate body of  claim 1 , wherein the plurality of impingement openings are oriented such that the plurality of fluid streams expelled thereby are configured to directly impinge on a surface of the circuit device supported by the body. 
     
     
         7 . The substrate body of  claim 4 , wherein the recessed area is vertically aligned relative to the electronic device. 
     
     
         8 . The substrate body of  claim 2 , wherein the plurality of laminated layers of dielectric material are arranged in stacked relation to one another. 
     
     
         9 . An electronic chip package comprising:
 a base including a fluid inlet opening for receiving pressurized fluid from a fluid source and a fluid outlet opening; and   a dielectric body arranged on the base and configured to support an electronic device, the body including:
 a coolant flow chamber formed in a first surface thereof; 
 a plurality of impingement openings formed through the body within the coolant flow chamber, the plurality of impingement openings in communication with the fluid inlet opening of the base for generating a plurality of fluid streams to be expelled into the coolant flow chamber; and 
 a coolant return port formed through the body within the coolant flow chamber and in communication with the fluid outlet opening of the base, 
   wherein the plurality of impingement openings are positioned such that a plurality of fluid streams to be generated are configured to directly impinge on the surface of the electronic device mounted to the first surface of the body.   
     
     
         10 . The package of  claim 9 , wherein the base comprises a thickness and the fluid inlet opening and fluid outlet opening are formed through the base in a direction of the thickness. 
     
     
         11 . The package of  claim 10 , wherein the dielectric body further comprises:
 a first dielectric layer having a first thickness and including an aperture formed therethrough in a direction of the first thickness for defining the coolant flow chamber; and   a second dielectric layer having a second thickness, wherein the plurality of impingement openings and the coolant return port are formed through the second dielectric layer in a direction of the second thickness.   
     
     
         12 . The package of  claim 9 , wherein the fluid inlet opening, the plurality of impingement openings, and the coolant flow chamber are oriented such that fluid from the fluid source may uninterruptedly pass through the fluid inlet opening, the plurality of impingement openings, and the coolant flow chamber in a first direction. 
     
     
         13 . An electronic chip package comprising:
 a base including a fluid inlet opening for receiving pressurized fluid from a fluid source and a fluid outlet opening; and   a dielectric body having a first side arranged on the base, and a second side opposite the first side configured to support an electronic device arranged thereon, the body including:
 a coolant flow chamber formed in the second side of the body, the coolant flow chamber configured to be in fluid communication with an exposed surface of the electronic device when the electronic device is supported by the body; 
 a plurality of impingement openings formed through the body within the coolant flow chamber, the plurality of impingement openings in communication with the fluid inlet opening of the base for generating a plurality of fluid streams to be expelled into the coolant flow chamber; and 
 a coolant return port formed through the body within the coolant flow chamber and in communication with the fluid outlet opening of the base. 
   
     
     
         14 . The package of  claim 13 , wherein the fluid inlet opening, the plurality of impingement openings, and the coolant flow chamber are oriented such that fluid from the fluid source may uninterruptedly pass through the fluid inlet opening, the plurality of impingement openings, and the coolant flow chamber in a first direction. 
     
     
         15 . The package of  claim 14 , wherein the dielectric body further comprises:
 a first layer of dielectric material having a first thickness and including an aperture formed therethrough in a direction of the first thickness for defining the coolant flow chamber; and   a second layer of dielectric material having a second thickness, wherein the plurality of impingement openings and the coolant return port are formed through the second dielectric layer in a direction of the second thickness,   wherein the base comprises a third thickness and the fluid inlet opening and fluid outlet opening are formed through the base in a direction of the third thickness, and   
       wherein the first direction comprises the direction of the first, second, and third thicknesses. 
     
     
         16 . The package of  claim 15 , wherein the first and second layers of dielectric material comprise a ceramic material. 
     
     
         17 . The package of  claim 15 , wherein a recessed area is formed in a top surface of the layer of dielectric material proximal to the electronic device and in vertical alignment therewith, and wherein the plurality of impingement openings are defined within said recessed area.