US2019170911A1PendingUtilityA1
Scale and manufacturing method of the same
Est. expiryDec 5, 2037(~11.4 yrs left)· nominal 20-yr term from priority
Inventors:Toshihiko Aoki
G02B 1/18G01D 5/34707G02B 1/14G01B 11/02
59
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Claims
Abstract
A scale includes: a substrate; scale gratings that are formed on a face of the substrate and has a plurality of gratings at a predetermined interval; and a protective layer that is made of fluoride and covers the scale gratings and an exposed portion of the face of the substrate.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A scale comprising:
a substrate; scale gratings that are formed on a face of the substrate and has a plurality of gratings at a predetermined interval; and a protective layer that is made of fluoride and covers the scale gratings and an exposed portion of the face of the substrate.
2 . The scale as claimed in claim 1 , wherein a thickness of the protective layer is 3 μm or less.
3 . The scale as claimed in claim 1 , wherein a thickness of the protective layer is 1 μm or less.
4 . The scale as claimed in claim 1 , wherein a surface of the protective layer is flat or approximately flat.
5 . The scale as claimed in claim 1 , wherein the fluoride is a polymer of fluorocarbon.
6 . A manufacturing method of a scale comprising:
forming a protective layer on a face of a substrate by a plasma polymerization, the substrate having scale gratings of a plurality of gratings arranged at a predetermined interval, the protective layer being made of fluoride and covering the scale gratings and an exposed portion of the face of the substrate.
7 . The method as claimed in claim 6 , wherein, in the forming of the protective layer, a surface of the protective layer is shaped into flat or approximately flat.
8 . The method as claimed in claim 6 , wherein further comprising:
forming the scale gratings by etching a layer to be etched that is formed on the face of the substrate, by using a plasma etching device, wherein, in the forming of the protective layer, the protective layer is formed by a plasma polymerization of the fluoride gas, by changing an operation condition of the plasma etching device.
9 . The method as claimed in claim 8 , wherein:
in the forming of the scale gratings, the scale gratings are formed by performing the etching with use of a mask; and the mask is removed by using the plasma etching device.
10 . The method as claimed in claim 6 , wherein the fluoride is a polymer of fluorocarbon.Join the waitlist — get patent alerts
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