Method for manufacturing a camera and a camera

Abstract

A method for manufacturing a camera. The method includes providing and connecting. In the providing, a wafer element, which includes a microlens unit and an image sensor, and a barrel element, which includes a lens system for concentrating light, are provided. In the connecting, the wafer element is connected to the barrel element to manufacture the camera.

What is claimed is: 
     
         1 . A method for manufacturing a camera, the method comprising:
 providing a wafer element, which includes at least one microlens unit and one image sensor, and a barrel element, which includes at least one lens system for concentrating light; and   connecting the wafer element to the barrel element to manufacture the camera.   
     
     
         2 . The method of  claim 1 , further comprising:
 in the providing of the wafer element, manufacturing an optical wafer, which includes a plurality of microlens units situated in a plane, connected to a semiconductor wafer, which includes a plurality of image sensors situated in a plane, and a wafer composite thus generated is separated to manufacture the wafer element.   
     
     
         3 . The method of  claim 1 , wherein in the providing, the wafer element is provided in which the microlens unit includes a plurality of microlenses situated in a stack. 
     
     
         4 . The method of  claim 1 , wherein in the providing, the barrel element is provided in which the lens system includes a plurality of lenses situated in a stack. 
     
     
         5 . The method of  claim 1 , wherein in the connecting, the wafer element is glued to the barrel element. 
     
     
         6 . The method of  claim 1 , wherein in the providing, the wafer element includes an aperture. 
     
     
         7 . The method of  claim 1 , wherein in the providing, the barrel element is provided in which a barrel element edge has a gap. 
     
     
         8 . The method of  claim 1 , wherein in the connecting, a planar optical element, which is configured to cover a surface of the wafer element, is inserted between the wafer element and the barrel element. 
     
     
         9 . A camera, comprising:
 a wafer element which includes at least one microlens unit and one image sensor; and   a barrel element, which is connected to the wafer element and includes at least one lens system for concentrating light.