Heat Sink With Protrusions On Multiple Sides Thereof And Apparatus Using The Same

Abstract

Examples of a thermal management unit and an electronic apparatus utilizing the thermal management unit are described. In one aspect, the thermal management unit includes a heat sink. The heat sink includes a base portion, a first protrusion structure and a second protrusion structure. The base portion has a first side and a second side opposite the first side. The first protrusion structure protrudes from the first side of the base portion, and includes multiple fins. The second protrusion structure protrudes from the second side of the base portion, and includes multiple ribs. The heat sink may be made of silicon.

What is claimed is: 
     
         1 . A thermal management unit, comprising:
 a heat sink, comprising:
 a base portion having a first side and a second side opposite the first side; 
 a first protrusion structure protruding from the first side of the base portion, the first protrusion structure comprising a plurality of fins; and 
 a second protrusion structure protruding from the second side of the base portion, the second protrusion structure comprising a plurality of ribs. 
   
     
     
         2 . The thermal management unit of  claim 1 , wherein the fins extend along a first direction on the first side of the base portion, and wherein the ribs extend along the first direction on the second side of the base portion. 
     
     
         3 . The thermal management unit of  claim 1 , wherein the fins extend along a first direction on the first side of the base portion, and wherein the ribs extend along a second direction on the second side of the base portion, the first direction and second direction orthogonal to one another. 
     
     
         4 . The thermal management unit of  claim 1 , wherein each of the fins respectively includes a base connected to the base portion and a tip opposite the base thereof, wherein a surface facing an adjacent fin and connecting the tip and the base of a fin of the plurality of fins is approximately 90° with respect to a plane defined by the first side of the base portion. 
     
     
         5 . The thermal management unit of  claim 1 , wherein each of the fins respectively includes a base connected to the base portion and a tip opposite the base thereof, wherein a surface facing an adjacent fin and connecting the tip and the base of a fin of the plurality of fins is greater than 90° with respect to a plane defined by the first side of the base portion. 
     
     
         6 . The thermal management unit of  claim 1 , wherein each of the ribs respectively includes a base connected to the base portion and a tip opposite the base thereof, wherein a surface facing an adjacent rib and connecting the tip and the base of a rib of the plurality of ribs is approximately 90° with respect to a plane defined by the second side of the base portion. 
     
     
         7 . The thermal management unit of  claim 1 , wherein each of the ribs respectively includes a base connected to the base portion and a tip opposite the base thereof, wherein a surface facing an adjacent rib and connecting the tip and the base of a rib of the plurality of ribs is greater than 90° with respect to a plane defined by the second side of the base portion. 
     
     
         8 . The thermal management unit of  claim 1 , wherein an amount of protrusion of a fin of the plurality of fins measured from the first side of the base portion and an amount of protrusion of a rib of the plurality of ribs measured from the second side of the base portion are different. 
     
     
         9 . The thermal management unit of  claim 1 , wherein an amount of protrusion of a first rib of the plurality of ribs measured from the second side of the base portion and an amount of protrusion of a second rib of the plurality of ribs measured from the second side of the base portion are different. 
     
     
         10 . The thermal management unit of  claim 1 , wherein the heat sink is made of silicon. 
     
     
         11 . The thermal management unit of  claim 1 , further comprising:
 a phase-change material in direct contact with at least a portion of the heat sink; and   a container coupled to the heat sink such that the phase-change material is contained in a space defined by the container and the heat sink.   
     
     
         12 . The thermal management unit of  claim 11 , wherein the phase-change material comprises a salt hydrate, an ionic liquid, paraffin, fatty acid, ester, an organic-organic compound, an organic-inorganic compound, or an inorganic-inorganic compound. 
     
     
         13 . The thermal management unit of  claim 11 , wherein the container is made of silicon, plastic, ceramic or metal. 
     
     
         14 . The thermal management unit of  claim 11 , wherein the container comprises a pouch that is coupled to the heat sink by heat and pressure, solder, pressure-sensitive adhesive, or epoxy. 
     
     
         15 . The thermal management unit of  claim 11 , wherein the container comprises a pouch that includes a metallic foil. 
     
     
         16 . The thermal management unit of  claim 11 , wherein the container comprises a pouch that includes an aluminum foil having surface areas coated with biaxially-oriented polyethylene terephthalate (BoPET). 
     
     
         17 . The thermal management unit of  claim 11 , wherein the container is coupled to the first side of the heat sink such that the fins of the heat sink are in direct contact with the phase-change material. 
     
     
         18 . The thermal management unit of  claim 11 , wherein the container is coupled to the second side of the heat sink such that the ribs of the heat sink are in direct contact with the phase-change material. 
     
     
         19 . The thermal management unit of  claim 18 , further comprising:
 a heat-generating device coupled to the first side of the heat sink, a side of the heat-generating device that faces the heat sink is configured to interlockingly engage with the first protrusion structure of the heat sink.   
     
     
         20 . The thermal management unit of  claim 19 , further comprising:
 a thermal paste, solder, or epoxy disposed between the heat-generating device and the heat sink.