Cooling and ventilation device, cooling hat, cooling shoes, and cooling backpack

Abstract

A cooling and ventilation device ( 10 ), a cooling hat ( 20 ), a cooling shoe and a cooling backpack. The cooling and ventilation device ( 10 ) comprises: a housing ( 100 ), a ventilation assembly ( 200 ), a heat conduction frame ( 300 ) and a cooling assembly ( 400 ). Two ends of the housing ( 100 ) are respectively provided with an air inlet ( 110 ) and an air outlet ( 120 ). The ventilation assembly ( 200 ) is arranged at the position of the air inlet ( 110 ), and is used for bringing air into the housing ( 100 ). The heat conduction frame ( 300 ) is arranged within the housing ( 100 ). The cooling assembly ( 400 ) comprises semiconductor cooling plates ( 410 ) and heat conduction film layers ( 420 ), the semiconductor cooling plates ( 410 ) being arranged on the heat conduction frame ( 300 ), the heat conduction film layers ( 420 ) being attached to the side surfaces of the semiconductor cooling plates ( 410 ) away from the heat conduction frame ( 300 ). When the semiconductor cooling plates ( 410 ) are turned on, the sides of the semiconductor cooling plates ( 410 ) connected to the heat conduction film layers ( 420 ) are cooling ends, and heat in the air entering from the external environment can be absorbed by the heat conduction frame ( 300 ) in a rapid and timely manner. Thus, a cooling operation is performed on the air entering from the external environment in a rapid and timely manner, thereby ensuring that an airflow discharged from the air outlet ( 120 ) is a cold airflow.

1 . A cooling and ventilation device, characterized by comprising:
 an outer housing, with an air inlet and an air outlet being defined at two ends of the outer housing, respectively;   a ventilation component, the ventilation component being provided at a position of the air inlet, for blowing air into the outer housing;   a thermally conductive rack, the thermally conductive rack being provided inside the outer housing; and   a cooling component, the cooling component comprising a semiconductor cooling sheet and a thermally conductive film, the semiconductor cooling sheet being provided on the thermally conductive rack, and the thermally conductive film being attached onto a side face of the semiconductor cooling sheet away from the thermally conductive rack.   
     
     
         2 . The cooling and ventilation device according to  claim 1 , characterized in that the cooling and ventilation device further comprises a circuit module, an installation cavity is defined between the thermally conductive rack and an inside wall of the outer housing, the circuit module is received inside the installation cavity, and the circuit module is in electrical connection to the ventilation component and the semiconductor cooling sheet, respectively. 
     
     
         3 . The cooling and ventilation device according to  claim 1 , characterized in that the ventilation component comprises a motor and fan blades, the fan blades are provided at a position of the air inlet, and the motor is connected to the fan blades for driving the fan blades to rotate. 
     
     
         4 . The cooling and ventilation device according to  claim 1 , characterized in that the cooling and ventilation device further comprises an installation base, and the outer housing is provided on the installation base. 
     
     
         5 . The cooling and ventilation device according to  claim 4 , characterized in that the cooling and ventilation device further comprises a circuit module, the circuit module is received in the installation base, and the circuit module is in electrical connection to the ventilation component and the semiconductor cooling sheet, respectively. 
     
     
         6 . The cooling and ventilation device according to  claim 5 , characterized in that a heat dissipation passage is defined in the installation base, and the heat dissipation passage is in communication with an outside environment and an inside space of the installation base, respectively. 
     
     
         7 . The cooling and ventilation device according to  claim 1 , characterized in that the thermally conductive rack is in a hollow triangular-prism structure, and an outer surface of the thermally conductive rack is provided with three installation faces sequentially connected;
 the cooling and ventilation device is provided with a plurality of the cooling components, the semiconductor cooling sheets of the cooling components are provided on the installation faces in one-to-one correspondence, and the thermally conductive films are attached, in one-to-one correspondence, onto side faces of the semiconductor cooling sheets away from corresponding thermally conductive racks.   
     
