Pressure-sensing intravascular devices, systems, and methods

Abstract

Intravascular devices, systems, and methods are disclosed. In some embodiments, the intravascular devices include at least one pressure sensing component within a distal portion of the device. In that regard, one or more electrical, electronic, optical, and/or electro-optical pressure-sensing components is secured to an elongated substrate such that the pressure-sensing component is mounted perpendicular to a central longitudinal axis of the device. In some implementations, the elongated substrate has a cylindrical profile. Methods of making, assembling, and/or using such intravascular devices and associated systems are also provided.

What is claimed is: 
     
         1 . A system, comprising:
 a sensing guidewire, comprising:
 a flexible elongate member configured to be positioned within a blood vessel of a patient, the flexible elongate member comprising a proximal portion and a distal portion; 
 a core wire disposed within the flexible elongate member; 
 a first electrical conductor extending along a length of the flexible elongate member from the proximal portion to the distal portion; and 
 a sensor assembly disposed at the distal portion of the flexible elongate member, wherein the sensor assembly comprises:
 a semiconductor substrate comprising a different, second electrical conductor in communication with the first electrical conductor; and 
 a physiological sensor disposed on a surface of the semiconductor substrate, wherein the physiological sensor comprises at least one of a pressure sensor or a flow sensor, wherein the physiological sensor is in communication with the first electrical conductor via the second electrical conductor. 
 
   
     
     
         2 . The system of  claim 1 , wherein the sensor assembly further comprises at least one of an application specific integrated circuit (ASIC), a signal conditioning circuit, an RF communication module, or a memory module. 
     
     
         3 . The system of  claim 1 , wherein semiconductor substrate comprises an elongated cylinder. 
     
     
         4 . The system of  claim 3 , wherein physiological sensor is disposed a distal end surface of the elongated cylinder. 
     
     
         5 . The system of  claim 3 , wherein the first electrical conductor and the second electrical conductor are coupled at a proximal end surface of the elongated cylinder. 
     
     
         6 . The system of  claim 3 , wherein the second electrical conductor extends longitudinally from a distal end surface to a proximal end surface of the elongated cylinder. 
     
     
         7 . The system of  claim 1 , wherein physiological sensor is a disposed on a forward-facing surface of the semiconductor substrate. 
     
     
         8 . The system of  claim 1 , wherein the semiconductor substrate comprises at least one of silicon, germanium, a silicon-germanium alloy, silica, quartz, sapphire, a ceramic material, or a plastic material. 
     
     
         9 . The system of  claim 1 , wherein the semiconductor substrate is bonded to at least one of the flexible elongate member or the core wire using an adhesive. 
     
     
         10 . The system of  claim 1 , wherein the flexible elongate member comprises a hole configured to expose the physiological sensor to blood within the blood vessel. 
     
     
         11 . The system of  claim 1 , further comprising:
 a control console in communication with the sensing guidewire.   
     
     
         12 . The system of  claim 11 , further comprising:
 an interface device communicatively disposed between the control console and the sensing guidewire, wherein the interface device configured to provide power to the physiological sensor and process a signal from the physiological sensor.   
     
     
         13 . The system of  claim 12 , wherein the interface device comprises an analog to digital converting circuit configured to provide a digital signal to the control console. 
     
     
         14 . The system of  claim 11 , wherein the control console is configured to output a visual representation of data obtained by the physiological sensor. 
     
     
         15 . The system of  claim 1 , wherein the physiological sensor comprises a micro-electromechanical system (MEMS) sensor. 
     
     
         16 . The system of  claim 1 , wherein the physiological sensor comprises an ultrasound transducer. 
     
     
         17 . The system of  claim 1 , wherein the physiological sensor is flip-chip bonded to the surface of the semiconductor substrate.