Methods of forming holes and etching surfaces in substrates and substrates formed thereby

Abstract

Methods capable of forming holes in, etching the surface of, or otherwise ablating substrates, and substrates formed thereby. A first method includes directing a first laser beam pulse towards a substrate to form a hole in a surface thereof and to form a plasma plume at least partially within the hole wherein the plasma plume has insufficient thermal energy and expansion velocity to etch sidewall of the hole, and directing a second laser beam pulse into the plasma plume to increase the temperature and expansion velocity of the plasma plume such that the sidewall is etched causing an increase in the cross-sectional dimension of the hole. A second method includes applying a liquid to a surface of a substrate, and directing a laser beam pulse into the liquid to create plasma on the surface of the substrate that etches portions of the surface of the substrate.

1 . A method comprising:
 applying a liquid to a surface of a substrate; and   directing a laser beam pulse into the liquid to create plasma on the surface of the substrate;   wherein the plasma etches portions of the surface of the substrate.   
     
     
         2 . The method of  claim 1 , wherein the liquid is water. 
     
     
         3 . The method of  claim 1 , wherein the substrate is a composite comprising first and second materials, and the plasma etches the first material and does not etch the second material. 
     
     
         4 . The method of  claim 3 , wherein the first material is a matrix material and the second material is a fiber reinforcement within the matrix material. 
     
     
         5 . The method of  claim 3 , wherein the first material is a polymer matrix material and the second material is a carbon fiber reinforcement within the matrix material. 
     
     
         6 . The method of  claim 1 , wherein the laser beam pulse has a duration of between a few nanoseconds and one nanosecond. 
     
     
         7 . The method of  claim 1 , wherein the substrate is formed of a conductive material. 
     
     
         8 . The method of  claim 1 , wherein the substrate is formed of a non-conductive material.