     
         8 . The cooling and ventilation device according to  claim 7 , characterized in that an inside wall of the outer housing is provided a clamping rail, the thermally conductive rack is provided with a clamping position at a connection point between two neighboring ones of the installation faces, and the clamping rail is embedded inside the clamping position in a sliding manner. 
     
     
         9 . The cooling and ventilation device according to  claim 7 , characterized in that the thermally conductive rack is provided therein with a plurality of thermally conductive fins, and the thermally conductive fins are provided at intervals. 
     
     
         10 . The cooling and ventilation device according to  claim 1 , characterized in that the thermally conductive film is a nano-graphite sheet or a nano-graphene sheet. 
     
     
         11 . The cooling and ventilation device according to  claim 1 , characterized in that a thermal conductivity coefficient of the thermally conductive film is greater than 400 W(m·K). 
     
     
         12 . The cooling and ventilation device according to  claim 1 , characterized in that the outer housing has a cross section in a ring-shape structure, and the ring-shape structure has an inner diameter of 8 cm˜10 cm;
 the outer housing is in an ellipsoid-shape structure, and the outer housing has a length of 10 cm˜13 cm; 
 the thermally conductive film has a cross section in a rectangular shape, and the rectangular shape has a length of 8 cm˜10 cm, and a width of 5 cm˜8 cm; 
 the semiconductor cooling sheet has a cross section in a square shape, and the square shape has a length of 4 cm˜6 cm. 
 
     
     
         13 . The cooling and ventilation device according to  claim 1 , characterized in that the air inlet has an area greater than that of the air outlet, an inside wall of the outer housing is in an arc-shape structure, an enhancement air passage is defined between the inside wall of the outer housing and the thermally conductive film, and the enhancement air passage is in communication with the air inlet and the air outlet, respectively. 
     
     
         14 . A cooling hat, characterized by comprising:
 a hat body, and   a cooling component, the cooling component comprising a semiconductor cooling sheet and a thermally conductive film, the semiconductor cooling sheet being provided on an inside wall of the hat body, and the thermally conductive film being attached onto a side face of the semiconductor cooling sheet away from the inside wall of the hat body.   
     
     
         15 . The cooling hat according to  claim 14 , characterized in that the hat body comprises a hat shell and an inner cloth layer, the semiconductor cooling sheet is provided on an inside wall of the hat shell, the thermally conductive film is attached onto a side face of the semiconductor cooling sheet away from the inside wall of the hat shell, and the inner cloth layer is attached onto a side face of the thermally conductive film away from the semiconductor cooling sheet. 
     
     
         16 . The cooling hat according to  claim 14 , characterized in that a plurality of micro ventilation holes are defined on the hat shell, and all of the micro ventilation holes communicate with an outside environment and a side face of the semiconductor cooling sheet away from the thermally conductive film, respectively. 
     
     
         17 . The cooling hat according to  claim 14 , characterized in that the cooling hat further comprises a solar cell module and a brim, the brim is clamped onto the hat body, the solar cell module is provided on the brim, and the solar cell module is in electrical connection to the semiconductor cooling sheet; the cooling hat further comprises a circuit module, an installation area is provided on the hat body, the circuit module is installed on the installation area, and the circuit module is in electrical connection to the semiconductor cooling sheet. 
     
     
         18 . (canceled) 
     
     
         19 . The cooling hat according to  claim 18 , characterized in that the cooling hat further comprises a push switch, the push switch is provided on the hat body, the push switch is in electrical connection to the circuit module and the semiconductor cooling sheet, respectively, for controlling connection or disconnection of the semiconductor cooling sheet to or from the circuit module. 
     
     
         20 . The cooling hat according to  claim 14 , characterized in that the cooling hat further comprises a metal support sheet, the metal support sheet is in an arc-shape structure, the metal support sheet is provided on the hat body, and a surface of the metal support sheet is provided with a nano-silver coating. 
     
     
         21 . The cooling hat according to  claim 14 , characterized in that the cooling hat further comprises a miniature fan, and the miniature fan is provided on the hat body, for blowing out air inside the hat body to an external environment; the thermally conductive film is provided with an air change passage, and the air change passage is used to introduce air in the external environment into the hat body. 
     
     
         22 - 24 . (canceled)