Printed wiring board and method for manufacturing printed wiring board

Abstract

A printed wiring board includes a support plate, a laminate formed on the support plate and including first conductor pads on a first surface side of the laminate and second conductor pads on a second surface side of the laminate, and a solder resist layer interposed between the support plate and the laminate and having openings formed such that the openings are exposing the first conductor pads respectively. The laminate includes a resin insulating layer and has a first surface on the first surface side and a second surface on the second surface side on the opposite side with respect to the first surface of the laminate, the second conductor pads are embedded in the second surface of the laminate such that the second conductor pads have surfaces recessed from the second surface of the laminate respectively.

1 . A printed wiring board, comprising:
 a support plate;   a laminate formed on the support plate and comprising a plurality of first conductor pads on a first surface side of the laminate and a plurality of second conductor pads on a second surface side of the laminate; and   a solder resist layer interposed between the support plate and the laminate and having a plurality of openings formed such that the openings are exposing the first conductor pads respectively,   wherein the laminate includes a resin insulating layer and has a first surface on the first surface side and a second surface on the second surface side on an apposite side with respect to the first surface of the laminate, and the plurality of second conductor pads is embedded in the second surface of the laminate such that the second conductor pads have surfaces recessed from the second surface of the laminate respectively.   
     
     
         2 . A printed wiring board according to  claim 1 , wherein the laminate includes a via conductor structure penetrating from the first surface to the second surface of the laminate such that the via conductor structure comprises at least one via conductor formed in the resin insulating layer and tapering from the first surface side toward the second surface side of the laminate. 
     
     
         3 . A printed wiring board according to  claim 1 , wherein the plurality of second conductor pads is formed such that the surfaces of the second conductor pads have a depth in a range of 3 μm or more to less than 10 μm from the second surface of the laminate. 
     
     
         4 . A printed wiring board according to  claim 1 , wherein the plurality of first conductor pads is formed on the first surface of the laminate. 
     
     
         5 . A printed wiring board according to  claim 1 , wherein the second surface of the laminate is not covered with a solder resist layer. 
     
     
         6 . A printed wiring board according to  claim 1 , further comprising:
 an electronic component connected to the plurality of second conductor pads such that the electronic component is mounted on the second surface side of the laminate.