Package structure and fabricating method thereof

Abstract

A package structure includes a first carrier plate, a second carrier plate, a pin group and an encapsulant member. A power component is disposed on a first top surface of the first carrier plate. The second carrier plate is disposed on the first top surface of the first carrier plate. A driving circuit is disposed on a second top surface of the second carrier plate for driving the power component. An opening runs through the second carrier plate, and the power component is accommodated within the opening. The pin group is assembled on the first carrier plate and/or the second carrier plate. The encapsulant member encapsulates the first carrier plate, the second carrier plate, a part of the first pin group and a part of the second pin group, so that the first pin group and the second pin group are partially exposed outside the encapsulant member.

What is claimed is: 
     
         1 . A package structure, comprising:
 a first carrier plate, wherein at least a power component is disposed on a first top surface of the first carrier plate;   a second carrier plate disposed on the first top surface of the first carrier plate, wherein a driving circuit is disposed on a second top surface of the second carrier plate for driving the power component, wherein at least an opening runs through the second carrier plate and corresponds to the power component, and the power component is accommodated within the opening when the second carrier plate is disposed on the first top surface of the first carrier plate;   a pin group assembled on the first carrier plate and/or the second carrier plate, wherein the pin group comprises a first pin group and a second pin group; and   an encapsulant member encapsulating the first carrier plate, the second carrier plate, a part of the first pin group and a part of the second pin group, so that the first pin group and the second pin group are partially exposed outside the encapsulant member,   wherein both of the first pin group and the second pin group are assembled on the first carrier plate.   
     
     
         2 . The package structure according to  claim 1 , wherein the current-flowing capability and the heat-dissipating efficiency of the first carrier plate are higher than the current-flowing capability and the heat-dissipating efficiency of the second carrier plate. 
     
     
         3 . The package structure according to  claim 1 , wherein the trace density of the second carrier plate is higher than the trace density of the first carrier plate. 
     
     
         4 . The package structure according to  claim 1 , wherein the first carrier plate is a direct bonded copper substrate, and the second carrier plate is a printed circuit board or an insulated metal substrate. 
     
     
         5 . The package structure according to  claim 1 , wherein the first pin group is electrically connected with the driving circuit, and the second pin group is electrically connected with the power component. 
     
     
         6 . A package structure, comprising:
 a first carrier plate, wherein at least a power component is disposed on a first top surface of the first carrier plate;   a second carrier plate disposed on the first top surface of the first carrier plate, wherein a driving circuit is disposed on a second top surface of the second carrier plate for driving the power component, wherein at least an opening runs through the second carrier plate and corresponds to the power component, and the power component is accommodated within the opening when the second carrier plate is disposed on the first top surface of the first carrier plate;   a pin group assembled on the first carrier plate and/or the second carrier plate, wherein the pin group comprises a first pin group and a second pin group; and   an encapsulant member encapsulating the first carrier plate, the second carrier plate, a part of the first pin group and a part of the second pin group, so that the first pin group and the second pin group are partially exposed outside the encapsulant member,   wherein the first pin group is assembled on the second carrier plate, and the second pin group is assembled on the first carrier plate.   
     
     
         7 . The package structure according to  claim 6 , wherein the second pin group further comprises a raised part, wherein the raised part is located at an end of the second pin group and assembled on the first carrier plate, and a thickness of the raised part of the second pin group is equal to a thickness of the second carrier plate, so that an exposed part of the second pin group and an exposed part of the first pin group are at the same level. 
     
     
         8 . The package structure according to  claim 6 , wherein the current-flowing capability and the heat-dissipating efficiency of the first carrier plate are higher than the current-flowing capability and the heat-dissipating efficiency of the second carrier plate. 
     
     
         9 . The package structure according to  claim 6 , wherein the trace density of the second carrier plate is higher than the trace density of the first carrier plate. 
     
     
         10 . The package structure according to  claim 6 , wherein the first carrier plate is a direct bonded copper substrate, and the second carrier plate is a printed circuit board or an insulated metal substrate. 
     
     
         11 . The package structure according to  claim 6 , wherein the first pin group is electrically connected with the driving circuit, and the second pin group is electrically connected with the power component. 
     
     
         12 . A package structure, comprising:
 a first carrier plate, wherein at least a power component is disposed on a first top surface of the first carrier plate;   a second carrier plate disposed on the first top surface of the first carrier plate, wherein a driving circuit is disposed on a second top surface of the second carrier plate for driving the power component, wherein at least an opening runs through the second carrier plate and corresponds to the power component, and the power component is accommodated within the opening when the second carrier plate is disposed on the first top surface of the first carrier plate;   a pin group assembled on the first carrier plate and/or the second carrier plate, wherein the pin group comprises a first pin group and a second pin group; and   an encapsulant member encapsulating the first carrier plate, the second carrier plate, a part of the first pin group and a part of the second pin group, so that the first pin group and the second pin group are partially exposed outside the encapsulant member,   wherein the first carrier plate is a lead frame, and the first pin group and the second pin group are integrally formed with the lead frame.   
     
     
         13 . The package structure according to  claim 12 , wherein the current-flowing capability and the heat-dissipating efficiency of the first carrier plate are higher than the current-flowing capability and the heat-dissipating efficiency of the second carrier plate. 
     
     
         14 . The package structure according to  claim 12 , wherein the trace density of the second carrier plate is higher than the trace density of the first carrier plate. 
     
     
         15 . The package structure according to  claim 12 , wherein the first carrier plate is a direct bonded copper substrate, and the second carrier plate is a printed circuit board or an insulated metal substrate. 
     
     
         16 . The package structure according to  claim 12 , wherein the first pin group is electrically connected with the driving circuit, and the second pin group is electrically connected with the power component. 
     
     
         17 . A fabricating method of a package structure, the fabricating method comprising steps of:
 (a) placing a power component on a first carrier plate;   (b) placing a driving circuit on a second carrier plate, and assembling a first pin group and a second pin group on the first carrier plate and/or the second carrier plate, wherein the second carrier plate has at least an opening;   (c) assembling the second carrier plate on the first carrier plate, wherein the power component is accommodated within the opening;   (d) allowing the first carrier, the second carrier, the power component, the driving circuit, the first pin group and the second pin group to be electrically connected with each other;   (e) encapsulating the first carrier, the second carrier, the power component, the driving circuit, the first pin group and the second pin group with an encapsulant member, wherein the first pin group and the second pin group are partially exposed outside the encapsulant member; and   (f) performing a trim and form process to treat the first pin group and the second pin group which are exposed outside the encapsulant member.   
     
     
         18 . The fabricating method according to  claim 17 , further comprising a step (g) of forming the opening in the second carrier plate, wherein the step (g) is performed after the step (a) and before the step (b). 
     
     
         19 . The fabricating method according to  claim 17 , wherein in the step (c), the second carrier plate is attached on the first carrier plate via a bonding material.