Thermosyphon-type heat dissipation device

Abstract

A thermosyphon-type heat dissipation device includes a heat-absorbing head and a radiator. The heat-absorbing head includes a first outlet, a first inlet, an evaporation chamber and a liquid return chamber. The first outlet is connected with the evaporation chamber. The first inlet is connected with the liquid return chamber. The evaporation chamber and the liquid return chamber are in communication with each other through a gap. An inner space of the evaporation chamber is larger than an inner space of the liquid return chamber. The radiator includes a second inlet and a second outlet. The second inlet is in communication with the first outlet. The second outlet is in communication with the first inlet.

What is claimed is: 
     
         1 . A thermosyphon-type heat dissipation device, comprising:
 a heat-absorbing head comprising a first outlet, a first inlet, an evaporation chamber and a liquid return chamber, wherein the first outlet is connected with the evaporation chamber, the first inlet is connected with the liquid return chamber, the evaporation chamber and the liquid return chamber are in communication with each other through a gap, and an inner space of the evaporation chamber is larger than an inner space of the liquid return chamber; and   a radiator comprising a second inlet and a second outlet, wherein the second inlet is in communication with the first outlet, and the second outlet is in communication with the first inlet.   
     
     
         2 . The thermosyphon-type heat dissipation device according to  claim 1 , further comprising a pipe, wherein the pipe is connected with the first outlet and the second inlet, and the pipe is connected with the second outlet and the first inlet. 
     
     
         3 . The thermosyphon-type heat dissipation device according to  claim 2 , wherein the pipe is a hard conduit or a flexible tube. 
     
     
         4 . The thermosyphon-type heat dissipation device according to  claim 2 , wherein the pipe is made of a plastic material or a non-plastic material. 
     
     
         5 . The thermosyphon-type heat dissipation device according to  claim 1 , further comprising a pump, wherein the pump is connected between the second outlet and the first inlet. 
     
     
         6 . The thermosyphon-type heat dissipation device according to  claim 1 , wherein the heat-absorbing head comprises a top cover and a base, and the liquid return chamber and the evaporation chamber are defined by the top cover and the base collaboratively, wherein a bottom surface of the base is in thermal contact with a heat source, and the shortest distance between the gap and the bottom surface of the base is smaller than the shortest distance between the first outlet and the bottom surface of the base. 
     
     
         7 . The thermosyphon-type heat dissipation device according to  claim 6 , wherein the top cover has a guiding slant, wherein when a working medium is heated, the working medium is guided to the first outlet by the guiding slant. 
     
     
         8 . The thermosyphon-type heat dissipation device according to  claim 1 , wherein the radiator comprises a first compartment, a second compartment, a third compartment and a fourth compartment, wherein the first compartment is in communication with the second inlet, the fourth compartment is in communication with the second outlet, the first compartment and the second compartment are in communication with each other through a first fluid channel group, the second compartment and the third compartment are in communication with each other through a second fluid channel group, and the third compartment and the fourth compartment are in communication with each other through a third fluid channel group, wherein a flowing direction of the first fluid channel group is reverse to a flowing direction of the second fluid channel group, and the flowing direction of the second fluid channel group is reverse to a flowing direction of the third fluid channel group. 
     
     
         9 . The thermosyphon-type heat dissipation device according to  claim 8 , wherein the first compartment and the third compartment are located at a first side of the radiator, the first compartment is located over the third compartment, the second compartment and the fourth compartment are located at a second side of the radiator, and the second compartment is located over the fourth compartment. 
     
     
         10 . The thermosyphon-type heat dissipation device according to  claim 1 , wherein the radiator comprises plural compartments and plural fluid channels in communication with the plural compartments, wherein one of the plural compartments is in communication with the second outlet and has the smallest inner space among the plural compartments. 
     
     
         11 . The thermosyphon-type heat dissipation device according to  claim 1 , wherein the radiator comprises plural compartments and plural fluid channels in communication with the plural compartments, wherein a first compartment of the plural compartments is in communication with the second outlet, and the first compartment is in communication with a second compartment of the plural compartments through a first fluid channel group, wherein an inner space of the second compartment is larger than an inner space of the second compartment. 
     
     
         12 . The thermosyphon-type heat dissipation device according to  claim 1 , wherein when the thermosyphon-type heat dissipation device is installed in an electronic device, the second inlet is at a level higher than the second outlet. 
     
     
         13 . The thermosyphon-type heat dissipation device according to  claim 1 , wherein when the thermosyphon-type heat dissipation device is installed in an electronic device, the first outlet is at a level higher than the first inlet. 
     
     
         14 . The thermosyphon-type heat dissipation device according to  claim 1 , wherein a working medium is filled in the thermosyphon-type heat dissipation device, and the working medium is an engineered fluid with low boiling point or water, wherein during a process of heating or cooling the working medium, the working medium undergoes a two-phase liquid-gas or gas-liquid transformation. 
     
