Substrate treatment apparatus

Abstract

A substrate processing apparatus has a table on which a polishing surface for polishing a substrate is provided, and a discharge suction section which has a discharge port which communicates with a fluid supply source and through which a fluid is discharged to the polishing surface and a suction opening which communicates with a vacuum source and through which the fluid existing on the polishing surface is sucked.

1 . A substrate processing apparatus comprising:
 a table on which a polishing surface for polishing a substrate is provided; and   a discharge suction section which includes a discharge port which communicates with a fluid supply source and through which a fluid is discharged to the polishing surface and a suction opening which communicates with a vacuum source and through which the fluid existing on the polishing surface is sucked.   
     
     
         2 . The substrate processing apparatus according to  claim 1 , wherein
 a gas is discharged from the discharge port, and a liquid on the polishing surface is vibrated or disturbed.   
     
     
         3 . The substrate processing apparatus according to  claim 1 , wherein
 the table is rotatable,   the discharge port is disposed on a downstream side of the suction opening in a rotation direction of the table, and   a liquid is supplied from the discharge port.   
     
     
         4 . The substrate processing apparatus according to  claim 3 , wherein
 the liquid discharged from the discharge port is a processing solution for processing a substrate.   
     
     
         5 . The substrate processing apparatus according to  claim 1 , wherein
 the table is rotatable,   the discharge port is disposed on an upstream side of the suction opening in a rotation direction of the table, and   a liquid is supplied from the discharge port.   
     
     
         6 . The substrate processing apparatus according to  claim 1 , wherein
 a flow path leading to the discharge port is inclined in a direction opposite to a direction of the suction opening.   
     
     
         7 . The substrate processing apparatus according to  claim 1 , wherein
 a distance between the discharge port and the suction opening is equal to or more than a lower limit distance within which a range of a thin liquid film on the polishing surface can be expanded by a fluid flow supplied from the discharge port.   
     
     
         8 . The substrate processing apparatus according to  claim 1 , wherein
 a flow path leading to the discharge port is inclined in a direction of the suction opening.   
     
     
         9 . The substrate processing apparatus according to  claim 1 , wherein
 a distance between the discharge port and the suction opening is equal to or less than an upper limit distance at which the polishing surface is hit by the fluid discharged from the discharge port to cause the dust and/or debris to float and then the floated dust and/or debris can be sucked from the suction opening.   
     
     
         10 . The substrate processing apparatus according to  claim 1 , wherein
 the discharge port and the suction opening are positioned on an approximately identical plane.   
     
     
         11 . The substrate processing apparatus according to  claim 1 , wherein
 a plurality of the discharge ports are disposed in a radial direction of the table.   
     
     
         12 . The substrate processing apparatus according to  claim 1 , further comprising:
 a polishing liquid supply section which supplies a polishing liquid to the polishing surface; and   a substrate holding section which holds the substrate, wherein   the discharge suction section is disposed on a downstream side of a polishing liquid supply nozzle in the rotation direction of the table and is disposed on an upstream side of the substrate holding section in the rotation direction of the table.   
     
     
         13 . The substrate processing apparatus according to  claim 1 , further comprising:
 a dresser for performing dressing of the polishing surface; and   a polishing liquid supply section which supplies a polishing liquid to the polishing surface, wherein   the discharge suction section is disposed on a downstream side of the dresser in the rotation direction of the table and is disposed on an upstream side of the polishing liquid supply section in the rotation direction of the table.   
     
     
         14 . The substrate processing apparatus according to  claim 1 , further comprising:
 a substrate holding section which holds the substrate; and   a dresser for performing dressing of the polishing surface, wherein   the discharge suction section is disposed on a downstream side of the substrate holding section in the rotation direction of the table and is disposed on an upstream side of the dresser in the rotation direction of the table.