US2019027458A1PendingUtilityA1

Method for manufacturing electronic device

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Assignee: INNOLUX CORPPriority: Aug 21, 2015Filed: Sep 26, 2018Published: Jan 24, 2019
Est. expiryAug 21, 2035(~9.1 yrs left)· nominal 20-yr term from priority
Inventors:Yan WangChi-Che TsaiChien-Feng LiWei-Yun ChangWei ChangPo-Ching Lin
G06F 2203/04102H10W 10/181H10P 90/1914H10P 90/1906H10P 14/69215H10P 14/6682H10P 14/3238H10P 14/2922H10P 14/683H10W 72/353H10W 72/351H10W 72/30H10W 72/073H01L 21/02118H01L 21/02422H01L 24/32H01L 21/02164H01L 2224/29099H01L 2224/29193H01L 21/02488H01L 24/29H01L 24/83H01L 21/7624H01L 21/02211
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Claims

Abstract

A method for manufacturing an electronic device is disclosed, which includes the following steps: providing a first substrate and modifying a surface of the first substrate to obtain a modified surface; applying silane or derivatives thereof on the modified surface to form an adhesion precursor layer; heat-treating the adhesion precursor layer to form an adhesion layer; forming an inorganic layer on the adhesion layer; and forming an active unit on the inorganic layer, wherein the inorganic layer is disposed between the adhesion layer and the active unit.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A method for manufacturing an electronic device, comprising the following steps:
 providing a first substrate and modifying a surface of the first substrate to obtain a modified surface;   applying silane or derivatives thereof on the modified surface to form an adhesion precursor layer;   heat-treating the adhesion precursor layer to form an adhesion layer;   forming an inorganic layer on the adhesion layer; and   forming an active unit on the inorganic layer, wherein the inorganic layer is disposed between the adhesion layer and the active unit.   
     
     
         2 . The method of  claim 1 , wherein a covalent bond is formed between the adhesion layer and the first substrate. 
     
     
         3 . The method of  claim 1 , wherein a covalent bond is formed between the adhesion layer and the inorganic layer. 
     
     
         4 . The method of  claim 1 , wherein the silane or the derivatives thereof is represented by the following formula (I): 
       
         
           
           
               
               
           
         
       
       wherein each of R 1 , R 2  and R 3  independently is H or C 1-6  alkyl; and Y is C 1-20  alkyl, C 2-20  alkenyl, C 1-20  alkyl-epoxy, epoxy, C 1-20  alkyl-acryl, or —O—C 1-20  alkyl. 
     
     
         5 . The method of  claim 4 , wherein the silane or the derivatives thereof is represented by any one the following formulas (I-1) to (I-3):

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