     
         15 . A thermosyphon-type heat dissipation device, comprising:
 a heat-absorbing head comprising a first outlet, a first inlet, a top cover, a base, an evaporation chamber, a liquid return chamber and a gap, wherein the liquid return chamber and the evaporation chamber are defined by the top cover and the base collaboratively, the first outlet is connected with the evaporation chamber, the first inlet is connected with the liquid return chamber, the evaporation chamber and the liquid return chamber are in communication with each other through the gap, and a working medium is filled in the heat-absorbing head, wherein when the working medium in the evaporation chamber is heated, the working medium is transformed from a liquid state into a gaseous state and the gaseous working medium is outputted from the first outlet, wherein the working medium in the liquid return chamber is in the liquid state and transferred to the evaporation chamber through a capillary action of the gap; and   a radiator comprising a second inlet and a second outlet, wherein the second inlet is in communication with the first outlet, the second outlet is in communication with the first inlet, and the working medium is transformed from the gaseous state into the liquid state by the radiator.   
     
     
         16 . The thermosyphon-type heat dissipation device according to  claim 15 , further comprising a pipe, wherein the pipe is connected with the first outlet and the second inlet, and the pipe is connected with the second outlet and the first inlet. 
     
     
         17 . The thermosyphon-type heat dissipation device according to  claim 15 , further comprising a pump, wherein the pump is connected between the second outlet and the first inlet. 
     
     
         18 . The thermosyphon-type heat dissipation device according to  claim 15 , wherein a bottom surface of the base is in thermal contact with a heat source, and the shortest distance between the gap and the bottom surface of the base is smaller than the shortest distance between the first outlet and the bottom surface of the base. 
     
     
         19 . The thermosyphon-type heat dissipation device according to  claim 15 , wherein the top cover has a guiding slant, wherein when the working medium is heated, the working medium is guided to the first outlet by the guiding slant. 
     
     
         20 . The thermosyphon-type heat dissipation device according to  claim 15 , wherein the radiator comprises a first compartment, a second compartment, a third compartment and a fourth compartment, wherein the first compartment is in communication with the second inlet, the fourth compartment is in communication with the second outlet, the first compartment and the second compartment are in communication with each other through a first fluid channel group, the second compartment and the third compartment are in communication with each other through a second fluid channel group, and the third compartment and the fourth compartment are in communication with each other through a third fluid channel group, wherein a flowing direction of the first fluid channel group is reverse to a flowing direction of the second fluid channel group, and the flowing direction of the second fluid channel group is reverse to a flowing direction of the third fluid channel group. 
     
     
         21 . The thermosyphon-type heat dissipation device according to  claim 20 , wherein the first compartment and the third compartment are located at a first side of the radiator, the first compartment is located over the third compartment, the second compartment and the fourth compartment are located at a second side of the radiator, and the second compartment is located over the fourth compartment. 
     
     
         22 . The thermosyphon-type heat dissipation device according to  claim 15 , wherein the radiator comprises plural compartments and plural fluid channels in communication with the plural compartments, wherein one of the plural compartments is in communication with the second outlet and has the smallest inner space among the plural compartments. 
     
     
         23 . The thermosyphon-type heat dissipation device according to  claim 15 , wherein the radiator comprises plural compartments and plural fluid channels in communication with the plural compartments, wherein a first compartment of the plural compartments is in communication with the second outlet, and the first compartment is in communication with a second compartment of the plural compartments through a first fluid channel group, wherein an inner space of the second compartment is larger than an inner space of the second compartment. 
     
     
         24 . The thermosyphon-type heat dissipation device according to  claim 15 , wherein when the thermosyphon-type heat dissipation device is installed in an electronic device, the second inlet is at a level higher than the second outlet. 
     
     
         25 . The thermosyphon-type heat dissipation device according to  claim 15 , wherein when the thermosyphon-type heat dissipation device is installed in an electronic device, the first outlet is at a level higher than the first inlet. 
     
     
         26 . The thermosyphon-type heat dissipation device according to  claim 15 , wherein the working medium is an engineered fluid with low boiling point or water, wherein during a process of heating or cooling the working medium, the working medium undergoes a two-phase liquid-gas or gas-liquid transformation. 
     
     
         27 . A heat-absorbing head, comprising:
 an evaporation chamber;   a liquid return chamber;   an outlet connected with the evaporation chamber; and   an inlet connected with the liquid return chamber,   wherein when the heat-absorbing head is in horizontal placement and attached on a heat source, the inlet is located at a lateral side of the heat-absorbing head, wherein when the heat-absorbing head is in vertical placement and attached on the heat source, the inlet is located at a lower position of the heat-absorbing head.   
     
     
         28 . The heat-absorbing head according to  claim 27 , wherein the evaporation chamber and the liquid return chamber are in communication with each other through a gap, and the gap comprises plural slits.