In-package photonics integration and assembly architecture

Abstract

In one embodiment, a microelectronic package structure comprises a substrate comprising at least one waveguide, a first instrument integrated circuit coupled to the substrate, a photonic engine coupled to the substrate and comprising an integrated circuit body, a transmit die, and a receive die. The photonic engine is positioned adjacent the at least one waveguide such that optical signals may be exchanged between the at least one waveguide and the transmit die and the at least one waveguide and the receive die. Other embodiments may be described.

What is claimed is: 
     
         1 . A photonic engine, comprising:
 an integrated circuit body;   a transmit die; and   a receive die;   wherein:
 the transmit die and the receive die are coupled to the photonic engine by a first plurality of bumps having a first height; and 
 the one or more solder balls are coupled to the photonic engine by a second plurality of bumps having a second height, greater than the first height. 
   
     
     
         2 . The photonic engine of  claim 1 , wherein:
 the photonic engine is coupled to a substrate via the one or more solder balls; and   the one or more solder balls are at least partially covered by a mold material,   wherein the mold material defines an air gap between the transmit die and at least one waveguide on the substrate and the receive die and the at least one waveguide on the substrate.   
     
     
         3 . The photonic engine of  claim 2 , further comprising:
 a thermal interface material (TIM) in thermal communication with the photonic engine.   
     
     
         4 . The photonic engine of  claim 3 , further comprising:
 a heat spreader in thermal communication with the thermal interface material.   
     
     
         5 . The photonic engine of  claim 4 , further comprising:
 a ball grid array positioned proximate a surface of the substrate.