Lithium sputter targets

Abstract

Described are methods of fabricating lithium sputter targets, lithium sputter targets, associated handling apparatus, and sputter methods including lithium targets. Various embodiments address adhesion of the lithium metal target to a support structure, avoiding and/or removing passivating coatings formed on the lithium target, uniformity of the lithium target as well as efficient cooling of lithium during sputtering. Target configurations used to compensate for non-uniformities in sputter plasma are described. Modular format lithium tiles and methods of fabrication are described. Rotary lithium sputter targets are also described.

1 .- 61 . (canceled) 
     
     
         62 . A modular format sputter target tile comprising:
 a backing plate;   a soft metal adhered to the backing plate; and   a removable protective coating on at least the target surface of the soft metal.   
     
     
         63 . The modular format sputter target tile of  claim 62 , wherein the backing plate comprises copper, the soft metal is lithium, and the removable protective coating comprises a polymer. 
     
     
         64 . The modular format sputter target tile of  claim 62 , wherein the backing plate has a rectangular area that is between about 6 inches and about 36 inches on any side. 
     
     
         65 . A method of fabricating a lithium sputter target, the method comprising:
 receiving a metal support structure; and   applying lithium to the metal support structure, wherein the lithium is roll pressed to the metal support structure.   
     
     
         66 . The method of  claim 65 , wherein the metal support structure comprises copper. 
     
     
         67 . The method of  claim 65 , wherein the lithium is roll pressed at temperature between about 20° C. and about 100° C. 
     
     
         68 . The method of  claim 65 , wherein the lithium is roll pressed under an inert atmosphere. 
     
     
         69 . The method of  claim 65 , wherein the metal support structure comprises an adhesion layer. 
     
     
         70 . The method of  claim 69 , wherein the adhesion layer comprises at least one of nickel and molybdenum. 
     
     
         71 . The method of  claim 65 , further comprising applying a removable protective coating at least on the target surface of the lithium. 
     
     
         72 . The method of  claim 71 , wherein the removable protective coating comprises a polymer and/or a metal foil. 
     
     
         73 . The method of  claim 71 , further comprising applying the removable protective coating to the target surface of the lithium by vacuum sealing, electrostatically, or by spray or dip coating. 
     
     
         74 . A method of making a soft metal sputter target, the method comprising:
 registering a mold and a backing plate to form a recess, wherein the base of the recess includes the backing plate;   introducing the soft metal into the recess; and   removing the mold.   
     
     
         75 . The method of  claim 74 , wherein the soft metal is lithium. 
     
     
         76 . The method of  claim 75 , wherein the lithium is roll pressed into the recess. 
     
     
         77 . The method of  claim 76 , wherein the lithium is adhered to the backing plate such that the lithium is exposed on all sides except at the interface between the backing plate and the lithium. 
     
     
         78 . The method of  claim 75 , further comprising applying a removable protective coating at least on a target surface of the lithium. 
     
     
         79 . The method of  claim 78 , wherein the removable protective coating comprises a polymer and/or a metal foil. 
     
     
         80 . The method of  claim 78 , further comprising applying the removable protective coating to the target surface of the lithium by vacuum sealing, electrostatically, or by spray or dip coating.