Circuit board structures for thermal insulation and method of making same

Abstract

Techniques and mechanisms for providing thermal insulation with a circuit board. In an embodiment, a circuit board comprises a metal core and an electrical insulator disposed thereon. A first portion and a second portion each comprise at least five percent of the metal core by volume, wherein a first surface of the first portion is at a first level along a height axis, and a second surface of the second portion is at a second level along the height axis. A difference between the first level and the second level is less than, and at least twenty percent of, an overall thickness of the metal core. In another embodiment, the metal core further comprises a trench portion disposed between the first portion and the second portion, wherein a thickness of the trench portion is less each of the respective thicknesses of the first portion and the second portion.

What is claimed is: 
     
         1 . A method comprising:
 fabricating a circuit board, including:
 forming a first portion of the metal core, wherein a first surface of the first portion is at a first height along a first line of direction; and 
 forming a second portion of the metal core, wherein the first portion and the second portion each comprise at least five percent of the metal core by volume, wherein a second surface of the second portion is at a second height along the first line of direction, wherein a difference between the first height and the second height is less than, and at least twenty percent of, an overall height of the metal core; and 
   depositing an insulator material on the metal core.   
     
     
         2 . The method of  claim 1 , wherein a first periphery of the first portion has a first average thickness along the first line of direction, wherein a second periphery of the second portion has a second average thickness along the first line of direction, wherein the first average thickness is at least two times the second average thickness. 
     
     
         3 . The method of  claim 1 , further comprising forming a trench portion between the first portion and the second portion. 
     
     
         4 . The method of  claim 1 , wherein forming the first portion comprises forming a first recess of the first portion. 
     
     
         5 . The method of  claim 4 , wherein forming the second portion comprises forming a second recess of the second portion. 
     
     
         6 . The method of  claim 5 , wherein the first recess is formed in a first side of the metal core, wherein the second recess is formed in a second side of the metal core, the second side opposite the first side. 
     
     
         7 . The method of  claim 1 , further comprising coupling first circuitry to the circuit board. 
     
     
         8 . The method of  claim 7 , further comprising exchanging a voltage or a signal with the first circuitry. 
     
     
         9 . A system comprising:
 a circuit board including:
 a metal core comprising:
 a first portion comprising at least five percent of the metal core by volume, wherein a first surface of the first portion is at a first height along a first line of direction; and 
 a second portion comprising at least five percent of the metal core by volume, wherein a second surface of the second portion is at a second height along the first line of direction, wherein a difference between the first height and the second height is less than, and at least twenty percent of, an overall thickness of the metal core; and 
 
 an insulator material disposed on the metal core; 
   integrated circuitry coupled to the circuit board, the integrated circuitry to communicate a signal via the circuit board; and   a display device coupled to the integrated circuitry, the display device to display an image based on the signal.   
     
     
         10 . The system of  claim 9 , wherein a first periphery of the first portion has a first average thickness along the first line of direction, wherein a second periphery of the second portion has a second average thickness along the first line of direction, wherein the first average thickness is at least two times the second average thickness. 
     
     
         11 . The system of  claim 9 , the metal core further comprising a trench portion disposed between the first portion and the second portion. 
     
     
         12 . The system of  claim 9 , wherein the first portion forms a first recess.