US2019045311A1PendingUtilityA1

Production Line PCB Serial Programming and Testing Method and System

Assignee: Bragi GmbHPriority: Aug 29, 2015Filed: Sep 27, 2018Published: Feb 7, 2019
Est. expiryAug 29, 2035(~9 yrs left)· nominal 20-yr term from priority
Inventors:Lisa Kingscott
G01R 31/2825G01R 31/2822H04R 1/10H05K 999/00H04R 29/001G01R 31/3641H04R 29/00G01R 31/3865
60
PatentIndex Score
0
Cited by
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References
0
Claims

Abstract

A system and method for testing a wireless earpiece which provides improved efficiencies in manufacturing. Automated testing of one or more printed circuit boards of the wireless earpiece is initiated. The semi-assembled wireless earpiece is tested. End-of-line functional testing is performed. Final acoustic testing of the wireless earpiece is performed.

Claims

exact text as granted — not AI-modified
What is claimed: 
     
         1 . A method for testing a wireless earpiece, the method comprising:
 initiating automated testing of one or more printed circuit boards (PCBs) of the wireless earpiece, wherein (1) component sets of the PCBs are tested for energy consumption and (2) a battery within the component sets is tested for charging capabilities;   testing the wireless earpiece, wherein the wireless earpiece is semi-assembled;   performing end-of-line functional testing, wherein the wireless earpiece is light insulated for testing LEDs of the wireless earpiece; and   performing final acoustic testing of the wireless earpiece, wherein the final acoustic testing is performed in an acoustically isolated chamber.   
     
     
         2 . The method of  claim 1 , further comprising the step of determining voltage and current utilized to charge the battery. 
     
     
         3 . The method of  claim 2 , further comprising the step of determining the capacity of the battery when fully charged. 
     
     
         4 . The method of  claim 1 , further comprising the step of determining whether the energy consumption is determined to be within designated tolerances. 
     
     
         5 . The method of  claim 4 , further comprising the step of generating alarms in response to any of the PCBs failing any of the tests. 
     
     
         6 . The method of  claim 5 , wherein a database is utilized to track the testing results for subsequent analysis. 
     
     
         7 . The method of  claim 6 , wherein a serial number, a bar code, a radio frequency tag, or other assigned identifier may be utilized to associate the PCBs or components with the test results and measurements. 
     
     
         8 . A system for testing a wireless earpiece, the system comprising:
 a computing device connected to the wireless earpiece;   a reference wireless earpiece connected to the computing device;   wherein the computing device is configured to:   initiate automated testing of one or more printed circuit boards (PCBs) of the wireless earpiece;   test the wireless earpiece, wherein the wireless earpiece is semi-assembled;   test battery voltage and current utilized to charge the battery to determine a capacity of the battery when fully charged;   testing the wireless earpiece, wherein the wireless earpiece is semi-assembled;   perform end-of-line functional testing including detecting light generated by LEDs of the wireless earpiece; and   perform final acoustic testing of the wireless earpiece, wherein the final acoustic testing is performed in an acoustically isolated chamber; and   wherein the reference wireless earpiece is used to test a connection range of a communication element and a processor associated with the communication element within the semi-assembled wireless earpiece.   
     
     
         9 . The system according to  claim 8 , further comprising a rework station for receiving a failed semi-assembly from the computing device; and
 a monitor operably coupled to the rework station providing data regarding the reason for the semi-assembly failing; wherein the failed semi-assembly is rejected if the second rework station cannot repair the failed semi-assembly and the failed semi-assembly is returned to the computing device for semi-assembly testing if the failed semi-assembly can be repaired.   
     
     
         10 . The system according to  claim 9 , wherein the computing device performs end-of-line functional testing. 
     
     
         11 . The system according to  claim 10 , wherein the wireless earpiece is rejected if a failure is detected during end-of-line functional testing. 
     
     
         12 . The system according to  claim 11 , wherein the computing device performs final acoustic testing of the wireless earpiece and rejects any failed wireless earpiece. 
     
     
         13 . The system according to  claim 11 , wherein the wireless earpiece is packaged. 
     
     
         14 . A method for testing a wireless earpiece, the method comprising:
 initiating an automated production panel, having a plurality of PCB (printed circuit boards) produced thereon for testing,   verifing the PCB utilizes power within a specified range when drawing power from an internal battery connection;   verifying a microcontroller of the PCB can connect to a touch sensor, an accelerometer and a memory;   performing semi-assembly testing of the wireless earpiece;   performing end-of-line functional testing, wherein the wireless earpiece is light insulated for testing LEDs of the wireless earpiece; and   performing final acoustic testing of the wireless earpiece, wherein the final acoustic testing is performed in an acoustically isolated chamber.   
     
     
         15 . The method according to  claim 14 , further comprising the step of rejecting the wireless earpiece if a failure is detected during end-of-line functional testing. 
     
     
         16 . The method according to  claim 15 , further comprising the step of rejecting the wireless earpiece if a failure is detected during final acoustic testing. 
     
     
         17 . The method according to  claim 16 , further comprising the step of packaging the wireless earpiece. 
     
     
         18 . The method according to  claim 17 , further comprising the step of testing component sets of a PCB for energy consumption. 
     
     
         19 . The method according to  claim 18 , further comprising the step of testing an NFMI antenna to test the limits of the NFMI antenna. 
     
     
         20 . The method according to  claim 19 , further comprising the step of testing red green and blue (RGB) light emitting diodes (LEDs).

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