Sensor arrangement for a packaging of a medicament

Abstract

The present disclosure relates to a sensor arrangement to monitor at least one ambient parameter, the sensor arrangement may comprise a first layer having a first electrical conductivity, and a second layer having a second electrical conductivity different than the first electrical conductivity, wherein a portion of the second layer is in direct contact with the first layer, and wherein the first layer and the second layer, in an initial configuration, comprise different concentrations of a diffusible component such that the electrical conductivity of the second layer is dependent on the concentration of the diffusible component within the second layer.

We claim: 
     
         1 . A sensor arrangement to monitor at least one ambient parameter, the sensor arrangement comprising:
 at least one of an electric antenna circuit or a processing unit;   a first layer having a first electrical conductivity and having a first initial concentration of a diffusible component when in an initial configuration; and   a second layer having a second initial concentration of the diffusible component different than the first initial concentration of the diffusible component in the first layer when in an initial configuration and having a second electrical conductivity different than the first electrical conductivity, the second electrical conductivity dependent on a current concentration of the diffusible component in the second layer, and at least a portion of the second layer being in direct contact with the first layer.   
     
     
         2 . The sensor arrangement according to  claim 1 , wherein the electric antenna circuit is configured to communicate wirelessly with at least one analysis device. 
     
     
         3 . The sensor arrangement according to  claim 1 , wherein the electric antenna circuit is configured to receive and/or to transmit RF signals. 
     
     
         4 . The sensor arrangement according to  claim 1 , comprising a stack of layers including the first layer and the second layer, wherein the processing unit and the stack of layers are integrated into a single chip. 
     
     
         5 . The sensor arrangement according to  claim 4 , wherein the processing unit, the electric antenna circuit, and the stack of layers are integrated into the single chip. 
     
     
         6 . The sensor arrangement according to  claim 1 , wherein the electric antenna circuit or processing unit, the first layer, and the second layer of the sensor arrangement are integrated into an RFID chip assembly. 
     
     
         7 . The sensor arrangement according to  claim 6 , wherein the RFID chip assembly is configured to extract electrical energy from an externally applied RF field for measurement of the second electrical conductivity of the second layer. 
     
     
         8 . The sensor arrangement according to  claim 6 , wherein the RFID chip assembly is void of an electric power source. 
     
     
         9 . The sensor arrangement according to  claim 1 , further comprising a third layer, at least a portion of the third layer being in direct contact with a surface of the second layer that faces away from the first layer. 
     
     
         10 . The sensor arrangement according to  claim 9 , wherein the first layer and the third layer are electrically connectable to a measurement device to measure the conductivity of the second layer sandwiched between the first layer and the third layer. 
     
     
         11 . The sensor arrangement according to  claim 1 , wherein the at least one ambient parameter is one or more of an ambient temperature, an ambient illumination, an ambient humidity, or a concentration of an ambient gaseous substance. 
     
     
         12 . The sensor arrangement according to  claim 1 , wherein the first layer, the third layer, or both comprise a conducting or semiconducting material provided with a diffusible dopant substance. 
     
     
         13 . The sensor arrangement according to  claim 9 , wherein the first layer, the third layer, or both comprise an organic semiconductor. 
     
     
         14 . The sensor arrangement according to  claim 12 , wherein the diffusible dopant substance comprises a molecular component that exhibits a chemical reaction when exposed to H 2 O. 
     
     
         15 . The sensor arrangement according to  claim 9 , wherein the second layer comprises:
 a first surface having a first surface segment including a first contact portion in direct contact with the first layer; and   a second surface facing away from the first surface, the second surface having a second surface segment including a second contact portion in direct contact with the third layer, the second surface segment having a same area, shape, and orientation as the first surface segment and arranged opposite the first surface segment, the second contact portion having a different area than the third contact portion.   
     
     
         16 . The sensor arrangement according to  claim 9 , wherein each of the first layer and the third layer comprises a plurality of geometrical non-overlapping structures lying in the plane of the respective layer and being separated by a filling material or by a void space. 
     
     
         17 . The sensor arrangement according to  claim 16 , wherein at least one of the plurality of geometrical non-overlapping structures of the first layer traverses at least one of the plurality of geometrical non-overlapping structures of the third layer in a projection parallel to a surface normal of the first layer or the third layer. 
     
     
         18 . The sensor arrangement according to  claim 16 , wherein the plurality of geometrical non-overlapping structures of the first layer has substantially identical geometric shapes and a substantially identical arrangement of the shapes as those of the plurality of geometrically non-overlapping structures of the third layer with the arrangement of the shapes of the plurality of geometrical non-overlapping structures of the first layer being rotated with respect to the arrangement of the plurality of geometrical non-overlapping structures of the third layer by a predefined angle about a rotation axis extending substantially parallel to a surface normal of the first layer or the third layer. 
     
     
         19 . A packaging for at least one item, comprising at least one sensor arrangement according to  claim 1 .