Resin molded substrate and mounting structure for capacitor

Abstract

A resin molded substrate has at least a pair of terminal through holes for allowing lead terminals of a cylindrical capacitor to be inserted through, and at least one protrusion for supporting a side of a bottom portion of the capacitor so as to space from a front surface of the substrate the side of the bottom portion of the capacitor having the lead terminals inserted through the terminal through holes. The pair of lead terminals at the bottom portion are inserted through the terminal through holes of the resin molded substrate, whereby the capacitor is mounted in an upright state with a solder, so that the protrusion spaces the side of the bottom portion from the front surface of the resin molded substrate.

What is claimed is: 
     
         1 . A resin molded substrate for allowing a cylindrical capacitor to be mounted in an upright state with a solder, the capacitor having a pair of lead terminals at a bottom portion, the resin molded substrate comprising:
 at least a pair of terminal through holes for allowing the lead terminals of the capacitor to be inserted through, respectively; and   at least one protrusion for spacing the capacitor from a front surface of the substrate, under being in contact with a side of the bottom portion of the capacitor, the lead terminals of the capacitor being inserted through the terminal through holes.   
     
     
         2 . The resin molded substrate according to  claim 1 , wherein
 the protrusion is disposed so as to be brought into contact with a peripheral portion in the side of the bottom portion of the capacitor.   
     
     
         3 . The resin molded substrate according to  claim 1 , wherein
 the protrusion is disposed between the pair of terminal through holes.   
     
     
         4 . The resin molded substrate according to  claim 1 , wherein
 the protrusion is disposed so as to overlap at least one of the pair of terminal through holes, and   the terminal through hole overlapped by the protrusion penetrates the protrusion.   
     
     
         5 . The resin molded substrate according to  claim 1 , wherein
 the protrusion is an integrally-molded portion integrally molded on the front surface of the substrate.   
     
     
         6 . A mounting structure for a cylindrical capacitor, the mounting structure allowing the capacitor to be mounted in an upright state on a resin molded substrate with a solder, the capacitor having a pair of lead terminals at a bottom portion, wherein
 the resin molded substrate is the resin molded substrate according to  claim 1 , and   the lead terminals are inserted through the terminal through holes of the resin molded substrate, and the side of the bottom portion of the capacitor is brought into contact with the at least one protrusion of the resin molded substrate ( 1 ), so that the capacitor is mounted to be spaced from the front surface of the resin molded substrate.