Led lamp

Abstract

An LED lamp A includes a plurality of LED modules 2 each including an LED chip 21 , and a support member 1 including a support surface 1 a on which the LED modules 2 are mounted. The LED modules 2 include a plurality of kinds of LED modules, or a first through a third LED modules 2 A, 2 B and 2 C different from each other in directivity characteristics that represent light intensity distribution with respect to light emission directions. This arrangement ensures that the entire surrounding area can be illuminated with sufficient brightness.

1 - 20 . (canceled) 
     
     
         21 . An LED lamp comprising:
 an elongated case that is circular in a cross section perpendicular to a longitudinal direction of the case;   a plurality of LED modules disposed within the case; and   a support member that supports the plurality of LED modules,   wherein the case comprises an inner surface formed with a pair of protrusions each protruding toward the other,   the support member is held in contact with the pair of protrusions, and a part of the support member comprises an arcuate periphery extending along the inner surface of the case in the cross section.   
     
     
         22 . The LED lamp according to  claim 21 , wherein an entirety of the support member is disposed offset from a center of the case in the cross section. 
     
     
         23 . The LED lamp according to  claim 21 , wherein the support member comprises a supporting substrate and a heat dissipator, the supporting substrate comprising a first surface on which the plurality of LED modules are mounted and a second surface held in contact with the heat dissipator. 
     
     
         24 . The LED lamp according to  claim 23 , wherein the heat dissipator forms the arcuate periphery. 
     
     
         25 . The LED lamp according to  claim 23 , wherein the pair of protrusions come into contact with one of the first surface or the second surface of the supporting substrate. 
     
     
         26 . The LED lamp according to  claim 23 , wherein a distance between the inner surface of the case and the first surface of the supporting substrate is greater than a distance between the inner surface of the case and the second surface of the supporting substrate. 
     
     
         27 . The LED lamp according to  claim 23 , wherein the supporting substrate is made of a resin, and the heat dissipator is made of a metal. 
     
     
         28 . The LED lamp according to  claim 21 , wherein the plurality of LED modules includes an LED module of a first type that comprises: a first LED chip: a first substrate supporting the first LED chip; a first lead and a second lead each disposed on the first substrate and electrically connected to the first LED chip; and a first frame disposed on the first substrate and encircling the first LED chip. 
     
     
         29 . The LED lamp according to  claim 28 , wherein the first substrate comprises a first surface on which the first LED chip is disposed and a second surface opposite to the first surface, and each of the first lead and the second lead extends from the first surface of the first substrate onto the second surface of the first substrate. 
     
     
         30 . The LED lamp according to  claim 29 , further comprising a wire, wherein the first LED chip is mounted on the first lead, and the wire connects the first LED chip to the second lead. 
     
     
         31 . The LED lamp according to  claim 30 , wherein the second surface of the first substrate is formed with a separate layer disposed between the first lead and the second lead, the separate layer having a first edge facing the first lead and a second edge facing the second lead, the first edge being longer than the second edge. 
     
     
         32 . The LED lamp according to  claim 28 , wherein the plurality of LED module includes an LED module of a second type that comprises: a second LED chip; a second substrate supporting the second LED chip; a third lead and a fourth lead each disposed on the second substrate and electrically connected to the second LED chip; and a sealing resin covering the second LED chip. 
     
     
         33 . The LED lamp according to  claim 32 , wherein the second substrate comprises a first surface on which the second LED chip is mounted, a second surface opposite to the first surface, and a first and a second side surfaces spaced apart from each other in a longitudinal direction of the second substrate, and each of the third lead and the fourth lead extends from the first surface of the second substrate and at least onto one of the first and the second side surfaces. 
     
     
         34 . The LED lamp according to  claim 33 ; wherein each of the third lead and the fourth lead further extends onto the second surface of the second substrate. 
     
     
         35 . The LED lamp according to  claim 33 , wherein the second substrate comprises a third side surface extending between the first and the second side surfaces, and each of the third lead and the fourth lead comprises a portion extending on the third side surface. 
     
     
         36 . The LED lamp according to  claim 35 , further comprising a second frame disposed on the second substrate and encircling the second LED chip and the sealing resin, wherein the second frame comprises a side surface that is flush with said portion extending on the third side surface. 
     
     
         37 . The LED lamp according to  claim 32 , wherein the plurality of LED modules includes an LED module of a third type that comprises: a third LED chip; a third substrate including a first surface on which the third LED chip is mounted and a second surface opposite to the first surface; a fifth lead and a sixth lead each disposed on the third substrate and electrically connected to the third LED chip; and a sealing resin covering the third LED chip,
 the sealing resin is greater in size measured in a first direction perpendicular to the first surface of the third substrate than the third substrate.   
     
     
         38 . The LED lamp according to  claim 37 , wherein each of the fifth lead and the sixth lead comprises a portion that is disposed on the first surface of the third substrate and exposed from the sealing resin. 
     
     
         39 . The LED lamp according to  claim 37 , wherein the third substrate comprises a pair of sides surfaces spaced apart from each other in a second direction perpendicular to the first direction, and the pair of side surfaces are formed with recesses, respectively, wherein each of the fifth lead and the sixth lead extends from the first surface of the third substrate, via one of the recesses and onto the second surface of the third substrate. 
     
     
         40 . The LED lamp according to  claim 39 , wherein each of the recesses is open in the first direction at the first surface and the second surface of the third substrate.