Package structure and manufacturing method thereof

Abstract

A package structure including a redistribution structure, a die, at least one connecting module, a first insulating encapsulant, a chip stack, and a second insulating encapsulant. The die is disposed on and electrically connected to the redistribution structure. The connecting module is disposed on the redistribution structure. The connecting module includes a protection layer and a plurality of conductive bars embedded in the protection layer. The first insulating encapsulant encapsulates the die and the connecting module. The chip stack is disposed on the first insulating encapsulant and the die. The chip stack is electrically connected to the connecting module. The second insulating encapsulant encapsulates the chip stack.

What is claimed is: 
     
         1 . A package structure, comprising:
 a redistribution structure;   a die disposed on the redistribution structure and electrically connected to the redistribution structure;   at least one connecting module disposed on the redistribution structure, wherein the connecting modules comprises a protection layer and a plurality of conductive bars embedded in the protection layer;   a first insulating encapsulant encapsulating the die and the connecting module;   a chip stack disposed on the first insulating encapsulant and the die and electrically connected to the connecting module; and   a second insulating encapsulant encapsulating the chip stack.   
     
     
         2 . The package structure according to  claim 1 , further comprising a plurality of conductive terminals disposed on the redistribution structure opposite to the die and the connecting module. 
     
     
         3 . The package structure according to  claim 1 , wherein the die has an active surface and a rear surface opposite to the active surface, the die comprises a plurality of conductive connectors located on the active surface, and the conductive connectors are directly in contact with the redistribution structure. 
     
     
         4 . The package structure according to  claim 3 , further comprising an adhesive layer sandwiched between the rear surface of the die and the chip stack. 
     
     
         5 . The package structure according to  claim 1 , wherein a material of the protection layer is different from a material of the first insulating encapsulant. 
     
     
         6 . The package structure according to  claim 1 , further comprising a plurality of conductive wires embedded in the second insulating encapsulant, wherein the chip stack is electrically connected to the connecting module through the conductive wires. 
     
     
         7 . The package structure according to  claim 1 , wherein the connecting module further comprises a plurality of conductive caps correspondingly disposed on the conductive bars, and the protection layer exposes at least a portion of each conductive cap. 
     
     
         8 . The package structure according to  claim 7 , wherein a material of the conductive caps comprises gold. 
     
     
         9 . The package structure according to  claim 7 , wherein a material of the conductive bars is different from a material of the conductive caps. 
     
     
         10 . The package structure according to  claim 7 , wherein surfaces of the conductive caps, a surface of the protection layer, and a surface of the first insulating encapsulant are substantially coplanar. 
     
     
         11 . A manufacturing method of a package structure, comprising:
 providing a carrier;   disposing a plurality of dies and a plurality of connecting modules on the carrier, wherein each of the connecting modules comprises a protection layer and a plurality of conductive bars embedded in the protection layer;   forming a first insulating encapsulant on the carrier to encapsulate the dies and the connecting modules;   forming a redistribution structure over the dies, the connecting modules, and the first insulating encapsulant;   removing the carrier from the dies, the connecting modules, and the first insulating encapsulant;   disposing a chip stack on the dies and the first insulating encapsulant opposite to the redistribution structure, wherein the chip stack is electrically connected to the connecting modules; and   encapsulating the chip stack by a second insulating encapsulant.   
     
     
         12 . The method according to  claim 11 , further comprising foiniing a plurality of conductive terminals on the redistribution structure opposite to the dies and the connecting modules. 
     
     
         13 . The method according to  claim 11 , further comprising forming a plurality of conductive wires embedded in the second insulating encapsulant, wherein the chip stack is electrically connected to the connecting modules through the conductive wires. 
     
     
         14 . The method according to  claim 11 , further comprising performing a singulation process. 
     
     
         15 . The method according to  claim 11 , wherein a material of the protection layer is different from a material of the first insulating encapsulant. 
     
     
         16 . The method according to  claim 11 , wherein the connecting modules are disposed on the carrier through a picked-and-placed process. 
     
     
         17 . The method according to  claim 11 , wherein each connecting module further comprises a plurality of conductive caps correspondingly disposed on the conductive bars, and the protection layer exposes at least a portion of each conductive cap. 
     
     
         18 . The method according to  claim 17 , wherein the connecting modules are disposed on the carrier such that the conductive caps face the carrier. 
     
     
         19 . The method according to  claim 17 , wherein a material of the conductive caps comprises gold. 
     
     
         20 . The method according to  claim 11 , wherein the die has an active surface and a rear surface opposite to the active surface, the die comprises a plurality of conductive connectors located on the active surface, and the step of forming the first insulating encapsulant comprises:
 forming an insulating material over the carrier to cover the dies and the connecting modules; and   removing a portion of the insulating material to expose the conductive connectors of the dies and the conductive bars of the connecting modules.