Copper alloy wire and manufacturing method thereof
Abstract
A copper alloy wire and a manufacturing method thereof are provided. The copper alloy wire includes: by weight percentage of components, 0.3 to 0.45 of silver (Ag), 0.01 to 0.02 of titanium, and a remaining part that is formed by copper and unavoidable impurities. The method for manufacturing the copper alloy wire is performing two-phase vacuum melting: first performing vacuum electric arc melting into a copper-titanium mother alloy, and then performing vacuum induction melting with remaining components into a copper alloy wire material by means of continuous casting; then drawing the copper alloy wire material into a copper alloy fine wire by a non-slip wire drawing device in a material even-flow wire drawing manner, and finally performing thermal treatment on the copper alloy fine wire by using argon as a protection gas, so as to complete a process of the copper alloy wire.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A method for manufacturing a copper alloy wire, comprising:
performing a vacuum melting step: melting titanium, silver, and copper into a molten copper alloy; performing a continuous casting step: manufacturing the molten copper alloy into a copper alloy wire material; performing a wire drawing step: drawing the copper alloy wire material into a copper alloy fine wire; and performing a thermal treatment step: performing thermal treatment on the copper alloy fine wire under a condition that an annealing temperature is ranged from 580° C. to 700° C.
2 . The method for manufacturing a copper alloy wire according to claim 1 , wherein the copper alloy wire comprises: by weight percentage of the copper alloy wire, 0.3 to 0.45 of silver, 0.01 to 0.02 of titanium, and a remaining part that is formed by copper and unavoidable impurities.
3 . The method for manufacturing a copper alloy wire according to claim 1 , wherein in the vacuum melting step, two-phase melting is performed in a vacuum manner and comprises steps of: first melting a total share of titanium and a partial share of copper into a copper-titanium mother alloy by means of electric arc melting, and then melting the copper-titanium mother alloy with a total share of silver and a remaining share of copper together into the molten copper alloy by means of induction melting.
4 . The method for manufacturing a copper alloy wire according to claim 3 , wherein the partial share of copper uses copper with a purity greater than 4N.
5 . The method for manufacturing a copper alloy wire according to claim 3 , wherein the remaining share of copper uses copper with a purity greater than 4N.
6 . The method for manufacturing a copper alloy wire according to claim 1 , wherein a wire diameter of the copper alloy wire material ranges between 4 mm and 8 mm.
7 . The method for manufacturing a copper alloy wire according to claim 1 , wherein a wire diameter of the copper alloy fine wire ranges between 10 μm and 20 μm.
8 . The method for manufacturing a copper alloy wire according to claim 1 , wherein the copper alloy wire material is drawn into the copper alloy fine wire by a wire drawing device.
9 . The method for manufacturing a copper alloy wire according to claim 8 , wherein the wire drawing device comprises a non-slip wire drawing device.
10 . The method for manufacturing a copper alloy wire according to claim 9 , wherein in the wire drawing step, the non-slip wire drawing device comprises a tension control apparatus and an eye mold, and the tension control apparatus is configured to increase a back drawing force of the copper alloy wire material behind the eye mold.
11 . The method for manufacturing a copper alloy wire according to claim 9 , wherein the non-slip wire drawing device performs a wire drawing process on the copper alloy wire material at a speed of 100 to 1000 m/min at room temperature.
12 . The method for manufacturing a copper alloy wire according to claim 8 , wherein coarse drawing, medium drawing and fine drawing of the wire drawing device are performed on the copper alloy wire material into the copper alloy fine wire.
13 . The method for manufacturing a copper alloy wire according to claim 1 , wherein the thermal treatment for annealing time of greater than 0.1 second is performed on the copper alloy fine wire.
14 . The method for manufacturing a copper alloy wire according to claim 1 , wherein a protection gas is used in the thermal treatment process.
15 . The method for manufacturing a copper alloy wire according to claim 14 , wherein argon is used as the protection gas in the thermal treatment process.
16 . The method for manufacturing a copper alloy wire according to claim 1 , wherein the copper alloy wire, only consisting of the following elements:
by weight percentage of components, 0.3 to 0.45 of silver, 0.01 to 0.02 of titanium, and a remaining part that is formed by copper and unavoidable impurities.
17 . A method for manufacturing a copper alloy wire, comprising:
melting titanium, silver, and copper under a vacuum manner into a molten copper alloy; manufacturing the molten copper alloy into a copper alloy wire material; drawing the copper alloy wire material into a copper alloy fine wire; and performing a thermal treatment on the copper alloy fine wire under an annealing temperature.
18 . The method for manufacturing a copper alloy wire according to claim 17 , wherein the annealing temperature is ranged from 580° C. to 700° C.
19 . The method for manufacturing a copper alloy wire according to claim 17 , wherein the step of melting titanium, silver, and copper comprises steps of: first melting a total share of titanium and a partial share of copper into a copper-titanium mother alloy by means of electric arc melting, and then melting the copper-titanium mother alloy with a total share of silver and a remaining share of copper together into the molten copper alloy by means of induction melting.
20 . The method for manufacturing a copper alloy wire according to claim 17 , wherein the copper alloy wire material is drawn into the copper alloy fine wire by a wire drawing device.Join the waitlist — get patent alerts
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