Through-hole forming method, through-hole forming apparatus, and method of manufacturing glass substrate provided with through-hole

Abstract

Disclosed is a through-hole forming method including a process of forming, by condensing and irradiating a laser beam onto an insulation substrate through a lens, a through-hole that passes through the insulation substrate in a thickness direction of the insulation substrate. A medium between the lens and the insulation substrate is air. A converging half angle θ that is calculated from a focal length f of the lens and a beam diameter d of the laser beam that enters the lens by using expression (1) satisfies expression (2): ( d /2)/ f =tan θ  (1), and 0.16≤sin θ≤0.22  (2).

1 - 19 . (canceled) 
     
     
         20 . A glass substrate provided with a through-hole, wherein the through-hole comprises a first opening edge at a first surface of the glass substrate and a second opening edge at a second surface opposite to the first surface of the glass substrate,
 wherein the second opening edge is smaller than the first opening edge, and   wherein at any position of the through-hole in a plate thickness direction, a ratio (Φ 1 /Φ 2 ) between a diameter (Φ 1 ) of the through-hole and a diameter (Φ 2 ) of a circular truncated cone, surfaces of the circular truncated cone comprising the first opening edge and the second opening edge, is greater than or equal to 0.7 and less than or equal to 1.1.   
     
     
         21 . The glass substrate according to  claim 20 , wherein the through-hole has a linearly tapered shape. 
     
     
         22 . The glass substrate according to  claim 20 , wherein the glass substrate with the through-hole is an interposer. 
     
     
         23 . The glass substrate according to  claim 20 , wherein the through-hole is configured for forming a through electrode. 
     
     
         24 . The glass substrate according to  claim 23 , wherein the through electrode is formed by plating. 
     
     
         25 . The glass substrate according to  claim 23 , wherein the through electrode is an electrode formed of an electrically conductive paste. 
     
     
         26 . The glass substrate according to  claim 21 , wherein the glass substrate with the through-hole is an interposer. 
     
     
         27 . The glass substrate according to  claim 21 , wherein the through-hole is configured for forming a through electrode. 
     
     
         28 . The glass substrate according to  claim 22 , wherein the through-hole is configured for forming a through electrode. 
     
     
         29 . The glass substrate according to  claim 26 , wherein the through-hole is configured for forming a through electrode. 
     
     
         30 . The glass substrate according to  claim 27 , wherein the through electrode is formed by plating. 
     
     
         31 . The glass substrate according to  claim 28 , wherein the through electrode is formed by plating. 
     
     
         32 . The glass substrate according to  claim 29 , wherein the through electrode is formed by plating. 
     
     
         33 . The glass substrate according to  claim 27 , wherein the through electrode is an electrode formed of an electrically conductive paste. 
     
     
         34 . The glass substrate according to  claim 28 , wherein the through electrode is an electrode formed of an electrically conductive paste. 
     
     
         35 . The glass substrate according to  claim 29 , wherein the through electrode is an electrode formed of an electrically conductive paste.