Wireless communication device, method for manufacturing same, seal fitted with rfic element, and method for producing same

Abstract

In a wireless communication device, radiation conductors including a first and second end portions are reformed on an upper surface of a radiation conductor base material. First and second terminal electrodes are provided at a same or substantially the same interval as the first and second end portions, on a lower surface of a RFIC element. A seal includes an adhesive surface larger than a principal surface of the RFIC element. The RFIC element is arranged on the upper surface of the radiation conductor substrate so that each of the first and second terminal electrodes comes into contact with the first and second end portions. The seal is pasted to the radiation conductor substrate so as to cover the RFIC element.

What is claimed is: 
     
         1 . A wireless communication device comprising:
 a radiation conductor base material including a radiation conductor and including a principal surface on which the radiation conductor is provided; and   a radio frequency integrated circuit (RFIC) element including a principal surface on which a terminal electrode is provided; wherein   the RFIC element is affixed to the principal surface of the radiation conductor base material with an adhesive material such that the terminal electrode faces the radiation conductor; and   the radiation conductor entirely overlaps with the terminal electrode in a planar view of the radiation conductor base material.   
     
     
         2 . The wireless communication device according to  claim 1 , wherein the RFIC element includes a flexible base material, the terminal electrode and an RFIC chip are mounted on the flexible base material, and the RFIC ship and the terminal electrode do not overlap with each other in the planar view. 
     
     
         3 . The wireless communication device according to  claim 2 , wherein the terminal electrode projects from a surface of the flexible base material. 
     
     
         4 . The wireless communication device according to  claim 1 , wherein
 the RFIC element includes an RFIC chip that processes a high-frequency signal, a power feeding circuit including a resonance frequency corresponding to a communication frequency, and a substrate including the RFIC chip mounted thereon and the power feeding circuit built therein; and   the terminal electrode is provided on a principal surface of the substrate and connected through the power feeding circuit to the RFIC chip.