Substrate processing apparatus

Abstract

A substrate processing apparatus includes a processing container configured to air-tightly accommodate substrates, a plurality of mounting stands configured to mount the substrates, a process gas supply part configured to supply a process gas to the mounting stands, an exhaust mechanism configured to evacuate an interior of the processing container, a partition wall configured to independently surround the mounting stands with a gap left between the partition wall and each of the mounting stands, and cylindrical inner walls configured to independently surround the mounting stands with a gap left between each of the inner walls and each of the mounting stands. Slits are formed in the inner walls. The process gas in the processing spaces is exhausted via the slits. The inner walls include partition plates for bypassing the process gas so that the process gas does not directly flow into the slits.

1 - 6 . (canceled) 
     
     
         7 . A substrate processing apparatus for processing a substrate, comprising:
 a processing container configured to air-tightly accommodate the substrate;   a mounting stand configured to mount the substrate within the processing container;   a process gas supply part configured to supply a process gas into the processing container;   an exhaust mechanism configured to evacuate the process gas in the processing container; and   an inner wall,   wherein the inner wall includes a plurality of process gas exhaust passages,   wherein each of process gas exhaust passages includes an interior slit inlet through which the process gas is initially exhausted, a channel connected to the interior slit inlet and formed between a body portion of the inner wall and a partition plate formed on an inner surface of the inner wall, the channel configured to guide the process gas by a predetermined length, and an exterior slit outlet through which the process gas is finally exhausted, the exterior slit outlet connected to the channel,   wherein the inner wall is disposed lower than a substrate mounting surface of the mounting stand, and   wherein the interior slit inlet and the exterior slit outlet are separated from each other in the circumferential direction of the inner wall with the channel being interposed between the interior slit inlet and the exterior slit outlet, the channel being formed in a circumferential direction of the inner wall, so that a cross section of the channel through which the process gas flows is perpendicular to cross sections of the interior slit inlet and the exterior slit outlet through which the process gas flows.   
     
     
         8 . A substrate processing apparatus for processing a substrate, comprising:
 a processing container configured to air-tightly accommodate the substrate;   a mounting stand configured to mount the substrate within the processing container;   a process gas supply part configured to supply a process gas into the processing container;   an exhaust mechanism configured to evacuate the process gas in the processing container; and   an inner wall,   wherein the inner wall is disposed lower than a substrate mounting surface of the mounting stand.