Multifunctional thermal management system and related method

Abstract

A system and related method that provides, but is not limited thereto, a thin structure with unique combination of thermal management and stress supporting properties. An advantage associated with the system and method includes, but is not limited thereto, the concept providing a multifunctional design that it is able to spread, store, and dissipate intense thermal fluxes while also being able to carry very high structural loads. An aspect associated with an approach may include, but is not limited thereto, a large area system for isothermalizing a localized heating source that has many applications. For example it can be used to mitigate the thermal buckling of ship deck plates, landing pad structures, or any other structures subjected to localized heating and compressive forces. It can also be used as a thermal regulation system in numerous applications, including but not limited to under-floor heating for residential or commercial buildings or for the de-icing of roads, runways, tunnels, sidewalks, and bridge surfaces.

1 . An anisotropic thermal management system, said system comprising:
 a high thermal conductivity layer to increase in-plane heat spreading across said high thermal conductivity layer;   a low thermal conductivity layer to reduce heat transfer in the direction orthogonal to said low thermal conductivity layer; and   wherein said system protects a load-bearing surface, structure, or component that is proximal to said low thermal conductivity layer, and distal from said high thermal conductivity layer, from excessive heat applied to said high thermal conductivity layer.   
     
     
         2 . The system of  claim 1 , wherein:
 said system possesses a high heat capacity such that, during periods in which high heat flux causes significant transient build-up of heat, the rate of temperature build-up of said system is moderated to protect said load-bearing surface from said heat flux.   
     
     
         3 . The system of  claim 2 , wherein:
 said high heat capacity is at least provided in part by one or more portions or segments of phase change material.   
     
     
         4 . The system of  claim 3 , wherein:
 said phase change material comprises: paraffins, fatty acids, or hydrated salts.   
     
     
         5 . The system of  claim 3 , wherein:
 said phase changing material comprises at least one of the following:   H 2 O; LiClO 3 .3H 2 O; ZnCl 2 .3H 2 O; K 2 HPO 4 .6H 2 O; NaOH.3½H 2 O; Na 2 CrO 4 . 10H 2 O; KF.4H 2 O; Mn(NO 3 ) 2 .6H 2 O; CaCl 2 .6H 2 O; LiNO 3 .3H 2 O; Na 2 SO 4 .10H 2 O; Na 2 CO 3 .10H 2 O; CaBr 2 .6H 2 O; Na 2 HPO 4 .12H 2 O; Zn(NO 3 ) 2 .6H 2 O; KF.2H 2 O; K(CH 3 C 00 ).1½H 2 O; K 3 PO 4 .7H 2 O; Zn(NO 3 ) 2 .4H 2 O; Ca(NO 3 ) 2 .4H 2 O; Na 2 HPO 4 . 7H 2 O; Na 2 S 2 O 3 .5H 2 O; Zn(NO 3 ) 2 .2H 2 O; NaOH.H 2 O; Na(CH 3 COO).3H 2 O; Cd(NO 3 ) 2 . 4H 2 O; Fe(NO 3 ) 2 .6H 2 O; NaOH; Na 2 B 4 O 7 .10H 2 O; Na3PO 4 .12H 2 O; Na 2 P 2 O 7 .10H 2 O; Ba(OH) 2 .8H 2 O; AlK(SO 4 ) 2 .12H 2 O; Kal(SO 4 ) 2 .12H 2 O; Al 2 (SO 4 ) 3 .18H 2 O; Al(NO 3 ) 3 . 8H 2 O; Mg(NO 3 ) 2 .6H 2 O; (NH 4 )Al(SO 4 ).6H 2 O; Na 2 S.5½H 2 O; CaBr 2 .4H 2 O; Al 2 (SO 4 ) 3 . 16H 2 O; MgCl 2 .6H 2 O; Mg(NO 3 ).2H 2 O; NaNO 3 ; KNO 3 ; KOH; MgCl 2 ; NaCl; Na 2 CO 3 ; or KF; K 2 CO 3 .   
     
     
         6 . The system of  claim 3 , wherein:
 said phase change materials are disposed in said high thermal conductivity layer and/or said low thermal conductivity layer.   
     
     
         7 . The system of  claim 1 , wherein:
 said high thermal conductivity layer comprises at least one or more of the following: a uniform high thermal conductivity material, a non-uniform high thermal conductivity material, or a composite formed from a multiplicity of high thermal conductivity materials.   
     
     
         8 . The system of  claim 7 , wherein:
 said high thermal conductivity material is an alloy of aluminum, silver, copper, diamond, graphite, or other material with a thermal conductivity greater than about 10 W/mK.   
     
     
         9 . The system of  claim 7 , wherein:
 said high conductivity layer further comprises a heat pipe system.   
     
     
         10 . The system of  claim 1 , wherein:
 said high conductivity layer comprises a heat pipe system.   
     
     
         11 . The system of  claim 10 , wherein:
 said heat pipe system comprises at least one or more heat pipe layers.   
     
     
         12 . The system of  claim 11 , wherein:
 at least one of said one or more heat pipe layers comprises multiple heat pipes.   
     
     
         13 . The system of  claim 12 , wherein:
 at least portions of said heat pipes within each layer are at least substantially parallel with other said heat pipes in said heat pipe layer.   
     
     
         14 . The system of  claim 13 , wherein:
 said multiple heat pipe layers are oriented in the same direction relative to each other.   
     
     
         15 . The system of  claim 13 , wherein:
 said multiple heat pipe layers are oriented in different directions relative to each other, thereby increasing in-plane heat spreading in different directions along said high thermal conductivity layer.   
     
     
         16 . The system of  claim 15 , wherein:
 said orientation is at least substantially perpendicular.   
     
     
         17 . The system of  claim 10 , wherein:
 said heat pipe system comprises one or more layers of interconnected heat pipes or heat pipe channels, said interconnected heat pipes or heat pipe channels having contiguous inner spaces, wherein said interconnected heat pipes and heat pipe channels increase in-plane heat spreading in different directions along said high thermal conductivity layer.   
     
     
         18 . The system of  claim 10 , wherein:
 said heat pipe system comprises one or more layers of intersecting heat pipes or heat pipe channels, wherein said intersecting heat pipes or heat pipe channels increase in-plane heat spreading in different directions along said high thermal conductivity layer.   
     
     
         19 . The system of  claim 10 , wherein:
 said heat pipe system comprises one or more layers of interconnected heat pipes or heat pipe channels and one or more layers of intersecting heat pipes or heat pipe channels, wherein said interconnected heat pipes or heat pipe channels and said intersecting heat pipes or heat pipe channels increase in-plane heat spreading in different directions along said high thermal conductivity layer.   
     
     
         20 . The system of  claim 10 , wherein:
 said heat pipe system comprises one or more layers of intersecting heat pipes, wherein said intersecting heat pipes cross over and/or under one another to increase heat spreading in different directions along said high thermal conductivity layer.   
     
     
         21 .- 125 . (canceled)