Mounting device on a circuit board and method for mounting an object on a circuit board

Abstract

A mounting device and a method for mounting an object on a circuit board are provided. The mounting device has an abutting portion and at least one pin. The mounting method includes disposing multiple the mounting devices on the circuit board, passing pins of each mounting device through multiple plated holes of the circuit board and soldering the pins in the plated holes, making through holes of the object go through the mounting devices, bending the abutting portion to abut an edge of an opening of the through holes of the object, and thereby mounting the object on the circuit board via the multiple mounting devices as well as grounding the object. Since the mounting device is firmly mounted on the circuit board by soldering; it is easy to assembly because the mounting device is soldered by a solder oven.

What is claimed is: 
     
         1 . A mounting device for mounting an object on a circuit board, wherein the object has a through hole and the circuit board has at least one plated hole; the mounting device comprises:
 a penetrating portion configured to pass through the through hole of the object and having two ends;   an abutting portion disposed on one of the ends of the penetrating portion and being capable of abutting an edge of an opening of the through hole of the object; and   a pin portion disposed on the other end, opposite the abutting portion, of the penetrating portion, the pin portion comprising:
 at least one pin configured to pass through the at least one plated hole of the circuit board and be soldered in the at least one plated hole. 
   
     
     
         2 . The mounting device as claimed in  claim 1 , wherein the penetrating portion, the abutting portion, and the pin portion are made of a bent metal strip. 
     
     
         3 . The mounting device as claimed in  claim 1 , wherein the abutting portion is a flat piece and perpendicular to the penetrating portion, and extends and protrudes from a side of the penetrating portion. 
     
     
         4 . The mounting device as claimed in  claim 2 , wherein the abutting portion is a flat piece and perpendicular to the penetrating portion, and extends and protrudes from a side of the penetrating portion. 
     
     
         5 . The mounting device as claimed in  claim 1  further comprising:
 an elastic component sleeved on the penetrating portion, the elastic component having two ends and one of the two ends of the elastic component being capable of pushing the object away from the circuit board. 
 
     
     
         6 . The mounting device as claimed in  claim 4  further comprising:
 an elastic component sleeved on the penetrating portion, the elastic component having two ends and one of the two ends of the elastic component being capable of pushing the object away from the circuit board. 
 
     
     
         7 . The mounting device as claimed in  claim 5 , wherein the pin portion further comprises:
 two support portions formed on a top of the pin portion, extending toward two opposite directions, and abutted by the other end, opposite the object, of the elastic component.   
     
     
         8 . The mounting device as claimed in  claim 6 , wherein the pin portion further comprises:
 two support portions formed on a top of the pin portion, extending toward two opposite directions, and abutted by the other end, opposite the object, of the elastic component.   
     
     
         9 . The mounting device as claimed in  claim 1 , wherein the penetrating portion comprises:
 two surfaces;   a groove recessed on one of the surfaces of the penetrating portion; and   a protrusion protruding outward on the other surface of the penetrating portion;   wherein the groove and the protrusion extend to the pin portion, and the groove and the protrusion correspond to each other in location.   
     
     
         10 . The mounting device as claimed in  claim 8 , wherein the penetrating portion comprises:
 two surfaces;   a groove recessed on one of the surfaces of the penetrating portion; and   a protrusion protruding outward on the other surface of the penetrating portion;   wherein the groove and the protrusion extend to the pin portion, and the groove and the protrusion correspond to each other in location.   
     
     
         11 . The mounting device as claimed in  claim 1 , wherein the pin portion comprises:
 a first extending portion mounted on the penetrating portion and a width of the first extending portion being larger than a width of the penetrating portion;   two second extending portions bent and formed at two respective ends of the first extending portion; wherein the number of the at least one pin of the pin portion is more than one, and two of the at least one pin are individually mounted on the two second extending portions.   
     
     
         12 . The mounting device as claimed in  claim 10 , wherein the pin portion comprises:
 a first extending portion mounted on the penetrating portion and a width of the first extending portion being larger than a width of the penetrating portion; wherein the two support portions are bent and formed at the first extending portion;   two second extending portions bent and respectively formed at two ends of the first extending portion; wherein the number of the at least one pin of the pin portion is more than one, and two of the at least one pin are individually mounted on the two second extending portions.   
     
     
         13 . A mounting method for mounting an object on a circuit board including the following steps:
 mounting at least one mounting device on the circuit board, wherein each of the at least one mounting device comprises a penetrating portion, an abutting portion, and a pin portion, the abutting portion and the pin portion are disposed at two opposite ends of the penetrating portion, and the pin portion comprises at least one pin passing through the at least one plated hole of the circuit board and soldered in the at least one plated hole; and   passing the penetrating portion of the at least one mounting device through a through hole of the object, bending the abutting portion to abut an edge of an opening of the through hole of the object, and thereby mounting the object on the circuit board via the at least one mounting device.   
     
     
         14 . The mounting method as claimed in  claim 13 , wherein the mounting method further comprises: after the at least one mounting device passes through the through hole, bending the abutting portion of the at least one mounting device with a horizontal force till the abutting portion abuts the edge of the opening of the at least one through hole of the object. 
     
     
         15 . The mounting method as claimed in  claim 13 , wherein each of the at least one mounting device comprises an elastic component pushing the object away from the circuit board. 
     
     
         16 . The mounting method as claimed in  claim 14 , wherein each of the at least one mounting device comprises an elastic component pushing the object away from the circuit board. 
     
     
         17 . The mounting method as claimed in  claim 13 , wherein the mounting method further comprises, after the at least one pin of each of the at least one mounting device passes through the at least one plated hole of the circuit board, passing the circuit board through a solder oven with the object to solder the at least one pin in the at least one plated hole. 
     
     
         18 . The mounting method as claimed in  claim 16 , wherein the mounting method further comprises, after the at least one pin of each of the at least one mounting device passes through the at least one plated hole of the circuit board, passing the circuit board through a solder oven with the object to solder the at least one pin in the at least one plated hole.