Wafer-level integrated opto-electronic module

Abstract

A method to manufacture optoelectronic modules comprises a step of providing a first wafer comprising a plurality of first module portions, wherein each of the first module portions comprises at least one passive optical component, providing a second wafer comprising a plurality of second module portions, wherein each of the second module portions comprises at least one optoelectronic component. The wafers are disposed on each other to provide a wafer stack that is diced into individual optoelectronic modules respectively comprising one of the first and the second and the third module portions.

What is claimed is: 
     
         1 . A method to manufacture optoelectronic modules, comprising:
 providing a first wafer comprising a plurality of first module portions, wherein each of the first module portions comprises at least one passive optical component, wherein the at least one passive optical component has a first and a second side and is configured to modify a beam of light such that a direction of light coupled in the at least one passive optical component at the first side is changed and coupled out of the at least one passive optical component at the second side;   providing a second wafer comprising a plurality of second module portions, wherein each of the second module portions comprises at least one optoelectronic component and metalized via holes extending in a material of the second wafer from a first surface of the second wafer to a second opposite surface of the second wafer, wherein the respective at least one optoelectronic component of the second module portions is electrically connected to the respective metalized via holes of the second module portions;   providing a third wafer comprising a plurality of third module portions, wherein each of the third module portions comprises at least one electronic component;   bonding the second wafer onto the third wafer such that the respective at least one electronic component of the third module portions is electrically coupled to the respective at least one optoelectronic component of the second module portions by means of the respective metalized via holes of the second module portions;   bonding the first wafer onto the second wafer to provide a wafer stack such that each of the first module portions is aligned to a respective one of the second module portions so that light coupled into the respective at least one passive optical component of the first module portions at the first side of the respective at least one passive optical component is coupled out at the second side of the respective at least one passive optical component and is directed to the respective at least one optoelectronic component of the second module portions; and   dicing the wafer stack into individual optoelectronic modules respectively comprising one of the first and the second and the third module portions.   
     
     
         2 . The method of  claim 1 , comprising:
 the first wafer having a first and a second surface being opposite to the first surface;   arranging the at least one passive optical component of each of the first module portions on the first surface of the first wafer;   providing the second wafer with the at least one optoelectronic component of each of the second module portions being arranged on the first surface of the second wafer; and   bonding the first wafer onto the second wafer such that the second surface of the first wafer is disposed on the first surface of the second wafer.   
     
     
         3 . The method of  claim 1 , comprising:
 providing the third wafer with respective electrical contact pads for each of the third module portions on a first surface of the third wafer, wherein the respective electrical contact pads are electrically coupled with the respective at least one electronic component of the third module portions;   providing the second wafer with respective electrical contact pads for each of the second module portions on the second surface of the second wafer, wherein the respective electrical contact pads are electrically coupled to the respective metalized via holes of the second module portions; and   bonding the second wafer onto the third wafer such that the second surface of the second wafer is disposed on the first surface of the third wafer and the respective electrical contact pads of the third module portions are aligned to the respective electrical contact pads of the second module portions to provide an electrical connection between the respective electrical contact pads of the third module portions and the respective electrical contact pads of the second module portions.   
     
     
         4 . The method of  claim 1 , comprising:
 providing the first wafer with respective metalized via holes for each of the first module portions in a material of the first wafer, the respective metalized via holes extending from the first surface of the first wafer to the second surface of the first wafer;   providing the second wafer with respective electrical contact pads for each of the second module portions on the first surface of the second wafer such that the respective electrical contact pads of the second module portions are electrically connected to the respective metalized via holes of the second module portions; and   bonding the first wafer onto the second wafer such that the respective electrical contact pads of the second module portions are electrically connected to the respective metalized via holes of the first module portions.   
     
     
         5 . The method of  claim 3 , comprising:
 providing a fourth wafer being configured for thermal isolation between the third and the second wafer, wherein the fourth wafer comprises metalized via holes in a material of the fourth wafer, wherein the metalized via holes are arranged to electrically couple the respective electrical contact pads of the third module portions to the respective electrical contact pads of the second module portions.   
     
     
         6 . A method to manufacture optoelectronic modules, comprising:
 providing a first wafer comprising a plurality of first module portions, wherein the first wafer has a first and an opposite second surface;   providing a second wafer comprising a plurality of second module portions, wherein the second wafer has a first and an opposite second surface, wherein each of the second module portions comprises at least one optoelectronic component;   disposing the first wafer onto the second wafer to provide a wafer stack such that the second surface of the first wafer is placed opposite to the first surface of the second wafer and each of the first module portions is aligned to a respective one of the second module portions so that light coupled in a respective one of the first module portions is transferred to a respective one of the second module portions and is directed to the respective at least one optoelectronic component of the second module portions; and   dicing the wafer stack into individual optoelectronic modules respectively comprising one of the first and the second module portions.   
     
     
         7 . The method of  claim 6 ,
 wherein each of the first module portions comprises at least a fixture to old an optical fiber; and   wherein the at least one fixture is made by a wafer scale process molding directly onto the first wafer and/or using one of a single wafer with molded elements and several stacked waters with varying holes and/or cut outs.   
     
     
         8 . The method of  claim 7 , comprising:
 providing at least one of the first and second module portions with at least one passive optical component; and   disposing the first wafer onto the second wafer to provide a wafer stack such that each of the first module portions is aligned to a respective one of the second module portions so that light coupled out of the optical fiber held in the respective at least one fixture of the first module portions is coupled into the respective at least one passive optical component of one of the first and second module portions at the first side of the respective at least one passive optical component and is coupled out at the second side of the respective at least one optical component and is directed to the respective at least one optoelectronic component of the second module portions.   
     
     
         9 . An optoelectronic module, comprising:
 a first substrate comprising a first module portion, wherein the first substrate has a first and an opposite second surface;   a second substrate comprising a second module portion, wherein the second substrate has a first and an opposite second surface, wherein the second module portion comprises at least one optoelectronic component;   wherein the first substrate is disposed onto the second substrate to provide the optoelectronic module such that the second surface of the first substrate is placed opposite to the first surface of the second substrate and the first module portion is aligned to the second module portion so that light coupled in the first module portion is transferred to the second module portion and is directed to the at least one optoelectronic component of the second module portion.   
     
     
         10 . The optoelectronic module of  claim 9 ,
 wherein the first module portion comprises at least one fixture to hold an optical fiber, wherein the at least one fixture is disposed on the first surface of the first substrate.   
     
     
         11 . The optoelectronic module of  claim 10 ,
 wherein at least one of the first and second module portion is provided with at least one passive optical component; and   wherein the first substrate is disposed on the second substrate to provide the optoelectronic module such that the first module portion is aligned to the second module portion so that light coupled out of the optical fiber held in the at least one fixture of the first module portion is coupled into the at least one passive optical component of one of the first and second module portions at the first side of the at least one passive optical component and is coupled out at the second side of the at least one optical component and is directed to the at least one optoelectronic component of the second module portion.