Composite electronic component and board having the same

Abstract

A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other, the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes disposed on both end portions of the first ceramic body, and the ceramic chip being disposed on a lower portion of the multilayer ceramic capacitor and formed of a ceramic material having substantially no piezoelectric property, wherein a ratio (T/L) of thickness (T) of the ceramic chip to length (L) of the multilayer ceramic capacitor is selected to minimize vibration of the ceramic chip.

1 . A composite electronic component comprising a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other,
 the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes disposed on both end portions of the first ceramic body, and   the ceramic chip being disposed on a lower portion of the multilayer ceramic capacitor and formed of a ceramic material containing alumina (Al 2 O 3 ),   wherein T/L≥0.22 in which L is a length L of the multilayer ceramic capacitor and T is a thickness of the ceramic chip.   
     
     
         2 - 3 . (canceled) 
     
     
         4 . The composite electronic component of  claim 1 , wherein the length of the multilayer ceramic capacitor is 2.0 mm or more. 
     
     
         5 . The composite electronic component of  claim 1 , wherein the thickness of the ceramic chip is 0.5 mm or more. 
     
     
         6 . (canceled) 
     
     
         7 . The composite electronic component of  claim 1 , wherein the ceramic chip includes a second ceramic body and first and second terminal electrodes disposed on both end portions of the second ceramic body and connected to the first and second external electrodes, respectively. 
     
     
         8 . The composite electronic component of  claim 1 , wherein the multilayer ceramic capacitor and the ceramic chip are coupled to each other by a conductive adhesive applied to lower surfaces of the first and second external electrodes. 
     
     
         9 . The composite electronic component of  claim 1 , wherein the multilayer ceramic capacitor and the ceramic chip are coupled to each other by a conductive adhesive applied to an entire adhesion surface of the ceramic chip. 
     
     
         10 . The composite electronic component of  claim 1 , wherein a length of the ceramic chip is longer than that of the multilayer ceramic capacitor. 
     
     
         11 . The composite electronic component of  claim 1 , wherein a width of the ceramic chip is wider than that of the multilayer ceramic capacitor. 
     
     
         12 . The composite electronic component of  claim 1 , wherein a length of the ceramic chip is shorter than that of the multilayer ceramic capacitor. 
     
     
         13 . The composite electronic component of  claim 1 , wherein a length of the ceramic chip is shorter than that of the multilayer ceramic capacitor and a width of the ceramic chip is narrower than that of the multilayer ceramic capacitor. 
     
     
         14 . A board having a composite electronic component, the board comprising:
 a printed circuit board on which a plurality of electrode pads are formed;   the composite electronic component of  claim 1 , mounted on the printed circuit board; and   a solder connecting the electrode pads and the composite electronic component to each other.   
     
     
         15 . The board of  claim 14 , wherein the length of the multilayer ceramic capacitor is 2.0 mm or more. 
     
     
         16 . The board of  claim 14 , wherein the internal electrodes in the first ceramic body are stacked to be perpendicular to a mounting surface of the composite body. 
     
     
         17 . (canceled) 
     
     
         18 . (canceled) 
     
     
         19 . A composite electronic component comprising a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other,
 the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes disposed on both end portions of the first ceramic body containing alumina (Al 2 O 3 ), and   the ceramic chip being disposed on a lower surface of the multilayer ceramic capacitor and including a second ceramic body formed of a ceramic material containing alumina (Al 2 O 3 ),   wherein the internal electrodes are stacked to be perpendicular to the lower surface of the multilayer ceramic capacitor,   wherein T/L≥0.12 in which L is a length L of the multilayer ceramic capacitor and T is a thickness of the ceramic chip.   
     
     
         20 . The composite electronic component of  claim 19 , wherein the length of the multilayer ceramic capacitor is 2.0 mm or more. 
     
     
         21 . The composite electronic component of  claim 19 , wherein the thickness of the ceramic chip is 0.5 mm or more. 
     
     
         22 . The composite electronic component of  claim 19 , wherein the ceramic chip further includes first and second terminal electrodes disposed on both end portions of the second ceramic body and connected to the first and second external electrodes, respectively. 
     
     
         23 . The composite electronic component of  claim 19 , wherein the multilayer ceramic capacitor and the ceramic chip are coupled to each other by a conductive adhesive applied to lower surfaces of the first and second external electrodes. 
     
     
         24 . The composite electronic component of  claim 19 , wherein a length of the ceramic chip is longer than that of the multilayer ceramic capacitor. 
     
     
         25 . The composite electronic component of  claim 24 , wherein a width of the ceramic chip is wider than that of the multilayer ceramic capacitor. 
     
     
         26 . The composite electronic component of  claim 19 , wherein a length of the ceramic chip is shorter than that of the multilayer ceramic capacitor. 
     
     
         27 . The composite electronic component of  claim 19 , wherein a length of the ceramic chip is shorter than that of the multilayer ceramic capacitor and a width of the ceramic chip is narrower than that of the multilayer ceramic capacitor. 
     
     
         28 . A composite electronic component comprising a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other,
 the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes disposed on both end portions of the first ceramic body containing alumina (Al 2 O 3 ), and   the ceramic chip being disposed on a lower surface of the multilayer ceramic capacitor and including a second ceramic body formed of a ceramic material containing alumina (Al 2 O 3 ),   wherein the internal electrodes are stacked to be perpendicular to the lower surface of the multilayer ceramic capacitor,   wherein a length of the ceramic chip is shorter than that of the multilayer ceramic capacitor and a width of the ceramic chip is narrower than that of the multilayer ceramic capacitor.   
     
     
         29 . The composite electronic component of  claim 28 , wherein the length of the multilayer ceramic capacitor is 2.0 mm or more. 
     
     
         30 . The composite electronic component of  claim 28 , wherein the thickness of the ceramic chip is 0.5 mm or more. 
     
     
         31 . The composite electronic component of  claim 28 , wherein the ceramic chip further includes first and second terminal electrodes disposed on both end portions of the second ceramic body and connected to the first and second external electrodes, respectively. 
     
     
         32 . The composite electronic component of  claim 28 , wherein the multilayer ceramic capacitor and the ceramic chip are coupled to each other by a conductive adhesive applied to lower surfaces of the first and second external electrodes.