Crimped Polyamide Conductive Filament, Manufacturing Method and Application Thereof
Abstract
The present invention relates to a crimped polyamide conductive filament, a manufacturing method and an application thereof. The crimped polyamide conductive filament is obtained by subjecting a conductive fiber with composite structure prepared by melt composite spinning process to a crimping deformation process, and has a crimp shrinkage of 15%-60% and a crimp stability of 40%-90%. The process of deformation processing is as follows: the conductive fiber protofilament is heated and plasticized by a deformed hot-box, cooled by a cooling plate, twisted and untwisted by a false twister, shaped, added with interlaced nodes, oiled, wound, inspected, and packaged. The crimped polyamide conductive filament is beneficial to the subsequent blended weaving, or used alone for weaving, and can exhibit a soft human experience effect, and can be widely used in intelligent sensing, smart wear and other fields.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A crimped polyamide conductive filament, wherein the crimped polyamide conductive filament is obtained by subjecting a polyamide conductive filament to a crimping deformation process, a crimp shrinkage of the crimped polyamide conductive filament is 15%-60%, and a crimp stability of the crimped polyamide conductive filament is 40%-90%.
2 . The crimped polyamide conductive filament according to claim 1 , wherein the polyamide conductive filament is composed of a conductive portion and a non-conductive portion, and the conductive portion accounts for 10%-40% of a total amount of the polyamide conductive filament; the polyamide conductive filament has a sheath-core structure, and a sheath layer is the conductive portion; or, the polyamide conductive filament has a composite structure, the conductive portion is embedded in the non-conductive portion and the conductive portion is partially exposed on a surface of the polyamide conductive filament.
3 . The crimped polyamide conductive filament according to claim 2 , wherein the conductive portion is composed of a conductive agent, a processing aid and a polyamide carrier, and the conductive agent is a conductive carbon black with an additive amount of 20%-35%, a carbon nanotube with an additive amount of 5%-15%, a composite conductive agent composed of the conductive carbon black and the carbon nanotubes and having an additive amount of 10%-25%, or a light-colored conductive metal oxide with an additive amount of 50%-80%.
4 . The crimped polyamide conductive filament according to claim 3 , wherein the light-colored conductive metal oxide is an antimony-doped titanium dioxide conductive powder.
5 . The crimped polyamide conductive filament according to claim 1 , wherein the crimped polyamide conductive filament has a monofilament fineness of 1.5-6 dtex, a strength of 2.0-3.5 cN/dtex, an elongation of 15%-35%, a resistivity of 10 0 -10 2 Ω·cm, and a surface resistance of 10 2 -10 5 Ω.
6 . A method for manufacturing a crimped polyamide conductive filament, wherein the method comprises the following process steps:
a polyamide conductive filament is sequentially subjected to the steps of heating and plasticizing, cooling, false-twisting, shaping, adding interlaced nodes, oiling and winding; a temperature of the heating and plasticizing is 145-195° C., a shaping temperature is 25-135° C., a draft multiple is 1.05-1.5, a value of D/Y is 1.6-2.5, and a winding speed is 100-800 m/min.
7 . A crimped polyamide conductive filament containing as an essential material in products selected from the group consisting of antistatic and radiation resistant fabrics, fiber fabric type sensors, and smart wearable products.Join the waitlist — get patent alerts
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