Package structure and manufacturing method thereof

Abstract

A manufacturing method of a package structure is described. The method includes at least the following steps. A carrier is provided. A semiconductor die and a sacrificial structure are disposed on the carrier. The semiconductor die is electrically connected to the bonding pads on the sacrificial structure through a plurality of conductive wires. As encapsulant is formed on the carrier to encapsulate the semiconductor die, the sacrificial structure and the conductive wires. The carrier is debonded, and at least a portion of the sacrificial structure is removed through a thinning process. A redistribution layer is formed on the semiconductor die and the encapsulant. The redistribution layer is electrically connected to the semiconductor die through the conductive wires.

1 . A manufacturing method of a package structure, comprising:
 providing a carrier,   disposing a semiconductor die and at least one sacrificial structure on the carrier;   electrically connecting the semiconductor die to bonding pads on the sacrificial structure through a plurality of conductive wires;   forming an encapsulant on the carrier to encapsulate the semiconductor die, the sacrificial structure and the conductive wires;   debonding the carrier,   removing at least a portion of the sacrificial structure through a thinning process; and   forming a redistribution layer on the semiconductor die and the encapsulant, the redistribution layer is electrically connected to the semiconductor die through the conductive wires.   
     
     
         2 . The manufacturing method of a package structure according to  claim 1 , wherein the sacrificial structure is disposed on the carrier, and the semiconductor die is disposed on the sacrificial structure. 
     
     
         3 . The manufacturing method of a package structure according to  claim 2 , wherein a width of the sacrificial structure is greater than a width of the semiconductor die. 
     
     
         4 . The manufacturing method of a package structure according to  claim 2 , wherein the redistribution layer is formed on the semiconductor die and the encapsulant after the removal of the sacrificial structure, and a plurality of passive components is disposed on the redistribution layer. 
     
     
         5 . The manufacturing method of a package structure according to  claim 1 , wherein the thinning process removes a portion of the semiconductor die to form a thinned semiconductor die. 
     
     
         6 . The manufacturing method of a package structure according to  claim 1 , wherein the bonding pads or the conductive wires are revealed after the thinning process. 
     
     
         7 . The manufacturing method of a package structure according to  claim 1 , wherein a plurality of the sacrificial structures is disposed on the carrier to surround the semiconductor die. 
     
     
         8 . The manufacturing method of a package structure according to  claim 7 , wherein the semiconductor die and the sacrificial structures are disposed on a same plane and on a same surface of the carriers. 
     
     
         9 . The manufacturing method of a package structure according to  claim 7 , further comprising:
 forming a plurality of passive components on the sacrificial structures, wherein the encapsulant is formed to encapsulate the passive components.   
     
     
         10 . The manufacturing method of a package structure according to  claim 9 , wherein the redistribution layer is formed on the semiconductor die and the encapsulant after the removal of the sacrificial structure, and the redistribution layer is electrically connected to the semiconductor die and the passive components. 
     
     
         11 . A package structure, comprising:
 an encapsulant having a top surface and a bottom surface opposite to the top surface;   a stacked die embedded in the encapsulant;   a plurality of bonding pads of a sacrificial structure encapsulated by the encapsulant, wherein connection terminals of the bonding pads are exposed on a top surface of the encapsulant;   a plurality of conductive wires embedded in the encapsulant, each of the plurality of conductive wires having one end coupled to the stacked die and another end coupled to a terminal of the bonding pads opposite the connection terminals;   a redistribution layer, directly formed on a first surface of the stacked die exposed through the encapsulant, the connection terminals of the bonding pads, and the top surface of the encapsulant, the redistribution layer is electrically connected to the stacked die through the bonding pads and the conductive wires, wherein the connection terminals of the bonding pads, the first surface of the stacked die, and the top surface of the encapsulant are coplanar to each other.   
     
     
         12 . The package structure according to  claim 11 , further comprising at least one passive component embedded in the encapsulant. 
     
     
         13 . The package structure according to  claim 11 , further comprising at least one passive component disposed on the redistribution layer. 
     
     
         14 . The package structure according to  claim 11 , wherein the encapsulant has a first thickness, and the redistribution layer has a second thickness smaller than the first thickness. 
     
     
         15 . The package structure according to  claim 14 , wherein the encapsulant provides a first rigidity, and the redistribution layer provides a second rigidity, the first rigidity is greater than the second rigidity. 
     
     
         16 . (canceled) 
     
     
         17 . The package structure according to  claim 11 , wherein the stacked die comprises:
 a first die having a first surface exposed through the encapsulant;   a second die stacked on the first die opposite to a side of the first surface, the second die cover portions of the first die, and other portions of the first die not covered by the second die contain die pads, the die pads of the first die are electrically connected to the bonding pads through the conductive wires.   
     
     
         18 . The package structure according to  claim 17 , wherein the stacked die further comprises:
 a third die stacked on the second die, the third die cover portions of the second die, and other portions of the second die not covered by the third die contain die pads, the die pads of the second die are electrically connected to the bonding pads through the conductive wires.   
     
     
         19 . The package structure according to  claim 11 , further comprising a plurality of conductive balls disposed on the redistribution layer. 
     
     
         20 . The package structure according to  claim 19 , wherein the bonding pads are arranged with a first pitch and the conductive balls are arranged with a second pitch, the second pitch is greater than the first pitch.