Metal Component Having Friction-Reducing Surface Coating

Abstract

Various embodiments may include a metallic component comprising: a base metal form with at least one surface; and an organic protective layer applied to at least part of the at least one surface to reduce friction. The organic protective layer is applied by treatment with a carbon-containing precursor by means of an atmospheric pressure plasma.

What is claimed is: 
     
         1 . A metallic component having comprising:
 a base metal form with at least one surface;   an organic protective layer applied to at least part of the at least one surface to reduce friction; and   wherein the organic protective layer is applied by treatment with a carbon-containing precursor by means of an atmospheric pressure plasma.   
     
     
         2 . The component as claimed in  claim 1 , wherein the coated surface has a thermal conductivity in the range from 10 to 150 W/mK. 
     
     
         3 . The component as claimed in  claim 1 , wherein the carbon-containing precursor comprises an unsaturated compound having at least one carbon-carbon multiple bond. 
     
     
         4 . The component as claimed in  claim 1 , wherein the organic protective layer has a thickness of less than 1 μm. 
     
     
         5 . The component as claimed in  claim 1 , wherein the organic protective layer has a thickness of less than 500 nm. 
     
     
         6 . The component as claimed in  claim 1 , wherein the organic protective layer has an absorption in the wavelength range of visible light. 
     
     
         7 . The component as claimed in  claim 1 , wherein the carbon-containing precursor is present in gaseous form at room temperature. 
     
     
         8 . The component as claimed in  claim 1 , wherein the base metal form serves as a counterelectrode for a plasma generation module. 
     
     
         9 . A process for coating surfaces of metallic components, the process comprising:
 coating at least one surface of a base metal body with an organic protective layer with an atmospheric pressure plasma generation module.   
     
     
         10 . The process as claimed in  claim 9 , further comprising at least partially removing the organic protective layer with the atmospheric pressure plasma generation module. 
     
     
         11 . The process as claimed in  claim 9 , further comprising delivering a carbon-containing precursor into the plasma generation module. 
     
     
         12 . The process as claimed in  claim 9 , further comprising using a carbon-containing precursor in gaseous form at room temperature for generating the plasma. 
     
     
         13 . The process as claimed in  claim 9 , further comprising using an organic precursor for plasma formation. 
     
     
         14 . The process as claimed in  claim 9 , further comprising using an organosilicon as a precursor for plasma formation. 
     
     
         15 . The process as claimed in  claim 9 , further comprising using acetylene as a precursor for plasma formation. 
     
     
         16 . The process as claimed in  claim 9 , further comprising using a process gas for removing the organic protective layer. 
     
     
         17 . (canceled)