Molded pocket in transaction card construction

Abstract

Methods and apparatuses are provided for manufacturing a transaction card. The disclosed methods and apparatuses may be used to form a transaction card frame within a mold. The transaction card frame may include one or more recessed portions formed within a first surface of the transaction card frame. The one or more recessed portions may be configured for affixing one or more electronic components.

1 - 20 . (canceled) 
     
     
         21 . Apparatus for manufacturing a transaction card, the apparatus comprising:
 a mold, including:   a cavity in the mold for receiving a material to be molded into a transaction card frame, the transaction card frame including a first surface, a recessed portion within the first surface having a second surface, the second surface recessed a depth from the first surface, the recessed portion configured to receive an electrical component;   a through hole disposed in the mold for receiving a pin to be driven through the through hole to release a molded transaction card frame from the mold; and   a protrusion structure configured to form the recessed portion, the through hole being disposed to pass through the protrusion structure,   wherein the pin driven through the through hole leaves a mark in the recessed portion of the molded transaction card frame.   
     
     
         22 . The apparatus of  claim 21 , wherein the protrusion structure includes a first protrusion portion protruding a first distance and a second protrusion portion protruding a second distance. 
     
     
         23 . The apparatus of  claim 22 , wherein the first protrusion portion defines the second surface in the recessed portion. 
     
     
         24 . The apparatus of  claim 23 , wherein the second protrusion portion defines a third surface in the recessed portion. 
     
     
         25 . The apparatus of  claim 22 , wherein the protrusion structure includes a third protrusion portion protruding a third distance. 
     
     
         26 . The apparatus of  claim 25 , wherein a third protrusion portion defines a fourth surface in the recessed portion. 
     
     
         27 . The apparatus of  claim 22 , wherein the first distance is 0.19-0.23 mm, and the second distance is 0.60-0.64 mm. 
     
     
         28 . The apparatus of  claim 21 , wherein the material is a thermoplastic or a thermosetting polymer. 
     
     
         29 . The apparatus of  claim 21 , wherein the mold is constructed using steel or aluminum. 
     
     
         30 . The apparatus of  claim 21 , wherein the mold is arranged to allow steps for removing defects in a subsequent manufacturing step through the through hole. 
     
     
         31 . The apparatus of  claim 21 , wherein the cavity is formed by first and second interior surfaces of the mold, the mold further including a gate formed in the first or second interior surfaces configured to receive the material to be molded. 
     
     
         32 . The apparatus of  claim 31 , wherein the mold comprises a first plate joinable to a second plate to form the cavity therebetween. 
     
     
         33 . The apparatus of  claim 32 , wherein the first plate or the second plate includes the through hole to receive the pin. 
     
     
         34 . The apparatus of  claim 33 , wherein the gate is included in the first plate and the through hole to receive the pin is in the second plate. 
     
     
         35 . The apparatus of  claim 32 , wherein the gate is included in the first plate, the first plate including two of the through holes for receiving two of the pins. 
     
     
         36 . The apparatus of  claim 32 , wherein the gate is included in the first plate, the second plate including two of the through holes for receiving two of the pins. 
     
     
         37 . The apparatus of  claim 32 , wherein the gate is disposed within the first plate or the second plate. 
     
     
         38 . The apparatus of  claim 32 , wherein the protrusion structure includes the gate, wherein a mark left by the gate during manufacturing is located in the recessed portion. 
     
     
         39 . The apparatus of  claim 32 , further including a channel passing through a portion of the mold from an exterior surface to the gate, the channel for receiving the heated material to be molded. 
     
     
         40 . The apparatus of  claim 32 , wherein the first plate and the second plate are arranged to allow steps for removing defects in a subsequent manufacturing step through the gate.