US2019145015A1PendingUtilityA1

Method for preparing porous copper alloy wick and product prepared by the same

Assignee: DELTA ELECTRONICS JIANGSU LTDPriority: Nov 16, 2017Filed: Apr 18, 2018Published: May 16, 2019
Est. expiryNov 16, 2037(~11.3 yrs left)· nominal 20-yr term from priority
C25D 5/50C25D 5/34C25D 3/38C25D 5/18F28D 15/046C25D 5/16C25D 5/623
40
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Claims

Abstract

The disclosure provides a preparation method of a porous copper alloy wick, including the steps of: a) preparing an electrolyte, which is an aqueous solution including 0.5-1.8 mol/L sulfuric acid and 0.1-0.5 mol/L copper sulfate; b) cleaning with a mixed solution of a surfactant and a basic compound, activating with dilute hydrochloric acid and then cleaning the surface of a copper alloy substrate; c) forming a porous structure on the substrate by electrodeposition on the treated substrate in the electrolyte; and d) washing with water, drying and then sintering the product obtained in step c). By the method of the disclosure, the porous structure with the specific arrangement, excellent capillary force and permeability can be directly obtained on the surface of the substrate, which is good for the transmission of the working liquid.

Claims

exact text as granted — not AI-modified
1 . A method for preparing a porous copper alloy wick, comprising the steps of:
 a) preparing an electrolyte, which is an aqueous solution comprising 0.5-1.8 mol/L sulfuric acid and 0.1-0.5 mol/L copper sulfate;   b) cleaning the surface of a copper alloy substrate with a mixed solution of a surfactant and a basic compound, activating with dilute hydrochloric acid, and then rinsing;   c) forming a porous structure on the substrate by electrodeposition on the treated substrate in the electrolyte; and   d) washing with water, drying, and then sintering the product obtained in step c).   
     
     
         2 . The method for preparing a porous copper alloy wick according to the  claim 1 , wherein the electrodeposition is carried out with a constant current density of 0.5-5 A/cm 2  for 20 seconds-10 minutes. 
     
     
         3 . The method for preparing a porous copper alloy wick according to the  claim 2 , wherein the constant current density is 0.8-1.5A /cm 2 , and the electrodeposition time is 50-90 seconds. 
     
     
         4 . The method for preparing a porous copper alloy wick according to the  claim 1 , wherein the electrodeposition is carried out by the increasing current density, the initial current density is 0.01-0.1 A/cm 2 , the current density increasing speed is 0.001-0.05 A/cm 2 ·s, and the deposition time is 10 seconds-10 minutes. 
     
     
         5 . The method for preparing a porous copper alloy wick according to the  claim 1 , wherein the electrodeposition is carried out by the decreasing current density, the initial current density is 0.5-5 A/cm 2 , the current density decreasing speed is 0.001-0.05 A/cm 2 ·s, and the deposition time is 10 seconds-10 minutes. 
     
     
         6 . The method for preparing a porous copper alloy wick according to the  claim 1 , wherein the substrate is brass, tin brass, lead brass, aluminum brass, nickel brass or iron brass. 
     
     
         7 . The method for preparing a porous copper alloy wick according to the  claim 1 , wherein the sintering is carried out in a protective atmosphere, a reducing atmosphere or a vacuum atmosphere at a temperature of 450 to 750° C. 
     
     
         8 . The method for preparing a porous copper alloy wick according to the  claim 7 , wherein the protective atmosphere is at least one selected from nitrogen and argon and the reducing atmosphere is a mixture of nitrogen and hydrogen. 
     
     
         9 . A porous copper alloy wick, being prepared by the method according to  claim 1 .

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