Method for manufacturing light strip and winding rack for manufacturing the same

Abstract

A method for manufacturing a light strip at least includes: winding a plurality of wires, removing an insulation layer, and attaching and fixing LED chips. The step of winding the wires includes providing a winding rack having a wire fixing portion at both ends of the winding rack, forming the winding rack with a hollow portion along a longitudinal direction, and winding the wires around the winding rack, wherein each of the wires has an insulation layer, and the wires are repeatedly wound across the hollow portion. The step of removing the insulation layer includes removing a part of the insulation layer from each of the wires to expose a core wire therein. The step of attaching and fixing the LED chips is attaching and fixing the LED chips on the core wires of the wires. Accordingly, the LED chips are firmly and electrically connected to the wires.

What is claimed is: 
     
         1 . A method for manufacturing a light strip, comprising:
 winding a plurality of wires: providing a winding rack having a wire fixing portion at both ends of the winding rack, forming a hollow portion at the winding rack along a longitudinal direction, winding the plurality of the wires around the winding rack, wherein each of the wires has an insulation layer, and the wires are repeatedly wound across the hollow portion;   removing the insulation layer: removing a part of the insulation layer from each of the wires along the hollow portion to expose a core wire therein; and   attaching and fixing a plurality of LED chips on the core wires of the wires to have the LED chips firmly and electrically connected to the wires.   
     
     
         2 . The method of  claim 1 , wherein the wire fixing portion includes a concave portion and a winding pin, the concave portion is formed at an end of the winding rack, and the winding pin is fixed in the concave portion, and wherein an end of the wires is fixedly wound to the winding pin. 
     
     
         3 . The method of  claim 1 , wherein the winding rack further has a plurality of anti-slip strips configured around the winding rack to prevent the wires from slipping. 
     
     
         4 . The method of  claim 3 , wherein two of the anti-slip strips are opposite to each other at two sides of the hollow portion of the winding rack and partially exposed on the top surface of the winding rack. 
     
     
         5 . The method of  claim 1 , wherein the removal of the insulation layer is performed by radiating the plurality of the wires along the hollow portion with a laser ray. 
     
     
         6 . The method of  claim 1 , wherein the hollow portion is a partially open groove. 
     
     
         7 . The method of  claim 1 , wherein the attaching and fixing of the plurality of LED chips includes the steps of:
 spreading a conductive material: coating the conductive material on each of the core wires exposed from each of the wires;   attaching the chips: placing the plurality of LED chips on the conductive material; and   fixing the chips in position: fixedly connecting the LED chips on the wires; and   wherein the method of  claim 1  further includes:
 dispensing glue: covering the LED chips in the glue along the hollow portion; 
 solidifying the glue: solidifying the glue; and 
 extracting the light strip: unwinding the plurality of the wires from the winding rack. 
   
     
     
         8 . The method of  claim 7 , wherein the conductive material is a solder paste and in the step of fixing the chips in position, the solder paste is baked along the hollow portion at a predetermined temperature to fixedly connect the LED chips to the wires. 
     
     
         9 . The method of  claim 7 , wherein the conductive material is a solder paste, and the step of spreading the conductive material includes providing a carrier to fix the plurality of the winding racks wound with the wires to the carrier side by side, the carrier having a pair of positioning seats, each positioning seat forming a plurality of insertion concaves, and two ends of each of the winding racks being respectively placed in the insertion concaves to print the conductive material on the wires in a printing manner. 
     
     
         10 . The method of  claim 9 , wherein the attachment of the chips includes obtaining chip placing positions where the insulated layers are removed from the wires by visual determination, and holding and moving the LED chips by a suction head to the chip placing positions. 
     
     
         11 . The method of  claim 1 , wherein the fixing of the chips includes baking the positions where the LED chips are disposed by a hot air device along the hollow portion. 
     
     
         12 . A winding rack for manufacturing a light strip, comprising cross sections that are substantially the same along a longitudinal direction, a top surface, at least one hollow portion along the longitudinal direction, and a plurality of anti-slip strips configured around the winding rack and partially exposed from the top surface. 
     
     
         13 . The winding rack of  claim 12 , wherein the winding rack further comprises a top wire seat movably inserted in the winding rack.