Method, device and system for facilitating heat dissipation from a circuit assembly

Abstract

Techniques and mechanisms for providing efficient heat dissipation by a circuit assembly. In an embodiment, the circuit assembly includes an inductor and a packaged device coupled thereto, where the inductor forms heat dissipation structures on various respective sides of a ferromagnetic body. The packaged assembly comprises a circuit board disposed in a mold material, where a metal core of the circuit board is thermally coupled to transfer heat from one or more circuit components of the packaged device to the inductor via one or more conductors extending from the package mold. In another embodiment, portions of the metal core have different respective vertical spans which contribute to different thermal conductivity characteristics across various regions of the circuit board.

What is claimed is: 
     
         1 . A circuit assembly, comprising:
 an inductor including:
 a ferromagnetic body; and 
   a first conductor which extends through the ferromagnetic body, wherein the first conductor forms fin structures on respective sides of the ferromagnetic body; and   
       a packaged device coupled to the inductor, the packaged device comprising a second conductor electrically coupled to the first conductor, and the package device comprising a third conductor electrically coupled to the first conductor. 
     
     
         2 . The circuit assembly of  claim 1 , wherein the packaged device further includes a metal core. 
     
     
         3 . The circuit assembly of  claim 2 , wherein the metal core is electrically coupled to one of the second conductor or the third conductor. 
     
     
         4 . The circuit assembly of  claim 2 , wherein the metal core comprises a recess structure. 
     
     
         5 . The circuit assembly of  claim 2 , wherein the metal core comprises a trench structure. 
     
     
         6 . The circuit assembly of  claim 1 , wherein a volume fraction of a ferromagnetic material of the ferromagnetic body is equal to or less than ninety seven percent (97%). 
     
     
         7 . The circuit assembly of  claim 1 , wherein some or all of the fin structures extend to overlap a sidewall of the packaged device. 
     
     
         8 . The circuit assembly of  claim 1 , wherein the packaged device includes a circuit component, and wherein the circuit component includes a packaged integrated circuit chip. 
     
     
         9 . The circuit assembly of  claim 1 , wherein the packaged device includes a circuit component, and wherein the circuit component includes a discrete circuit element. 
     
     
         10 . The circuit assembly of  claim 1 , wherein the packaged device includes a circuit component, and wherein the circuit component is electrically coupled to the inductor. 
     
     
         11 . The circuit assembly of  claim 2 , wherein the packaged device includes a circuit component, and wherein the circuit component is directly coupled to the metal core. 
     
     
         12 . A system comprising:
 a circuit assembly including:
 an inductor including:
 a ferromagnetic body; and 
 
 a first conductor which extends through the ferromagnetic body, wherein the first conductor forms fin structures on respective sides of the ferromagnetic body; and 
 a packaged device coupled to the inductor, the packaged device comprising a second conductor electrically coupled to the first conductor, and the package device comprising a third conductor electrically coupled to the first conductor; and 
   a display device coupled to the circuit assembly, the display device configured to display an image based on a signal or a voltage communicated between the inductor and the packaged device.   
     
     
         13 . The system of  claim 12 , wherein the packaged device further includes a metal core. 
     
     
         14 . The system of  claim 13 , wherein the metal core is electrically coupled to one of the second conductor or the third conductor. 
     
     
         15 . The system of  claim 13 , wherein the metal core comprises a recess structure. 
     
     
         16 . The system of  claim 13 , wherein the metal core comprises a trench structure. 
     
     
         17 . The system of  claim 12 , wherein a volume fraction of a ferromagnetic material of the ferromagnetic body is equal to or less than ninety seven percent (97%). 
     
     
         18 . The system of  claim 12 , wherein some or all of the fin structures extend to overlap a sidewall of the packaged device. 
     
     
         19 . The system of  claim 12 , wherein the packaged device includes a circuit component, and wherein the circuit component includes a packaged integrated circuit chip. 
     
     
         20 . The system of  claim 12 , wherein the packaged device includes a circuit component, and wherein the circuit component includes a discrete circuit element.