Projection exposure apparatus for semiconductor lithography including an actuator system

Abstract

The disclosure relates to a projection exposure apparatus for semiconductor lithography which includes an actuator system to mechanically actuate a component of the projection exposure apparatus. The actuator system has at least one mechanism to reduce and/or dampen the heat input into the component that is due to heat arising during the operation of the actuator system.

2 .- 21 . (canceled) 
     
     
         22 . Projection exposure apparatus for semiconductor lithography, comprising at least one optical element, an actuator system for the mechanical actuation of the at least one optical element which comprises an outer mount, wherein the actuator system comprises a heat transport element for reducing a heat input into the at least one optical element, the heat input generated by heat arising during the operation of the actuator system in heated regions of the actuator system, wherein the heated regions of the actuator system are arranged on the outer mount of an optical element and are in thermal contact with the heat transport element, and wherein the heat transport element is led toward the outside through the objective housing. 
     
     
         23 . Projection exposure apparatus according to  claim 22 , characterized in that the heat transport element has a thermal conductivity of more or equal than 400 W/(m*K). 
     
     
         24 . Projection exposure apparatus according to  claim 23 , characterized in that the heat transport element is provided with a cooling body at its side remote from the heated regions of the actuator system. 
     
     
         25 . Projection exposure apparatus according to  claim 23 , characterized in that the heat transport element is embodied as a thermally conductive strip. 
     
     
         26 . Projection exposure apparatus according to  claim 22 , characterized in that the actuator system is embodied as a damping system. 
     
     
         27 . Projection exposure apparatus according to  claim 22 , characterized in that the actuator system comprises elements selected from the group consisting of piezocrawler, piezo actuator, plunger-type coil and eddy current brake. 
     
     
         28 . Projection exposure apparatus according to  claim 26 , characterized in that the optical element is arranged in a projection objective, and in that the damping system is embodied as a counter-vibrating mass with damper, said mass being arranged on the exterior of the objective housing. 
     
     
         29 . Projection exposure apparatus according to  claim 22 , characterized in that the heated region of the actuator system is in thermal contact with a body having a high specific heat capacity. 
     
     
         30 . Projection exposure apparatus according to  claim 22 , characterized in that a control/regulating unit is present, which can drive the heat transport element for reducing the heat input. 
     
     
         31 . Projection exposure apparatus according to  claim 30 , characterized in that the control/regulating unit is connected to at least one acceleration sensor and is suitable for driving the heat transport element for reducing the heat input on the basis of the parameters determined by the acceleration sensor. 
     
     
         32 . Projection exposure apparatus according to  claim 30 , characterized in that the control/regulating unit is connected to a further control/regulating unit of the projection exposure apparatus or is embodied as part of the latter and is designed in such a way that the heat transport element for reducing the heat input can be driven on the basis of imminent system events. 
     
     
         33 . Projection exposure apparatus according to  claim 22 , characterized in that the actuator system is embodied as a damping system and has a passive and also an active damping element. 
     
     
         34 . Projection exposure apparatus according to  claim 22 , characterized in that the actuator system is arranged in a projection objective of the projection exposure apparatus. 
     
     
         35 . Projection exposure apparatus according to  claim 34 , characterized in that the heat transport element has a thermal conductivity of more or equal than 400 W/(m*K). 
     
     
         36 . Projection exposure apparatus according to  claim 35 , characterized in that the heat transport element is provided with a cooling body at its side remote from the heated regions of the actuator system. 
     
     
         37 . Projection exposure apparatus according to  claim 35 , characterized in that the heat transport element is embodied as a thermally conductive strip. 
     
     
         38 . Projection exposure apparatus according to  claim 34 , characterized in that the actuator system is embodied as a damping system. 
     
     
         39 . Projection exposure apparatus according to  claim 34 , characterized in that the actuator system comprises elements selected from the group consisting of piezocrawler, piezo actuator, plunger-type coil and eddy current brake. 
     
     
         40 . Projection exposure apparatus according to  claim 39 , characterized in that the optical element is arranged in a projection objective, and in that the damping system is embodied as a counter-vibrating mass with damper, said mass being arranged on the exterior of the objective housing. 
     
     
         41 . A projection exposure apparatus, comprising:
 an optical element;   a mount for the optical element;   an actuator system to mechanically actuate the optical element, the actuator system comprising a heat transport element in thermal contact with the mount to transfer heat generated during use of the actuator system away from the actuator system to reduce heat input into the optical element from the actuator system during use of the actuator system; and   a first control/regulating unit to drive the heat transport element to reduce heat input into the optical element,   wherein:
 the optical element comprises an optical element selected from the group consisting of a refractive optical element, a diffractive optical element an a reflective optical element; 
 the heat transport element has a thermal conductivity of at least 400 W/(m*K); and the projection exposure apparatus is a semiconductor microlithography projection exposure apparatus.