Package device and manufacturing method thereof

Abstract

The present disclosure provides a package device including a conductive pad, a protecting block, and a redistribution layer. The protecting block is disposed on the conductive pad. The redistribution layer is disposed on the protecting block, and the conductive pad is electrically connected to the redistribution layer through the protecting block.

What is claimed is: 
     
         1 . A package device, comprising:
 a conductive pad;   a protecting block, disposed on the conductive pad; and   a redistribution layer, disposed on the protecting block, and the conductive pad being electrically connected to the redistribution layer through the protecting block.   
     
     
         2 . The package device according to  claim 1 , wherein the conductive pad is directly in contact with the protecting block. 
     
     
         3 . The package device according to  claim 1 , wherein the protecting block covers the conductive pad in a top view direction of the package device. 
     
     
         4 . The package device according to  claim 1 , wherein the conductive pad and the protecting block are formed of a same material. 
     
     
         5 . The package device according to  claim 1 , wherein the protecting block comprises a conductive material. 
     
     
         6 . The package device according to  claim 1 , wherein the conductive pad and the protecting block have different thicknesses. 
     
     
         7 . The package device according to  claim 1 , further comprising an electronic device, disposed on the redistribution layer, wherein the conductive pad is electrically connected to the electronic device through the protecting block and the redistribution layer. 
     
     
         8 . The package device according to  claim 7 , wherein the redistribution layer comprises at least one dielectric layer and at least one patterned conductive layer, and the conductive pad is electrically connected to the electronic device through the at least one patterned conductive layer. 
     
     
         9 . The package device according to  claim 7 , further comprising an encapsulation layer disposed between the electronic device and the redistribution layer. 
     
     
         10 . The package device according to  claim 1 , further comprising a solder ball, in contact with the conductive pad. 
     
     
         11 . A manufacturing method of a package device, comprising:
 forming a release layer on a carrier substrate;   forming a protecting layer and a conductive pad on the release layer, wherein the protecting layer is in contact with the conductive pad;   forming a redistribution layer on the protecting layer and the conductive pad;   removing the release layer and the carrier substrate; and   etching the protecting layer.   
     
     
         12 . The manufacturing method of the package device according to  claim 11 , further comprising disposing an electronic device on the redistribution layer before removing the release layer and the carrier substrate. 
     
     
         13 . The manufacturing method of the package device according to  claim 12 , further comprising disposing an encapsulation layer between the electronic device and the redistribution layer. 
     
     
         14 . The manufacturing method of the package device according to  claim 11 , wherein the conductive pad and the protecting layer are formed of a same material. 
     
     
         15 . The manufacturing method of the package device according to  claim 11 , wherein the conductive pad and the protecting layer have different thicknesses. 
     
     
         16 . The manufacturing method of the package device according to  claim 11 , further comprising performing a cleaning process on the protecting layer between removing the release layer and etching the protecting layer. 
     
     
         17 . The manufacturing method of the package device according to  claim 11 , wherein forming the conductive pad and the protecting layer comprises:
 forming the conductive pad on the release layer; and   forming the protecting layer on the conductive pad and the release layer,   wherein etching the protecting layer comprises removing a part of the protecting layer to expose the redistribution layer.   
     
     
         18 . The manufacturing method of the package device according to  claim 11 , wherein forming the conductive pad and the protecting layer comprises:
 forming the protecting layer on the release layer; and   forming the conductive pad on the protecting layer,   wherein etching the protecting layer comprises removing the protecting layer to expose the conductive pad.   
     
     
         19 . The manufacturing method of the package device according to  claim 11 , wherein forming the conductive pad and the protecting layer comprises:
 forming a conductive layer on the release layer; and   etching the conductive layer to forming the conductive pad and the protecting layer,   wherein a thickness of the conductive pad is greater than a thickness of the protecting layer, and etching the protecting layer comprises removing the protecting layer.   
     
     
         20 . The manufacturing method of the package device according to  claim 11 , further comprising forming a solder ball on the conductive pad after etching the protecting layer.