Connection pin and feedthrough and production process for a connection pin

Abstract

A connection pin of a feedthrough of an implantable medical electronic device has a primarily cylindrical pin body and at least one flattened end section. The flattened end section has at least one planar connecting surface formed on it, especially for connection by material bonding of a band-shaped conductor.

1 . A connection pin of a feedthrough of an implantable medical electronic device, the connection pin comprising:
 an elongated pin body extending along a longitudinal axis of said pin body;   at least one flattened end section integrally connected to said pin body, said at least one flattened end section having a cross-section area that is smaller than a cross-section area of said pin body; and   at least one planar connecting surface formed on said at least one flattened end section.   
     
     
         2 . The connection pin according to  claim 1 , wherein said pin body is cylindrical. 
     
     
         3 . The connection pin according to  claim 1 , wherein said at least one planar connecting surface is configured to be bonded to a band-shaped conductor by way of material bonding. 
     
     
         4 . The connection pin according to  claim 1 , wherein said at least one planar connecting surface is larger than said cross-section area of said pin body. 
     
     
         5 . The connection pin according to  claim 1 , which comprises a further flattened end section integrally connected to said pin body, said further flattened end section having a cross-section area that is smaller than the cross-section area of said pin body, and said further flattened end section having at least one planar connecting surface formed thereon. 
     
     
         6 . The connection pin according to  claim 5 , wherein said at least one planar connecting surface is one of two planar connecting surfaces formed opposite one another on said further flattened end section. 
     
     
         7 . The connection pin according to  claim 5 , wherein said at least one planar connecting surface is one of two planar connecting surfaces formed opposite one another on said flattened end section and wherein said at least one planar connecting surface is one of two planar connecting surfaces formed opposite one another on said further flattened end section. 
     
     
         8 . The connection pin according to  claim 1 , further comprising a nail head formed on one end of said pin body. 
     
     
         9 . The connection pin according to  claim 1 , wherein said at least one planar connecting surface is one of two planar connecting surfaces formed opposite one another on said flattened end section. 
     
     
         10 . The connection pin according to  claim 1 , wherein said at least one flattened end section is bent at an angle in a range between 30° and 90° with respect to the longitudinal axis of said pin body. 
     
     
         11 . The connection pin according to  claim 5 , wherein said at least one flattened end section is bent at an angle in a range between 30° and 90° with respect to the longitudinal axis of said pin body; and/or wherein said further flattened end section is bent at an angle in a range between 30° and 90° with respect to the longitudinal axis of the pin body. 
     
     
         12 . The connection pin according to  claim 11 , wherein said at least one flattened end section and said further flattened end section are bent relative to the longitudinal axis of the pin body an angle of 90°. 
     
     
         13 . The connection pin according to  claim 1 , wherein said at least one connecting surface of said at least one flattened end section has a surface structure that is configured to prevent a connecting material for connection of a band-shaped conductor by material bonding, from running in a direction of the longitudinal axis of said pin body or towards said pin body, and/or wherein at least one connecting surface of a further flattened end section has a surface structure that is configured to prevent a connecting material for connection of a band-shaped conductor by material bonding, from running in a direction of the longitudinal axis or towards said pin body. 
     
     
         14 . The connection pin according to  claim 13 , wherein said surface structure is oriented transverse to the longitudinal axis, or wherein said surface structure is a irregular surface structure. 
     
     
         15 . A feedthrough of an implantable medical electronic device, comprising at least one connection pin according to  claim 1 . 
     
     
         16 . The feedthrough according to  claim 15 , wherein the medical electronic device is a cardiac pacemaker or a cardioverter. 
     
     
         17 . A method for producing a connection pin, the method comprising:
 providing an annealed wire material;   applying an ultrashort pulse laser treatment to the wire material to form a pin body, at least one flattened end section, and at least one planar connecting surface of the connection pin according to  claim 1 .   
     
     
         18 . The method according to  claim 17 , further comprising:
 forming a surface structure on the at least one planar connecting surface of the at least one flattened end section by ultrashort pulse laser treatment, and forming the surface structure to be oriented transverse to a longitudinal axis of the pin body.   
     
     
         19 . The method according to  claim 17 , further comprising installing the connection pin into a feedthrough of an implantable medical electronic device after the at least one flattened end section is formed, and bending a device-internal end section of the connection pin by cold forming in an installed state of the connection pin. 
     
     
         20 . The method according to  claim 19 , which comprises bending a device-external end section of the connection pin by cold forming prior to being installed into the feedthrough.